Reza-ur Rahman Khan

Person

Rancho Santa Margarita, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally and electrically enhanced ball grid array package
- Patent number 8,686,558
- Issue date Apr 1, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package enhanced with a thermal and electrical conn...
- Patent number 8,310,067
- Issue date Nov 13, 2012
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die down ball grid array packages and method for making same
- Patent number 8,021,927
- Issue date Sep 20, 2011
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package enhanced with a thermal and electrical conn...
- Patent number 7,893,546
- Issue date Feb 22, 2011
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-up ball grid array package with die-attached heat spreader
- Patent number 7,859,101
- Issue date Dec 28, 2010
- Broadcom Corporation
- Sam Z Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipiece apparatus for thermal and electromagnetic interference (...
- Patent number 7,791,189
- Issue date Sep 7, 2010
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die down ball grid array package
- Patent number 7,786,591
- Issue date Aug 31, 2010
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low voltage drop and high thermal performance ball grid array package
- Patent number 7,781,882
- Issue date Aug 24, 2010
- Broadcom Corporation
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for improved thermal performance and electrom...
- Patent number 7,781,266
- Issue date Aug 24, 2010
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package including a non-planar heat spreader and method o...
- Patent number 7,719,110
- Issue date May 18, 2010
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with patterned stiffener surface and method...
- Patent number 7,629,681
- Issue date Dec 8, 2009
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for improved thermal performance and electrom...
- Patent number 7,582,951
- Issue date Sep 1, 2009
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for secure heat sink attachment on semiconductor...
- Patent number 7,566,591
- Issue date Jul 28, 2009
- Broadcom Corporation
- Sam Z Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipiece apparatus for thermal and electromagnetic interference (...
- Patent number 7,482,686
- Issue date Jan 27, 2009
- Braodcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for thermal and electromagnetic interference (...
- Patent number 7,432,586
- Issue date Oct 7, 2008
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package substrates with a modified central opening...
- Patent number 7,405,145
- Issue date Jul 29, 2008
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a ball grid array package with two substrates
- Patent number 7,312,108
- Issue date Dec 25, 2007
- Broadcom Corporation
- Sam Zinqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package including a non-planar heat spreader and method o...
- Patent number 7,271,479
- Issue date Sep 18, 2007
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package including a substrate capable of mou...
- Patent number 7,259,457
- Issue date Aug 21, 2007
- Broadcom Corporation
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with a heat spreader and method for...
- Patent number 7,259,448
- Issue date Aug 21, 2007
- Broadcom Corporation
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with stepped stiffener layer
- Patent number 7,245,500
- Issue date Jul 17, 2007
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a ball grid array package with multiple inter...
- Patent number 7,241,645
- Issue date Jul 10, 2007
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with printed circuit board attachabl...
- Patent number 7,227,256
- Issue date Jun 5, 2007
- Broadcom Corporation
- Sam Z Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package enhanced with a thermal and electrical conn...
- Patent number 7,161,239
- Issue date Jan 9, 2007
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced die-up ball grid array packages and method for making the...
- Patent number 7,132,744
- Issue date Nov 7, 2006
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with printed circuit board attachabl...
- Patent number 7,102,225
- Issue date Sep 5, 2006
- Broadcom Corporation
- Reza-ur R Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die support structures for ball grid array package fabrication
- Patent number 7,078,806
- Issue date Jul 18, 2006
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with attached stiffener ring
- Patent number 7,038,312
- Issue date May 2, 2006
- Broadcom Corporation
- Reza-ur R Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with enhanced stiffener
- Patent number 7,005,737
- Issue date Feb 28, 2006
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-up ball grid array package with patterned stiffener opening
- Patent number 6,989,593
- Issue date Jan 24, 2006
- Broadcom Corporation
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED DIE-UP BALL GRID ARRAY AND METHOD FOR MAKING THE SAME
- Publication number 20150137343
- Publication date May 21, 2015
- BROADCOM CORPORATION
- Reza-ur Rahman KHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE
- Publication number 20140210083
- Publication date Jul 31, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...
- Publication number 20110140272
- Publication date Jun 16, 2011
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die Down Ball Grid Array Packages and Method for Making Same
- Publication number 20100285637
- Publication date Nov 11, 2010
- BROADCOM CORPORATION
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array Package Having One or More Stiffeners
- Publication number 20100052151
- Publication date Mar 4, 2010
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Improved Thermal Performance and Electrom...
- Publication number 20100035383
- Publication date Feb 11, 2010
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Secure Heat Sink Attachment on Semiconductor...
- Publication number 20100025810
- Publication date Feb 4, 2010
- BROADCOM CORPORATION
- Sam Z. ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Voltage Drop and High Thermal Performance Ball Grid Array Package
- Publication number 20090267222
- Publication date Oct 29, 2009
- BROADCOM CORPORATION
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Die-Up Ball Grid Array and Method for Making the Same
- Publication number 20090203172
- Publication date Aug 13, 2009
- BROADCOM CORPORATION
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multipiece Apparatus for Thermal and Electromagnetic Interference (...
- Publication number 20090115048
- Publication date May 7, 2009
- BROADCOM CORPORATION
- Sam Z. ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...
- Publication number 20090057871
- Publication date Mar 5, 2009
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip Package Including a Non-Planar Heat Spreader and Method o...
- Publication number 20080006934
- Publication date Jan 10, 2008
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Voltage Drop and High Thermal Performance Ball Grid Array Package
- Publication number 20070108598
- Publication date May 17, 2007
- BROADCOM CORPORATION
- Chonghua ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for improved thermal performance and electrom...
- Publication number 20070090502
- Publication date Apr 26, 2007
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for secure heat sink attachment on semiconductor...
- Publication number 20070040267
- Publication date Feb 22, 2007
- BROADCOM CORPORATION
- Sam Z. Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package enhanced with a thermal and electrical conn...
- Publication number 20070007644
- Publication date Jan 11, 2007
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip package including a heat spreader having an edge with a r...
- Publication number 20060091542
- Publication date May 4, 2006
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package including a non-planar heat spreader and method o...
- Publication number 20060091509
- Publication date May 4, 2006
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die down ball grid array packages and method for making same
- Publication number 20060065972
- Publication date Mar 30, 2006
- Broadcom Corporation
- Reza-Ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multipiece apparatus for thermal and electromagnetic interference (...
- Publication number 20050280139
- Publication date Dec 22, 2005
- Broadcom Corporation
- Sam Z. Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for thermal and electromagnetic interference (...
- Publication number 20050280127
- Publication date Dec 22, 2005
- Broadcom Corporation
- Sam Z. Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling a ball grid array package with two substrates
- Publication number 20050173787
- Publication date Aug 11, 2005
- BROADCOM CORPORATION
- Sam Zinqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a ball grid array package with patterned stiff...
- Publication number 20050133905
- Publication date Jun 23, 2005
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package substrates with a modified central opening...
- Publication number 20050127501
- Publication date Jun 16, 2005
- BROADCOM CORPORATION
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-up ball grid array package including a substrate capable of mou...
- Publication number 20050051890
- Publication date Mar 10, 2005
- Broadcom Corporation
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-up ball grid array package including a substrate having an open...
- Publication number 20050035452
- Publication date Feb 17, 2005
- Broadcom Corporation
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced die-up ball grid array and method for making the same
- Publication number 20050029657
- Publication date Feb 10, 2005
- BROADCOM CORPORATION
- Reza-ur R. Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for assembling a ball grid array package with multiple inter...
- Publication number 20050023677
- Publication date Feb 3, 2005
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC die support structures for ball grid array package fabrication
- Publication number 20040262754
- Publication date Dec 30, 2004
- Reza-ur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making an enhanced die-up ball grid array package with t...
- Publication number 20040113284
- Publication date Jun 17, 2004
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Reza-ur Rahman Khan

Person

Patents Grantslast 30 patents

Thermally and electrically enhanced ball grid array package

Ball grid array package enhanced with a thermal and electrical conn...

Die down ball grid array packages and method for making same

Ball grid array package enhanced with a thermal and electrical conn...

Die-up ball grid array package with die-attached heat spreader

Multipiece apparatus for thermal and electromagnetic interference (...

Die down ball grid array package

Low voltage drop and high thermal performance ball grid array package

Methods and apparatus for improved thermal performance and electrom...

Flip chip package including a non-planar heat spreader and method o...

Ball grid array package with patterned stiffener surface and method...

Methods and apparatus for improved thermal performance and electrom...

Method and system for secure heat sink attachment on semiconductor...

Multipiece apparatus for thermal and electromagnetic interference (...

Apparatus and method for thermal and electromagnetic interference (...

Ball grid array package substrates with a modified central opening...

Method for assembling a ball grid array package with two substrates

Flip chip package including a non-planar heat spreader and method o...

Die-up ball grid array package including a substrate capable of mou...

Die-up ball grid array package with a heat spreader and method for...

Ball grid array package with stepped stiffener layer

Method for assembling a ball grid array package with multiple inter...

Die-up ball grid array package with printed circuit board attachabl...

Ball grid array package enhanced with a thermal and electrical conn...

Enhanced die-up ball grid array packages and method for making the...

Die-up ball grid array package with printed circuit board attachabl...

IC die support structures for ball grid array package fabrication

Die-up ball grid array package with attached stiffener ring

Die-up ball grid array package with enhanced stiffener

Die-up ball grid array package with patterned stiffener opening

Patents Applicationslast 30 patents

ENHANCED DIE-UP BALL GRID ARRAY AND METHOD FOR MAKING THE SAME

THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE

Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...

Die Down Ball Grid Array Packages and Method for Making Same

Ball Grid Array Package Having One or More Stiffeners

Methods and Apparatus for Improved Thermal Performance and Electrom...

Method and System for Secure Heat Sink Attachment on Semiconductor...

Low Voltage Drop and High Thermal Performance Ball Grid Array Package

Enhanced Die-Up Ball Grid Array and Method for Making the Same

Multipiece Apparatus for Thermal and Electromagnetic Interference (...

Ball Grid Array Package Enhanced With a Thermal and Electrical Conn...

Flip Chip Package Including a Non-Planar Heat Spreader and Method o...

Low Voltage Drop and High Thermal Performance Ball Grid Array Package

Methods and apparatus for improved thermal performance and electrom...

Method and system for secure heat sink attachment on semiconductor...

Ball grid array package enhanced with a thermal and electrical conn...

Flip chip package including a heat spreader having an edge with a r...

Flip chip package including a non-planar heat spreader and method o...

Die down ball grid array packages and method for making same

Multipiece apparatus for thermal and electromagnetic interference (...

Apparatus and method for thermal and electromagnetic interference (...

Method for assembling a ball grid array package with two substrates

Method of assembling a ball grid array package with patterned stiff...

Ball grid array package substrates with a modified central opening...

Die-up ball grid array package including a substrate capable of mou...

Die-up ball grid array package including a substrate having an open...

Enhanced die-up ball grid array and method for making the same

Method for assembling a ball grid array package with multiple inter...

IC die support structures for ball grid array package fabrication

Method for making an enhanced die-up ball grid array package with t...