Patent Application
20110140272
1. Field of the Invention
The invention relates generally to the field of integrated circuit (IC) device packaging technology and, more particularly, to substrate stiffening, heat spreading, and power delivery/current return techniques in ball grid array (BGA) packages.
2. Background Art
Integrated circuit (IC) dies are typically mounted in or on a package that facilitates attachment to a printed circuit board (PCB). One such type of IC package is a ball grid array (BGA) package. BGA packages provide for smaller footprints than many other package solutions available today. A BGA package has an array of solder balls located on a bottom external surface of a package substrate. The solder balls are reflowed to attach the package to the PCB. The IC die is mounted to a top surface of the package substrate. Wire bonds typically couple signals in the IC die to the substrate. The substrate has internal routing which electrically couples the IC die signals to the solder balls on the bottom substrate surface.
A number of BGA package substrate types exist, including ceramic, plastic, and tape (also known as “flex”). In some BGA package types, a stiffener may be attached to the substrate to supply planarity and rigidity to the package. In such packages, the IC die may be mounted to the stiffener instead of the substrate. Openings in the stiffener may be used to allow the IC die to be wire-bonded to the substrate.
Die-up and die-down BGA package configurations exist. In die-up BGA packages, the IC die is mounted on a top surface of the substrate or stiffener, opposite of the side to which the solder balls are attached. In die-down BGA packages, the IC die is mounted on a bottom surface of the substrate or stiffener, on the same side as which the solder balls are attached.
Existing BGA packages are subject to high thermal stresses that result from the heat given off during operation of the mounted IC die. The thermal stresses are primarily imposed on the IC die and solder balls due to the mismatch of the thermal expansion coefficient (CTE) between the semiconductor die and the metal stiffener. As a result, existing flex BGA packages have difficulty in meeting reliability requirements for die sizes larger than about 9 mm. See, e.g., Thompson, T., et al., Reliability Assessment of a Thin (Flex) BGA Using a Polyimide Tape Substrate, International Electronics Manufacturing Technology Symposium, IEEE, pp. 207-213 (1999).
The tape substrate used in flex BGA packages is typically polyimide, which has a low value of thermal conductivity. Consequently, the IC die is separated from the PCB internally by the tape substrate which acts as a thermal barrier. The lack of direct thermal connection from IC die to PCB leads to relatively high resistance to heat transfer from IC die-to-board (theta-jb).
A stiffener attached to a substrate can enhance heat spreading. However, the openings on the stiffener for wire bond connections tend to reduce the thermal connections between the IC die and the edges of the stiffener. As a result, heat spreading is limited largely to the region of the IC die attach pad, while areas at the stiffener periphery do not contribute effectively to heat spreading.
Furthermore, because of the high density of the substrate routing circuitry, it is difficult to bond each power and ground pad on the IC die to the substrate by a corresponding bond finger. As a result, the distribution of ground and power signals connecting to the IC die is frequently compromised in conventional BGA packages.
Ball grid array packages that use plastic substrates (for example, BT or FR4 plastic) are commonly known as plastic BGAs, or PBGAs. See, e.g., Lau, J. H., Ball Grid Array Technology, McGraw-Hill, New York, (1995). A PBGA package, for example, may add solder balls to the bottom substrate surface under the IC die to aid in conducting heat to the PCB. Solder balls such as these are referred to as thermal balls. The cost of the PBGA package, however, will increase with the number of thermal balls. Furthermore, a large array of thermal balls may be necessary for heat dissipation into the PCB for high levels of IC device power.
Hence, what is needed are BGA packages with improved heat spreading capabilities, while also providing for high levels of IC electrical performance.
Packages having enhanced electrical and thermal characteristics are described herein. For example, a package can include a substrate having first and second surfaces, a stiffener coupled to the first surface of the substrate, and a thermal connector coupled to the second surface of the substrate that is configured to be coupled to a printed circuit board.
Further aspects of the present invention, and further features and benefits thereof, are described below. The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the invention.
The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present invention and, together with the description, further serve to explain the principles of the invention and to enable a person skilled in the pertinent art to make and use the invention.
The present invention will now be described with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Additionally, the left-most digit(s) of a reference number identifies the drawing in which the reference number first appears.
The present invention is directed to a method and system for improving the mechanical, thermal, and electrical performance of BGA packages. The present invention is applicable to all types of BGA substrates, including ceramic, plastic, and tape (flex) BGA packages. Furthermore the present invention is applicable to die-up (cavity-up) and die-down (cavity-down) orientations.
Numerous embodiments of the present invention are presented herein. In a first embodiment, BGA package thermal stress at the IC die/stiffener interface is released or altered with the introduction of a heat spreader on the top surface of the IC die, enabling large size dies with high input and output (I/O) counts to be packaged using BGA technology. In a second embodiment, BGA package thermal resistance and the length of the current return path are reduced by introducing thermal/ground balls underneath or within close proximity of the IC die. In a third embodiment, the package thermal resistance and ground inductance are reduced by removing center solder balls, and enabling the attachment of a die pad to the PCB. The die pad is attached to the PCB with novel patternings of the metal stiffener, or by positioning a thermal/ground connector in between the IC die pad and the PCB. In a fourth embodiment, the package thermal resistance is reduced by attaching a metal ring to the top surface of a stiffener. In a fifth embodiment, the package thermal resistance is reduced by bridging the die pad to the outer regions of the stiffener with metal studs.
In further embodiments according to the present invention, the electrical performance of the BGA package is improved. In a sixth embodiment, electrical performance is improved by connecting ground bonds from the IC die to the stiffener. In such a configuration, the stiffener operates as a package ground plane. The package ground plane may be connected to PCB ground through either thermal/ground balls or thermal/ground connectors mentioned in embodiments above, and further described herein. In a seventh embodiment, package power distribution is enhanced by using a layer in a tape substrate as a power or ground plane.
In still further embodiments according to the present invention, plastic ball grid array (PBGA) package thermal and electrical performances are improved. In an eighth embodiment, replacing the center solder balls with a solid conductor reduces the package junction-to-board thermal resistance and package ground inductance of a PBGA package.
Ball grid array package types are described below. Further detail on the above described embodiments, and additional embodiments according to the present invention, are presented below. The embodiments described herein may be combined as required by a particular application.
A ball grid array (BGA) package is used to package and interface an IC die with a printed circuit board (PCB). BGA packages may be used with any type of IC die, and are particularly useful for high speed ICs. In a BGA package, solder pads do not just surround the package periphery, as in chip carrier type packages, but cover the entire bottom package surface in an array configuration. BGA packages are also referred to as pad array carrier (PAC), pad array, land grid array, and pad-grid array packages. BGA packages types are further described in the following paragraphs. For additional description on BGA packages, refer to Lau, J. H., Ball Grid Array Technology, McGraw-Hill, New York, (1995), which is herein incorporated by reference in its entirety.
Die-up and die-down BGA package configurations exist. In die-up BGA packages, the IC die is mounted on a top surface of the substrate or stiffener, in a direction away from the PCB. In die-down BGA packages, the IC die is mounted on a bottom surface of the substrate or stiffener, in a direction towards the PCB.
A number of BGA package substrate types exist, including ceramic, plastic (PBGA), and tape (also known as “flex”) (for example, refer to Hayden, T. F., et al., Thermal & Electrical Performance and Reliability Results for Cavity-Up Enhanced BGAs, Electronic Components and Technology Conference, IEEE, pp. 638-644 (1999), which is incorporated herein by reference).
Tape substrate 104 is generally made from one or more conductive layers bonded with a dielectric material. For instance, the dielectric material may be made from various substances, such as polyimide tape. The conductive layers are typically made from a metal, or combination of metals, such as copper and aluminum. Trace or routing patterns are made in the conductive layer material. Substrate 104 may be a single-layer tape, a two-layer tape, or additional layer tape substrate type. In a two-layer tape, the metal layers sandwich the dielectric layer, such as in a copper-Upilex-copper arrangement.
IC die 102 is attached directly to substrate 104, for example, by an epoxy. IC die 102 is any type of semiconductor integrated circuit.
One or more wire bonds 108 connect corresponding bond pads 118 on IC die 102 to contact points 120 on substrate 104.
An encapsulate, mold compound, or epoxy 116 covers IC die 102 and wire bonds 108 for mechanical and environmental protection.
As shown in
The use of a stiffener in a flex BGA package requires additional considerations when attempting to manage heat spreading.
Plastic substrate 302 includes one or more metal layers formed on an organic substrate. For example, plastic or organic substrates may include materials such as “BT”, which includes a resin called bis-maleimide triazine, and/or “FR-4,” which is a fire-retardant epoxy resin-glass cloth laminate material, and/or other similar materials. IC die 304 is mounted to die pad 310. IC die 304 may be attached to die pad 310 with an epoxy, such as a silver-filled epoxy. Wire bonds 308 connect signals of IC die 304 to substrate 302. For instance, gold bonding wire is bonded from aluminum bond pads on IC die 304 to gold-plated contact pads on substrate 302. The contact pads on substrate 302 connect to solder balls 306 attached to the bottom surface of substrate 302, through vias 314 and routing within substrate 302 using copper conductors 312. Thermal/ground vias 316 connect die pad 310 to one or more thermal/ground balls 322 on the center bottom surface of substrate 302. An encapsulate, mold compound, or epoxy 320 covers IC die 304 and wire bonds 308 for mechanical and environmental protection.
As described above, a BGA package includes an array of solder balls located on a bottom external surface of the package substrate.
Note that although wire bonds, such as wire bonds 1210, are shown and described herein, IC dies may be mounted and coupled to a substrate with solder balls located on the bottom surface of the IC die, by a process commonly referred to as “C4” or “flip chip” packaging.
As shown in
The solder ball arrangement shown in
As described above, the BGA package substrate provides vias and routing on one or more layers to connect contact pads for wire bonds on its upper surface to solder balls attached to the bottom substrate surface. For illustrative purposes,
The present invention is applicable to improving thermal and electrical performance in the BGA package types described herein, and further BGA package types.
Further details of structural and operational implementations of ball grid array packages of the present invention are described in the following sections. These structural and operational implementations are described herein for illustrative purposes, and are not limiting. For instance, the present invention as described herein may be implemented in both die-up and die-down BGA package types, as well as other IC package types. Furthermore, each of the embodiments presented below are applicable to tape substrate BGA packages, plastic substrate BGA packages, and ceramic substrate BGA packages. The description below is adaptable to these and other package types, as would be understood to persons skilled in the relevant art(s) from the teachings herein. For instance, in plastic substrate BGA packages, and some tape BGA packages, a stiffener may not be required in the BGA package.
Features of each of the embodiments presented below may be incorporated into BGA packages independently, or may be combined in any manner, as would be apparent to persons skilled in the relevant art(s) from the teachings herein.
According to an embodiment of the present invention, a heat spreader may be used in a BGA package to provide for thermal stress relief and heat dissipation. In a preferred embodiment, a drop-in heat spreader is attached to the top surface of an IC die in a flex BGA package to provide for thermal stress relief and heat dissipation.
Substrate 104 has a top surface to which a bottom surface of stiffener 112 is mounted. A bottom surface of substrate 104 attaches the plurality of solder balls 106. The plurality of solder balls 106 connect to vias and/or points on the bottom surface of substrate 104 to which signals internal to substrate 104 are routed and exposed.
Stiffener 112 has a top surface to which IC die 102 is mounted. In alternate embodiments, BGA package 400 does not require a stiffener, and does not include a stiffener 112. In such an alternate embodiment, IC die 102 is mounted to substrate 104.
One or more wire bonds 108 connect corresponding bond pads 118 on IC die 102 to contact points 120 on substrate 104. When a stiffener 112 is present, as shown in
Heat spreader 402 is attached to the top surface (active surface) of IC die 102 using adhesive 404. Adhesive 404 may be an epoxy, an adhesive tape, or may be a different substance. Silver filled epoxies or thermally conductive tapes may be used for adhesive 404 to enhance heat extraction from IC die 102.
As shown in
As shown in
By attaching heat spreader 402 to the top surface of IC die 102, the mechanical structure of BGA package 400 becomes more symmetrical in its center region, particularly when ground/thermal solder balls do not exist on the bottom surface of substrate 104 underneath the outer profile of IC die 102. Thermal stress at the interface of IC die 102 and stiffener 112 is substantially released or altered by heat spreader 402. Deformation caused by thermal stress in stiffener 112 and substrate 104 is substantially reduced through the use of heat spreader 402. Drop-in heat spreader 402 allows for even larger sizes for IC die 102 and greater I/O counts by providing for greater heat spreading capacity in BGA package 400.
Flowchart 1400 begins with step 1402. In step 1402, a substrate that has a first surface and a second surface is provided. For example, the substrate is flex substrate 104, or another substrate type suitable for a BGA package. For example, an IC die mounting position and/or contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1404, a first surface of a stiffener is attached to the first substrate surface. For example, the stiffener is stiffener 112, which is attached to substrate 104. In alternative embodiments, a stiffener is not required.
In step 1406, an IC die is mounted to the second stiffener surface. For example, the IC die is IC die 102, which is mounted to stiffener 112. In alternative embodiments, when a stiffener is not used, IC die 102 is mounted directly to the substrate.
In step 1408, a heat spreader is mounted to the IC die, wherein the heat spreader dissipates heat from the IC die. For example, the heat spreader is heat spreader 402 or 502, which is mounted with adhesive 404 or other attachment means to the upper surface of IC die 102. Heat spreader 402 or 502 typically is mounted to the center of the upper surface of IC die 102, and covers less than the entire upper surface of IC die 102. For instance, the smaller area of heat spreader 402 or 502 allows for bond pads 118 to be exposed on the upper surface of IC die 102 for wire bond connections. In alternative embodiments, heat spreader 402 or 502 is of the same size, or comprises a larger area than the upper surface of IC die 102.
In step 1410, a plurality of solder balls are attached to the second substrate surface. For example, the plurality of solder balls are plurality of solder balls 106, which connect to vias and/or solder ball pads on the bottom surface of substrate 104. The solder balls may be arranged on the bottom surface of substrate 104 as shown in
A benefit of performing the steps of flowchart 1400 is that the heat spreader relieves thermal stress at an interface of the IC die and the first stiffener surface.
Flowchart 1400 may include the additional step where the second stiffener surface is encapsulated. For instance, the second stiffener surface may be encapsulated by a resin or molding compound, that also encapsulates the IC die, heat spreader, and wire bonding.
According to an embodiment of the present invention, electrical performance of an IC die, and thermal performance of a corresponding BGA package may be improved by allowing a stiffener to act as a ground plane. In a preferred embodiment, a stiffener in a die-up tape BGA (Flex BGA) package is coupled to PCB ground through one or more vias to ground solder balls. Ground contact pads of the IC die are connected to the stiffener by ground wire bonds. In a further aspect, one or more metal layers of a flex tape substrate may be coupled to a ground or power potential, to operate as a ground or power plane.
Substrate 104 has a top surface to which a bottom surface of stiffener 112 is mounted. A bottom surface of substrate 104 attaches the plurality of solder balls 106. The plurality of solder balls 106 connect to vias and/or points on the bottom surface of substrate 104 to which signals internal to substrate 104 are routed and exposed.
Stiffener 112 has a top surface to which IC die 102 is mounted.
One or more wire bonds 108 connect corresponding bond pads 118 on IC die 102 to contact points 120 on substrate 104. Wire bonds 108 extend through one or more openings 114 in stiffener 112 to form connections with substrate 104.
IC die 102 has a top surface that includes at least one ground pad 608. Ground pad 608 is coupled to a ground potential signal in IC die 102. A ground wire bond 602 connects ground pad 608 to stiffener 112. The bottom surface of stiffener 112 is coupled to a ground potential signal in the PCB to which BGA package 600 is attached, to cause stiffener 112 to operate as a ground plane. Stiffener 112 is coupled to PCB ground through one or more of ground/thermal via 604 that extend through substrate 104. The one or more of ground/thermal vias 604 are located in substrate 104, underneath IC die 102, and can be filled with a conductive material, such as solder. A ground/thermal solder ball 606 is attached to each ground/thermal via 604 on the bottom surface of substrate 104. Ground/thermal solder ball 606 forms the connection to PCB ground, when reflowed to attach to the PCB. Each ground/thermal via 604 connects the respective ground/thermal solder ball 606 to stiffener 112 both electrically and thermally.
In a further embodiment, a tape substrate is configured such that a metal layer is used as a package power or ground plane. For instance, with a two-layer tape substrate, the bottom metal layer may be used as a power or ground plane.
In
The introduction of a stiffener ground plane, and/or a power/ground plane using a metal layer of a tape substrate allows for very short power and ground connections. Current return path lengths are shortened, voltage drop across planes is reduced, and power/ground inductance is reduced. The shorter power and ground paths are also significant in reducing a power/ground path resistance, which advantageously reduces required IC device power levels.
For further description of the use of a thermal vias in a flex tape substrate, and of the use of a thermal ball coupled to a heat spreader in a die-down TBGA package, refer to U.S. Pat. No. 6,020,637, which is incorporated by reference in its entirety herein. For further description of the use of a thermal via and a thermal ball in a plastic substrate BGA package, refer to U.S. Pat. No. 5,894,410, which is incorporated by reference in its entirety.
Flowchart 1500 begins with step 1502. In step 1502, a substrate that has a first surface and a second surface is provided. For example, the substrate is flex substrate 104, or another substrate type suitable for a BGA package. For example, an IC die mounting position and/or contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1504, at least one opening in a stiffener from a first surface of the stiffener to a second surface of the stiffener is provided. For example, the at least one opening includes openings 114 in stiffener 112. In a preferred embodiment, an opening 114 is located on each of the four edges of IC die 102.
In step 1506, the first stiffener surface is attached to the first substrate surface. For example, the stiffener is stiffener 112, which is attached to substrate 104. In alternative embodiments, a stiffener is not required, and is riot attached to the substrate.
In step 1508, an integrated circuit (IC) die is mounted to the second stiffener surface, wherein a first surface of the IC die includes a contact pad. For example, the IC die is IC die 102, which is mounted to stiffener 112. In alternative embodiments, when a stiffener is not used, IC die 102 is mounted directly to the substrate. For example, the contact pad is ground contact pad 608.
In step 1510, the contact pad is coupled to the second stiffener surface. For instance, contact pad is ground contact pad 608, which is connected to stiffener 112 by ground wire bond 602. Ground wire bond 602 may be soldered, or otherwise attached to stiffener 112.
In step 1512, a plurality of solder balls is attached to the second substrate surface, inside an outer dimensional profile of the IC die. For example, the plurality of solder balls include one or more ground/thermal balls 606, which are arranged on the bottom surface of substrate 104 in the region of substrate center 1224, shown in
In step 1514, the plurality of solder balls are coupled through corresponding vias in the substrate to the first stiffener surface. For example, the vias include ground/thermal via 604. The vias can be filled with a conductive material, such as solder, to allow the electrical connection of the solder balls to stiffener 112.
In a further embodiment according to flowchart 1500, the substrate includes a metal layer, wherein the metal layer is coupled to a second potential. The stiffener has at least one opening extending from the first stiffener surface to the second stiffener surface. The second IC die surface includes a second contact pad. The second contact pad is coupled to the metal layer through one of the openings in the stiffener and through a corresponding via that extends through the substrate. The second contact pad may be coupled to a power or ground potential in the IC die. For example, the second contact pad is power contact pad 610, the metal layer is metal layer 614, and the corresponding via is power via 612.
In an embodiment, flowchart 1500 may include an additional step, where the contact pad is coupled to a ground potential in the IC die. For example, the contact pad may be connected to a ground plane or ground signal in IC die that is routed to the contact pad.
Flowchart 1500 may include the additional step where the second stiffener surface is encapsulated. For instance, the second stiffener surface may be encapsulated by a resin or molding compound, that also encapsulates the IC die and wire bonding.
Flowchart 1500 may include the additional step where a second plurality of solder balls is attached to the second substrate surface, outside an outer dimensional profile of the IC die. For example, the second plurality of solder balls are plurality of solder balls 106, which connect to vias and/or solder ball pads on the bottom surface of substrate 104. The solder balls are arranged on the bottom surface of substrate 104 as shown in
Embodiments with Stiffener Coupled to a PCB
According to an embodiment of the present invention, electrical performance of the IC device, and thermal performance of a BGA package is improved by enabling an IC die pad to attach to a PCB. In an embodiment, the IC die pad is attached to the PCB by a novel patterning of the metal stiffener in a die-up tape BGA package. In an alternate embodiment, the IC die pad is attached to the PCB by placing a thermal/ground connector between the IC die pad and PCB in a die-up tape BGA package.
A BGA package junction-to-board thermal resistance can be substantially reduced by the attachment of a metal die-attach pad directly to a PCB. Metal die-attach pads are coupled to a PCB for package junction-to-board thermal resistance minimization in an exposed pad quad flat pack (QFP), a QFP with exposed heat sink at bottom, and a leadless plastic chip carrier (i.e. LPCC, QFN, SON, QLP) package, for instance. All existing such designs that involve an exposed die pad or an exposed heat sink at package bottom are “lead frame” packages. The present invention provides for an exposed die-attach pad or heat sink at the bottom of flex BGA packages.
Substrate 104 has a top surface to which a bottom surface of stiffener 112 is mounted. A bottom surface of substrate 104 attaches the plurality of solder balls 106. The plurality of solder balls 106 connect to vias and/or points on the bottom surface of substrate 104 to which signals internal to substrate 104 are routed and exposed. Substrate 104 in
Stiffener 112 has a top surface to which IC die 102 is mounted. Stiffener 112 in
Stiffener 112 may optionally be configured to operate as a ground plane. One or more ground pads 608 may be coupled to a ground potential signal in IC die 102. A ground wire bond 602 connects each ground pad 608 to stiffener 112. With one or more ground wire bonds 602 coupled to stiffener 602, the bottom exposed surface of cavity 702 may function both as an exposed ground pad of BGA package 700, and as an exposed heat spreader. As described above, the bottom exposed surface of cavity 702 may be plated with solder to allows stiffener 112 to be surface mounted to one or more soldering pads on the PCB. The pads on the PCB can be connected to a PCB ground plane to shorten the length of electrical current return paths, as well as to form a conductive heat dissipation path from BGA package 700 to the PCB.
Direct electrical and thermal connection from BGA package ground to a PCB ground plane is also possible by attaching a heat spreader between the stiffener and PCB.
In a further embodiment, stiffener 112 and ground/thermal connector 802 may be manufactured from a single piece of metal, and hence consist of a single metal piece.
Flowchart 1600 begins with step 1602. In step 1602, a substrate that has a first surface and a second surface is provided. For example, the substrate is flex substrate 104, or another substrate type suitable for a BGA package. For example, an IC die mounting position and/or contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1604, a first surface of a stiffener is attached to the first substrate surface. For example, the stiffener is stiffener 112, which is attached to substrate 104.
In step 1606, a portion of the first stiffener surface is exposed through a window opening in the substrate. For example, substrate 104 has a window opening 704 in its center. A portion of the bottom surface of stiffener 112 is exposed through window opening 704.
In step 1608, an IC die is mounted to a second surface of the stiffener, wherein a surface of the IC die includes at least one contact pad. For example, the IC die is IC die 102, which is mounted to stiffener 112.
In step 1610, a plurality of solder balls are attached to the second substrate surface. For example, the plurality of solder balls are plurality of solder balls 106, which connect to vias and/or solder ball pads on the bottom surface of substrate 104. The solder balls are arranged on the bottom surface of substrate 104 as shown in
In step 1612, the exposed portion of the first stiffener surface is configured to be coupled to a printed circuit board (PCB), whereby electrical and thermal performance of the BGA package is improved.
In step 1614, a heat spreader is coupled to the exposed portion of the first stiffener surface. For example, the heat spreader is ground/thermal connector 802, which is coupled to stiffener 112 through window opening 702.
In step 1616, a surface of the heat spreader is configured to be coupled to the PCB. In an embodiment, step 1612 further includes the step where the heat spreader surface is plated with solder to allow the heat spreader surface to be surface mounted to soldering pads on the PCB.
In an alternate embodiment, step 1612 comprises the step where the stiffener is shaped to have a centrally-located cavity shaped portion that protrudes through the window opening. In an embodiment, step 1612 further includes the step where a surface of the cavity shaped portion is plated with solder to allow the stiffener to be surface mounted to soldering pads on the PCB. For example, stiffener 112 is patterned with a cavity 702, which protrudes downward in window opening 704. The bottom surface of cavity 702 is plated with solder.
In step 1618, the stiffener is coupled to a potential. For example, the stiffener may be coupled to ground or power on the PCB. The bottom surface of cavity 702 may be coupled to the ground or power potential on the PCB, or ground/thermal connector 802 may make the connection to the PCB.
In step 1620, each of the at least one contact pads are coupled to the second stiffener surface with corresponding wire bonds.
In step 1622, the stiffener is coupled to a ground potential.
In step 1624, the stiffener allowed to serve as a ground plane.
Flowchart 1600 may include the additional step where the second stiffener surface is encapsulated. For instance, the second stiffener surface may be encapsulated by an epoxy, that also encapsulates the IC die and wire bonding.
According to an embodiment of the present invention, the mechanical and thermal performance of a BGA package is enhanced by attaching a metal ring to the top surface of the stiffener. In a preferred embodiment, a metal ring is attached to the top surface of the stiffener in a die-up tape BGA package.
Substrate 104 has a top surface to which a bottom surface of stiffener 112 is mounted. A bottom surface of substrate 104 attaches the plurality of solder balls 106. The plurality of solder balls 106 connect to vias and/or points on the bottom surface of substrate 104 to which signals internal to substrate 104 are routed and exposed.
One or more wire bonds 108 connect corresponding bond pads 118 on IC die 102 to contact points 120 on substrate 104. Wire bonds 108 extend through one or more openings 114 in stiffener 112 to form connections with substrate 104. Stiffener 112 has a top surface to which IC die 102 is mounted. Furthermore, ring 902 is attached to the top surface of stiffener 112. Ring 902 may be laminated to stiffener 112, after wire bonding is completed. Epoxy 116 is filled in and flushed to ring 902 after the attachment of ring 902. Ring 902 is preferably made of a metal, such as copper or aluminum, or a combination thereof, but may be constructed from other applicable materials. Preferably, ring 902 is made from the same material as stiffener 112, to minimize the mismatch of the thermal expansion coefficient. Ring 902 is preferably flush with the outer edges of stiffener 112 to form an outer edge of BGA package 900, but may also reside entirely within an outer profile of stiffener 112.
A primary benefit of attaching ring 902 to stiffener 112 is an increase in stiffness of BGA package 900. Ring 902 also aids in reducing the amount of warp of BGA package 900. Furthermore, ring 902 promotes heat dissipation from stiffener 112, reduces junction-to-case thermal resistance, and facilitates the attachment of an external heat spreader to BGA package 900.
Furthermore, ring 902 enhances the process of encapsulation of the BGA package. Ring 902, with stiffener 112, creates a cavity that may be filled with a dispensed glob top or encapsulating material, that locks IC die 102 and surrounding elements in place.
Flowchart 1700 begins with step 1702. In step 1702, a substrate that has a first surface and a second surface is provided. For example, the substrate is flex substrate 104, or another substrate type suitable for a BGA package. For example, an IC die mounting position and/or contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1704, a first surface of a stiffener is attached to the first substrate surface. For example, the stiffener is stiffener 112, which is attached to substrate 104. In alternative embodiments, a stiffener is not required, and is not attached to the substrate.
In step 1706, an IC die is mounted to the first stiffener surface. For example, the IC die is IC die 102, which is mounted to stiffener 112. In alternative embodiments, when a stiffener is not used, IC die 102 is mounted directly to the substrate.
In step 1708, a plurality of solder balls are attached to the second substrate surface. For example, the plurality of solder balls are plurality of solder balls 106, which connect to vias and/or solder ball pads on the bottom surface of substrate 104. The solder balls may be arranged on the bottom surface of substrate 104 as shown in
In step 1710, a metal ring is attached to the first stiffener surface. Attaching the metal ring enhances heat dissipation from the stiffener. For example, the metal ring is ring 902. In alternative embodiments, when a stiffener is not used, ring 902 is attached directly to the substrate.
Flowchart 1700 may include the additional step where the second stiffener surface within the volume encompassed by the ring is encapsulated. For example, such a filled upper surface may be called a “glob top”. For instance, this volume may be encapsulated by a resin or molding compound, that also encapsulates the IC die and wire bonding.
According to an embodiment of the present invention, the thermal performance of a BGA package is improved by bridging an IC die pad to which the IC die is mounted to the outer regions of the stiffener. In a preferred embodiment, one or more metal studs are used as thermal bridges, to bridge the openings in the stiffener that surround the IC die, in a die-up tape BGA package.
The openings on a stiffener surface allow for wire bond connections between an IC die and a substrate. These openings have the additional effect of reducing the amount of heat that can spread to the outer surface regions of the stiffener, hampering the ability of the stiffener to act as a heat spreader. This effect is illustrated in
Flowchart 1800 begins with step 1802. In step 1802, a substrate that has a first surface and a second surface is provided. For example, the substrate is flex substrate 104, or another substrate type suitable for a BGA package. For example, an IC die mounting position and/or contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1804, a wire bond opening is created along each edge of an IC die mount position on a stiffener, wherein each wire bond opening extends through the stiffener. For example, the wire bond openings are wire bond openings 114 in stiffener 1000. The IC die mount position is IC die mounting position 202, shown in
In step 1806, a first surface of the stiffener is attached to the first substrate surface. For example, the stiffener is stiffener 1000, which is attached to substrate 104.
In step 1808, an IC die is mounted to a second surface of the stiffener. For example, the IC die is IC die 102, which is mounted to stiffener 1000, in IC die mounting position 202.
In step 1810, at least one of the wire bond openings are bridged with at least one stud. For example, one or more of wire bond openings 114 are bridged with one or more studs 1002. Studs 1002 allow for increased heat spreading across corresponding wire bond openings 114 to the outer edges of stiffener 1000.
In step 1812, a plurality of solder balls are attached to the second substrate surface. For example, the plurality of solder balls are plurality of solder balls 106, which connect to vias and/or solder ball pads on the bottom surface of substrate 104. The solder balls may be arranged on the bottom surface of substrate 104 as shown in
The flowchart 1800 may include the further step where a contact pad on the IC die is coupled to the substrate with a wire bond, wherein the wire bond passes through one of the wire bond openings in the stiffener.
Flowchart 1800 may include the additional step where the second stiffener surface is encapsulated. For instance, the second stiffener surface may be encapsulated by a resin or molding compound, that also encapsulates the IC die and wire bonding.
According to an embodiment of the present invention, the electrical and thermal performance of a plastic BGA (PBGA) package is improved by attaching a thermal/ground connector to the bottom surface of a PBGA package. The thermal/ground connector couples the bottom center of a plastic substrate of a die-up PBGA to the PCB. Heat from an IC die is more easily spread to the PCB through the thermal/ground connector, which is attached to the plastic substrate underneath the IC die.
In the discussion above regarding
IC die 304 is mounted to die pad 310. Wire bonds 308 connect signals of IC die 304 to contact pads on substrate 302. The contact pads on substrate 302 connect to solder balls 306 attached to the bottom surface of substrate 302, through vias 314 and routing within substrate 302.
Thermal/ground vias 316 connect die pad 310 to an exposed metal plane 1110 at the bottom center of substrate 302. For instance, die pad 310 and metal plane 1110 may be exposed copper pads of plastic substrate 302.
Solder balls are not attached to the bottom region of substrate 302 covered by metal plane 1110. Ground/thermal connector 1102 is attached to metal plane 1110. For instance, ground/thermal connector 1102 may be a metal piece (copper or aluminum, for example) that is laminated to metal plane 1110 at the bottom center of substrate 302 using a conductive adhesive material 1104, such as a conductive epoxy, solder, or other adhesive material. A bottom surface 1112 of ground/thermal connector 1102 may be plated with solder for surface mount to soldering pads on the PCB.
BGA package 1100 provides a thermal path of IC die 304, to die pad 310, to thermal/ground vias 316, to metal plane 1110, to adhesive material 1104, to ground thermal connector 1102 (and bottom surface 1112) to the PCB soldering pads. Heat spreading is improved by a direct thermal path from IC die 304 to the PCB.
Metal pads on the PCB can be connected to a PCB ground plane to advantageously shorten the length of electrical current return paths, as well shorten the conductive heat dissipation path from device junctions of IC die to the PCB.
Ground bonds 1106 may be used to couple ground bond pads 1108 on IC die 304 to die pad 310, when die pad 310 is coupled to ground. This provides for very short ground connections for signals in IC die 304.
Flowchart 1900 begins with step 1902. In step 1902, a substrate that has a first surface and a second surface is provided. For example, the substrate is plastic substrate 302, or another substrate type suitable for a BGA package. For example, an IC die mounting position and contact points are provided on a first, upper surface, and solder ball pads are provided on a second, bottom surface.
In step 1904, an IC die is mounted to the first substrate surface. For example, the IC die is IC die 304, which is mounted to substrate 302. IC die 304 may be mounted to a die pad 310 attached to substrate 302.
In step 1906, a plurality of solder balls are attached to the second substrate surface. For example, the plurality of solder balls are plurality of solder balls 306, which connect to vias and/or solder ball pads on the bottom surface of substrate 302. The solder balls may be arranged on the bottom surface of substrate 302 as shown in
In step 1908, a first surface of a heat spreader is coupled to the second substrate surface. For example, the heat spreader is ground/thermal connector 1102, which is coupled to substrate 302 with adhesive material 1104. Ground/thermal connector 1102 may be mounted to metal plane 1110 on substrate 302 by adhesive material 1104.
In step 1910, a second surface of the heat spreader is configured to be coupled to a printed circuit board (PCB). Second heat spreader surface is bottom surface 1112. In an embodiment, step 1910 may include the step where the second surface of the heat spreader is plated with solder.
Flowchart 1900 may comprise the additional step where the first substrate surface is coupled to the heat spreader through at least one via that extends through the substrate. For example, the first substrate surface may be coupled to the heat spreader by one or more ground/thermal vias 316.
In step 1912, a copper plated die-attach pad is exposed in the center of the first substrate surface. The copper plated die-attach pad, die pad 310, may be an exposed portion of a metal layer of plastic substrate 302.
In step 1914, the IC die is mounted to the copper plated die-attach pad. For example, the IC die may be mounted with an epoxy.
In step 1916, a copper plated plane is exposed in the center of the second substrate surface. The copper plated plane, metal plane 1110, is an exposed portion of a metal layer of plastic substrate 302.
In step 1918, the die-attach pad is coupled to the copper plated plane with at least one via.
Flowchart 1900 may include the additional step where the first substrate surface is encapsulated. For instance, the first substrate surface may be encapsulated by a resin or molding compound, that also encapsulates the IC die and wire bonding.
Additional description for exemplary embodiments of die-up PBGA package 1100 are described in this section.
In the configuration of package 1100 shown in
Ground/thermal connector 1102 is attached to metal plane 1110. Metal plane 1110 is a portion of a metal layer of substrate 302 exposed though the solder mask on the bottom surface of substrate 302. As described above, ground/thermal connector 1102 may be a metal piece or slug (copper or aluminum, for example) similar to the heat spreaders described elsewhere herein, that is laminated to metal plane 1110 at the bottom center of substrate 302 using a conductive adhesive material 1104, such as a conductive epoxy, solder, or other adhesive material. A bottom surface 1112 of ground/thermal connector 1102 may be plated with a metal (including a metal alloy), such as a solder, which may include palladium, nickel, tin, gold, silver, lead and/or further related substance(s), to form connector plating 2202. Connector plating 2202 enhances the surface mounting of connector 1102 to PCB 2222.
The top surface of PCB substrate 2212 includes solder ball contact pads 2226 for surface mount of solder balls 306 to PCB 2222, and includes PCB metal pad 2216 for surface mount of connector 1102 to PCB 2222. PCB metal pad plating 2214 may be attached to PCB metal pad 2216 to enhance the surface mounting of connector 1102 to PCB metal pad 2216. For example, PCB metal pad 2216 may be screen printed with a solder paste to form PCB metal pad plating 2214. PCB metal pad plating 2214 also may be formed in other known manners from processes and substances described herein or elsewhere.
Heat spreading is improved in package 1100 by a direct thermal path from IC die 304 through connector 1102 to PCB 2222. Furthermore, PCB metal pad 2216 on PCB 2222 can be connected to a PCB ground plane to advantageously shorten the length of electrical current return paths, as well shorten the conductive heat dissipation path from device junctions of IC die 304 to PCB 2222. As described above, vias may be created in substrate 302, and filled with a conductive material, to enhance thermal and electrical performance by coupling IC die 304 to connector 1102 more directly.
Example implementations for package 1100 and PCB 2222 according to the present invention will now be described. These implementations are provided for purposes of illustration, and are not intended to limit the scope of the invention. Alternate implementations, differing slightly or substantially from those described herein, will be apparent to persons skilled in the relevant art(s) based on the teachings contained herein. Such alternate implementations fall within the scope and spirit of the present invention.
In an example implementation, ground/thermal connector 1102 may be attached to metal plane 1110 on substrate 302 by adhesive material 1104 that has an adhesive material height 2204 in the range of 1 to 1.5 mil (0.025 to 0.0375 mm). Connector 1102 has a connector height 2206 equal to 0.38 mm. Connector plating 2202 has a connector plating height 2208 equal to 1 mil (0.025 mm). According to these example height values, the sum of adhesive material height 2204 (using a value of 0.025 mm), connector height 2206, and connector plating height 2208 is 0.43 mm.
Furthermore, prior to attachment to substrate 302, solder balls 306 may have a height of 0.6 mm, for example. Ball pitch 2220, which represents the distance from the center of a solder ball mounted to substrate 302 to the center of an adjacent solder ball, is equal to 1 mm, for example. When attached to substrate 302, the height of solder balls 306 may decrease slightly, to have a solder ball height 2218 equal to 0.5 mm, for example. This decrease in height is due to the spreading of solder of the solder ball onto a solder ball pad 2224 to which it is attaching. In this example configuration, therefore, the difference in height between the solder ball height 2218 (0.5 mm) and the sum of adhesive material height 2204, connector height 2206, and connector plating height 2208 (0.43 mm) is equal to 0.07 mm, which is the value of a gap distance. When package 1100 is attached to PCB 2222, this gap distance appears between connector plating 2202 and PCB 2222. In this example implementation, the gap distance may vary between 2.0 to 4.0 mils (0.05 to 0.1 mm), or even outside of this range, due to variations in the actual height values recited above that occur during the manufacturing process.
As described above, the dimensions shown in
As described above, PCB metal pad plating 2210 may be formed on PCB metal pad 2216. PCB metal pad plating 2210 substantially bridges the above described gap distance, and enhances the connection of connector 1102 to PCB 2222. For example, PCB metal pad plating 2214 may be formed such that PCB metal pad plating height 2210 is in the range of 4 to 6 mil (0.1 to 0.15 mm) to substantially fill the gap distance.
In another example configuration, ball pitch 2220 may be equal to 1.27 mm and solder ball height 2218 may be equal to 0.75 or 0.76 mm. In further implementations, these dimensions may have other values. As described above, the dimension values provided in the section are examples, and are not limiting to the present invention.
Furthermore, ground/thermal connector 1102 may be shaped in additional ways, to enhance the operation and manufacturability of package 1100.
Furthermore, in the example embodiment shown in
Ground/thermal connector 1102 may also include two or more separate sub-sections that are attached to package 1100.
The use of more than one ground/thermal connector, as shown in
Any number of additional ground/thermal connectors may be used, according to the present invention.
According to the present invention, ground/thermal connectors may be shaped and arranged in a variety of configurations. For example, one or more ground/thermal connectors may be formed around a portion of, or all of one or more other ground/thermal connectors.
Vias through a package substrate may be located in a variety of places in a substrate. One example pattern for locating vias in a substrate is shown in
The present invention is applicable to the via configuration shown in
Referring to the example shown in
Note that in
Flowchart 2600 begins with step 2602. In step 2602, a substrate that has a first surface is provided. For example, the substrate is plastic substrate 302, or another substrate type suitable for a BGA package. The first surface is the bottom surface of substrate 302 shown in
In step 2604, an array of contact pads and a metal plane on the first surface of the substrate are exposed. For example, the contact pads are solder ball contact pads 2224, and the metal plane is metal plane 1110. The contact pads and metal plane are portions of a metal layer of substrate 302 that are completely or partially exposed through a solder mask on the bottom surface of substrate 302.
In step 2606, a solder ball is attached to each of the exposed contact pads on the first surface of the substrate. For example, the solder balls attached to each contact pad are plurality of solder balls 306, which attach to solder ball contact pads 2224.
In step 2608, a first surface of a thermal connector is coupled to the exposed metal plane. For example, the thermal connector is ground/thermal connector 1102, which is coupled to metal plane 1110.
In an embodiment, step 2608 may include a step wherein the first surface of the thermal connector is coupled to the exposed metal plane, wherein the thermal connector has a height that is less than a height of a solder ball attached to one of the exposed contact pads. For example, as shown in
Flowchart 2600 may include the additional step wherein the second surface of the thermal connector is plated with a metal. For example, as shown in
Flowchart 2600 may include the additional step wherein the second surface of the thermal connector is configured to be coupled to a second metal plating formed on a metal plane on the PCB. As shown in
In an embodiment, the thermal connector of step 2608 may include a plurality of separate thermal connectors. For example, as shown in
In an embodiment, step 2602 may include the step wherein an organic substrate that has a first surface is provided. For example, the organic substrate may be plastic substrate 302, which includes one or more metal layers formed on an organic substrate (for example, BT resin or FR4 epoxy/glass).
In an embodiment, flowchart 2600 may include the additional step wherein an IC die is mounted to a second surface of the substrate. For example, the IC die may be IC die 304. IC die 304 may be mounted to a die pad 310 attached to substrate 302, as shown in
In an example embodiment, substrate 302 has a central portion that is defined by the metal plane to which an IC die may be mounted. In an embodiment, flowchart 2600 may include the additional steps where a plurality of vias are located in the substrate in the central region, and a plurality of vias are located in the substrate outside of the central region. For example, the central region may be ventral region 2806, and an area outside of the central region may be peripheral region 2804. In an embodiment, a first via density for the plurality of vias in the central portion is greater than a second via density for the plurality of vias outside of the central portion.
According to an embodiment of the present invention, the electrical performance of a BGA package is improved by configuring the BGA package to allow the attachment of electronic devices to the bottom surface of a BGA package. In an example BGA package, a thermal/ground connector couples the bottom center of the package substrate to a PCB. According to the present invention, electronic devices are attached to the bottom surface of the BGA package, in a region between the thermal/ground connector and the array of solder balls. This configuration allows for enhanced electrical performance, by allowing additional electronic devices to be present in the BGA package. Furthermore, the electronic devices are mounted closely to the thermal/ground connector, and hence may have shorter ground current paths. Further benefits may be realized, as would be understood by persons skilled in the relevant art(s) from the teachings herein.
Embodiments allowing the attachment of electronic devices to the bottom surface of the BGA package are adaptable to any BGA package types, including any of those described elsewhere herein. These BGA package types include tape and organic substrate BGA packages, and include die-up and die-down BGA package configurations. For exemplary purposes, the present invention is described below in relation to a die-up BGA package similar to BGA package 800 shown in
As shown in
Electronic devices may be attached to the bottom surface of substrate 104 adjacent to ground/thermal connector 802. In some configurations, electronic devices may be attached more closely to ground/thermal connector 802 than in others. For example, as described above, ground/thermal connector 802 may be coupled to a stiffener in BGA package 3100 through a central opening in substrate 104. When ground/thermal connector 802 is directly coupled to the bottom surface of substrate 104, no central opening in substrate 104 is required. The structural integrity of substrate 104 near ground/thermal connector 802 when a central opening is present may be less than when a central opening is not present. Hence, in some embodiments, electronic devices may be attached in substrate region 3102 more closely to ground/thermal connector 802 when a central opening is not present in substrate 104, than when a central opening is present.
As shown in
When BGA package 3100 is mounted on PCB portion 3306, either or both of substrate region 3102 and PCB region 3306 may have electronic devices attached/mounted on them. For example,
As shown in
As described above,
In an embodiment, step 2604 includes the step where the array of contact pads are arranged in at least one ring to surround the metal plane on the first surface of the substrate. For example, as shown in
As shown in
As shown in
In step 3606, a second array of contact pads are exposed arranged in at least one ring that corresponds to the first array of contact pads. For example, as shown in
In step 3608, at least one passive electronic device is attached to the first surface of the PCB in a region bounded on a first edge by the second metal plane and on a second edge by the second array of contact pads. For example, as shown in
Additional Embodiments of a BGA Package with Thermal Connector
Further description of exemplary embodiments of BGA packages with stiffeners and thermal connectors, similar to tape BGA package 800 shown in
Note that the thermal connectors referred to herein may also be referred to as heat spreaders, heat sinks, heat slugs, and by other labels.
As shown in
Substrate 3701 is a substrate applicable to BGA packages, substantially similar to the other BGA package substrates described elsewhere herein, and to BGA package substrates otherwise known to persons skilled in the relevant art(s). Substrate 3701 is shown in
As shown in
As shown in
In the embodiment of
In the embodiment shown in
As shown in
For example, as shown in
As shown in
Stiffener 3702 and thermal connector 802, and other stiffeners described elsewhere herein, may be manufactured from copper, copper-based alloys, aluminum, aluminum-based alloys, as well as other types of electrically conductive metals and alloys, ceramic materials, thermally conductive dielectric materials, organic materials, plastics, and combinations of these materials, as would be understood by persons skilled in the relevant art(s) from the teachings herein.
Surfaces of stiffener 3702 are not required to be finished. However, the surfaces of stiffener 3702 may be finished using processes such as micro-etch and oxidation to enhance adhesion of encapsulate material 3704 and/or thermal connector 802. In embodiments, one or more plated areas of silver, solder, nickel, gold, and further metals and alloys may also be applied to the top and/or bottom surfaces 3742 and 3740 of stiffener 3702. For example, one or more plated areas may be created in spot, strip, bar, ring, and other shapes on top surface 3742 of stiffener 3702 to enhance wire bond connections, and/or mounting of IC die 102. For example, as shown in
Furthermore, surfaces of thermal connector 802 are not required to be finished. However, surfaces of thermal connector 802 may be finished using processes such as micro-etch and oxidation to enhance attachment to stiffener 3702. Selective plating or screen printing of silver, solder, nickel, gold, and further metals and alloys may be applied to top and/or bottom surfaces of thermal connector 802. For example, one or more plated areas may be applied to the top surface of thermal connector 802 to enhance attachment to bottom surface 3740 of stiffener 3702. One or more plated areas may also be applied to bottom surface 3736 of thermal connector 802 to promote attachment to a PCB when attached thereto by surface mounting or other process.
h1(3708)=height of solder ball 106/standoff height of the bottom surface of substrate 3701 to the sitting plane of the BGA package.
h2 (3710) distance from bottom surface 3744 of substrate 3701 to bottom surface 3736 of thermal connector 3702.
h3 (3712)=h1-h2=distance between bottom surface 3736 of thermal connector 3702 and sitting plane of the BGA package (also, change in height of solder ball 106 prior to and after attachment to PCB).
Where h3 is typically in the range of:
0<h3<h1
For example, in an exemplary embodiment, h1=0.5 mm and h2=0.4 mm. Hence, h3=0.5 mm-0.4 mm=0.1 mm. For example, these dimension values may be used in a BGA package with 1 mm ball pitch and 0.6 mm ball diameter. Note that these dimension values are provided for illustrative purposes, and the present invention is applicable to other dimension values related to BGA packages.
Stiffener 3802 has a bottom surface 3808 and a protruding portion 3804, similarly to stiffener 112 shown in
BGA package 3800 has improved thermal and electrical properties. A single-piece stiffener better conducts heat and/or electricity than the two-piece stiffener/thermal connector structure shown in
Note that as shown in the embodiment of
Furthermore, as shown in
BGA package 4200 has improved thermal and electrical properties. A single-piece stiffener better conducts heat and/or electricity than the two-piece stiffener/thermal connector structure shown in
Note that as shown in the embodiment of
As shown in the example of
In an embodiment, cavity 4504 is the same size as, or larger size than a footprint size of thermal connector 802. The thermal connector 802 may be attached to PCB 4502 using an adhesive 4506, which may be an electrically connective or non-conductive adhesive, epoxy, solder, metal-filled paste, or other joining agent. This configuration may be used to enhance thermal coupling of IC die 102 inside BGA package 4500 to external heat sinking and transportation devices. Such devices may include, but are not limited to heat sinks, heat pipes, radiators, a chassis and a box, and enclosure walls of electronic systems.
Embodiments for Assembling BGA Packages with Thermal Connectors
In step 4604, the surface of the substrate is coupled to a surface of a stiffener, wherein an area of the surface of the stiffener is less than an area of the surface of the substrate. For example, the surface of the substrate is top surface 3738 of substrate 3701, and the surface of the stiffener is bottom surface 3740 of stiffener 3702, as shown in
In step 4606, a thermal connector is coupled to the surface of the stiffener through the opening, wherein a surface of the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. For example, the thermal connector is thermal connector 802, which is coupled to bottom surface 3740 of stiffener 3702 through opening 704, as shown in
In step 4608, an IC die is mounted to a second surface of the stiffener. For example, as shown in
In step 4610, the IC die is encapsulated on the second surface of the stiffener. For example, as shown in
In step 4612, a dam is formed on the surface of the substrate around the IC die. For example, the dam is dam 3706, which is formed on top surface 3738 of substrate 3701 around IC die 102.
In step 4614, an encapsulate material is applied within a boundary of the dam. For example, as shown in
In an alternative embodiment, step 4610 may include the step where an encapsulate material is applied according to an over-mold encapsulation process. For example, as shown in
In step 4616, an encapsulate material is applied. For example, as shown in
In step 4618, an edge of the encapsulate material is formed according to a saw-singulation process. As described above, a saw-singulation process may be used to separate the BGA packages that were manufactured in a panel strip, thereby forming relatively straight edges for encapsulate material 3704, as shown in
In step 4620, a pattern is formed in at least a portion of an edge of the stiffener. For example, as shown in
In step 4622, the thermal connector is configured to have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. For example, as shown in
In step 4704, an opening is formed through a surface of a substrate. For example, the opening is central window-shaped opening 704, formed in substrate 3701 of BGA package 3800 shown in
In step 4706, the surface of the substrate is coupled to the surface of the stiffener such that the protruding portion extends through the opening, wherein an area of the surface of the stiffener is less than an area of the surface of the substrate, wherein a surface of the protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. For example, as shown in
In step 4708, an IC die is mounted to a second surface of the stiffener. For example, as shown in
In step 4710, the IC die is encapsulated on the second surface of the stiffener. For example, as shown in
In step 4712, a dam is formed on the surface of the substrate around the IC die. For example, the dam is dam 3706, which is formed on top surface 3738 of substrate 3701 around IC die 102.
In step 4714, an encapsulate material is applied within a boundary of the dam. For example, as shown in
In an alternative embodiment, step 4710 may include the step where an encapsulate material is applied according to an over-mold encapsulation process. For example, BGA package 3800 with a single piece stiffener/thermal connector is applicable to an over-mold encapsulation process, as shown in
In step 4716, an encapsulate material is applied. For example, as shown in
In step 4718, an edge of the encapsulate material is formed according to a saw-singulation process. As described above, a saw-singulation process may be used to separate the BGA packages that were manufactured in a panel strip, thereby forming relatively straight edges for encapsulate material 3704, as shown in
In step 4720, a pattern is formed in at least a portion of an edge of the stiffener. For example,
In step 4722, the protruding portion is configured to have a height such that the protruding portion extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. For example, similarly to the embodiment shown in
In step 4804, the surface of the substrate is coupled to a surface of a stiffener. For example, the surface of the substrate is top surface 3738 of substrate 3701, and the surface of the stiffener is bottom surface 4102 of stiffener 112, as shown in
In step 4806, a thermal connector is coupled to the surface of the stiffener through the opening, wherein the thermal connector is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. For example, the thermal connector is thermal connector 802, which is coupled to bottom surface 4102 of stiffener 112 through opening 704, as shown in
In step 4808, the thermal connector is configured to have a height such that the thermal connector extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. For example, as shown in
In step 4904, a stiffener that has a surface and a protruding portion is provided, wherein the protruding portion is located on the surface of the stiffener. For example, the stiffener is stiffener 4202, as shown in
In step 4906, the surface of the substrate is coupled to the surface of the stiffener such that the protruding portion extends through the opening, wherein the protruding portion is capable of attachment to a printed circuit board (PCB) when the BGA package is mounted to the PCB. For example, as shown in
In step 4908, the protruding portion is configured to have a height such that the protruding portion extends into a cavity formed in a surface of the PCB when the BGA package is mounted to the PCB. For example, similarly to the embodiment shown in
This section describes PCB land patterns and configurations for attaching a thermal connector portion of a BGA package to a PCB, according to embodiments of the present invention. The PCB land patterns and configurations are applicable to mounting all types of thermal connectors. For example, applicable thermal connectors include cavity 702 shown in
As shown in
As shown in
Note that for illustrative purposes, the present description illustrates “solder mask defined land openings,” (SMDs) such as land pattern 5102. For SMDs, a portion of the conductive land that is exposed through openings in the solder mask has a smaller area than the entire conductive land. The present invention, however, is also applicable to “non-solder mask defined land openings” (NSMDs). For NSMDs, the entire conductive land is exposed. For example, in an NSMD embodiment for PCB 5100, conductive land 5004 may be formed as a plurality of rectangular conductive lands arranged in an array or matrix, so that solder mask 5006 is not required to define the array or matrix, and/or is not required to define the rectangular shapes of openings 5104. Any of the land patterns described herein may be formed as SMDs or NSMDs.
This section describes a seal ring for a thermal connector portion of a BGA package, according to embodiments of the present invention. The seal ring as described herein is applicable to all configurations of BGA packages with thermal connectors. For example, the applicable thermal connectors include cavity 702 shown in
In an alternative embodiment, sealant material 5602 is an electrically conductive material that can electrically couple thermal connector 802 to one or more electrically conductive traces, rings, and/or planes of substrate 3701, that are coupled to an electrical potential. Such an embodiment provides additional flexibility for routing of substrate 3701, and an improvement in BGA package electrical performance.
(1) A window opening is patterned in the package substrate to facilitate thermal and electrical connection from the IC die to the PCB.
(2) A thermal/electrical connector is exposed at the bottom of the BGA package.
(3) BGA package designs can use conventional types of substrate (such as organic, tape, and ceramic, etc.) as well as advanced types of substrate (high density substrate, build-up substrate, Teflon substrate, etc.); a single routing layer substrate, as well as two or more routing layer substrate can be used.
(4) Glob-top, over-mold, saw-singulation and other IC die encapsulation processes can be used.
(5) Stiffener/interposer can be patterned in different forms (openings, cutouts, steps, etc.) or shapes (square, rectangular, circular, spoke-like, cutouts or notches and steps on one or more edges, etc.) for enhanced wire bond connection, enhanced BGA package mechanical, thermal, and electrical performance, enhanced reliability, improved substrate design, and manufacturing process enhancement.
(6) One or more of stiffener/interposers and thermal/electrical connector surfaces may be finished using a variety of processes, materials, and methodologies at various surfaces, spots, locations.
(7) The stiffener/interposer and thermal/electrical connector may be constructed in a single piece.
(8) A cavity may be formed in a thermal/electrical connector for die attachment.
(9) Two or more stiffeners/interposers may be integrated into a BGA package.
(10) A seal ring design may be incorporated in a substrate window opening.
(11) A thermal/electrical connector may be formed to extend under the sitting plane of the BGA package.
(12) A cavity may be formed in a surface of the PCB to allow the extended thermal/electrical connector to be more easily mounted on the PCB, and/or exposed to the backside of the PCB, and/or connected to heat sinking devices at the backside of the PCB
(13) A split stiffener/interposer design may be used to provide different electrical potential planes for the BGA package.
(14) Rigid support is provided for the IC die during the BGA package assembly processes.
(1) A thermal/electrical connector provides a low impedance path for heat and/or electrical current flow between an IC die and a PCB.
(2) A window opening formed in a substrate facilitates thermal and electrical connection between an IC die and PCB.
(3) BGA package designs can use conventional types of substrate (such as organic, tape, and ceramic, etc.) as well as advanced types of substrate (high-density substrate, build-up substrate, Teflon substrate, etc.).
(4) A substrate with a single routing layer, as well as two or more layers may be used.
(5) Various processes may be used for IC die encapsulation, including glob-top, over-mold, saw-singulated, and others to meet requirements of various applications and provide the BGA package with various forms and appearances.
(6) Different patterns (openings, cutouts, steps, etc.) or shapes (square, rectangular, circular, spoke-like, cutouts or notches and steps on one or more edges, etc.) may be formed in a stiffener/interposer to reduce wire bond lengths for critical nets, reduce risks of wire bonds shorting during the BGA package assembly processes, provide flexibility for substrate routing/design, and enhance BGA package mechanical, thermal, electrical, and reliability performances.
(7) A black-oxidized surface treatment may be applied on a top surface of a stiffener/interposer. This promotes adhesion between a molding compound used for IC die encapsulation and the stiffener/interposer. A surface coating or plating on one or more stiffener/interposer surfaces and/or thermal/electrical connector surfaces at an interface of silver, solder, or other metals and alloys promotes adhesion between elements. A surface coating or plating on a bottom surface of a thermal/electrical connector of silver, solder, or other metal(s) and/or alloy(s) promotes adhesion between the thermal connector of the BGA package and a PCB during a surface mount process.
(8) A single-piece construction for stiffener/interposer and thermal/electrical connector reduces an electrical and thermal interface impedance.
(9) A cavity formed in a thermal/electrical connector for attachment of the IC die reduces wire bond length and improves package electrical performances.
(10) A two-stiffener/interposer integration into a BGA package provides additional electrical potential planes for the BGA package.
(11) A split stiffener/interposer design provides additional electrical potential planes for the BGA package.
(12) A seal ring design in a substrate window opening improves BGA package moisture resistance as well as mechanical and thermal performances.
(13) A rigid IC die support is provided by the present invention, which reduces IC die cracking and de-lamination, and improves assembly yields during a BGA package assembly process.
(14) Extension or protrusion of the thermal/electrical connector under the sitting plane of the BGA package allows connection of heat sinking devices from the backside of an PCB to the BGA package.
While various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
This application is a continuation of U.S. application Ser. No. 12/260,784, now allowed, filed Oct. 29, 2008, which is a continuation of U.S. application Ser. No. 11/475,118, filed Jun. 27, 2006, now U.S. Pat. No. 7,462,933, which is a divisional of U.S. application Ser. No. 10/284,312, filed Oct. 31, 2002, now U.S. Pat. No. 7,161,239, which claims the benefit of U.S. Provisional Application No. 60/352,877, filed Feb. 1, 2002 (Atty. Dkt. No. 1875.0200002) and is a continuation-in-part of U.S. application Ser. No. 09/984,259, filed Oct. 29, 2001, now U.S. Pat. No. 7,132,744, which is a continuation-in-part of U.S. application Ser. No. 09/742,366, filed Dec. 22, 2000, now abandoned. All of the above-mentioned applications are incorporated herein by reference in their entireties. The following applications of common assignee are related to the present application, and are herein incorporated by reference in their entireties: “Ball Grid Array Package with Patterned Stiffener Layer,” U.S. application Ser. No. 10/284,340, filed Oct. 31, 2002, now U.S. Pat. No. 6,906,414, issued Jun. 14, 2005; “Ball Grid Array Package with Stepped Stiffener Layer,” U.S. application Ser. No. 10/284,371, filed Oct. 31, 2002, now pending; “Ball Grid Array Package Fabrication with IC Die Support Strictures,” U.S. application Ser. No. 10/284,349, filed Oct. 31, 2002, now U.S. Pat. No. 6,825,108, issued Nov. 30, 2004; “Ball Grid Array Package with Multiple Interposers,” U.S. application Ser. No. 10/284,166, field Oct. 31, 2002, now U.S. Pat. No. 6,861,750, issued Mar. 1, 2005; and “Ball Grid Array Package with Separated Stiffener Layer,” U.S. application Ser. No. 10/284,366, filed Oct. 31, 2002, now pending.
| Number | Date | Country | |
|---|---|---|---|
| 60352877 | Feb 2002 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 10284312 | Oct 2002 | US |
| Child | 11475118 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 12260784 | Oct 2008 | US |
| Child | 13030950 | US | |
| Parent | 11475118 | Jun 2006 | US |
| Child | 12260784 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 09984259 | Oct 2001 | US |
| Child | 10284312 | US | |
| Parent | 09742366 | Dec 2000 | US |
| Child | 09984259 | US |
