Rezaur Rahman Khan

Person

Rancho Santa Margarita, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,615,110
- Issue date Apr 7, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density redistribution layer (RDL) interconnect bridge using a...
- Patent number 10,276,403
- Issue date Apr 30, 2019
- Avago Technologies International Sales Pe. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader having thermal interface material retainment
- Patent number 10,079,191
- Issue date Sep 18, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,008,439
- Issue date Jun 26, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level system in package (SiP) using a reconstituted wafer and...
- Patent number 9,842,827
- Issue date Dec 12, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out 3D IC integration structure without substrate and method of...
- Patent number 9,837,378
- Issue date Dec 5, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic-core three-dimensional (3D) inductors and packaging integr...
- Patent number 9,693,461
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interposer having a cavity for intra-interposer die
- Patent number 9,548,251
- Issue date Jan 17, 2017
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant dielectric layer for semiconductor device
- Patent number 9,431,370
- Issue date Aug 30, 2016
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,406,636
- Issue date Aug 2, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutual capacitance and magnetic field distribution control for tran...
- Patent number 9,338,880
- Issue date May 10, 2016
- Broadcom Corporation
- Sampath Komarapalayam Velayudham Karikalan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for cooling semiconductor device hot blocks an...
- Patent number 9,299,634
- Issue date Mar 29, 2016
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging using reconstituted wafers
- Patent number 9,293,393
- Issue date Mar 22, 2016
- Broadcom Corporation
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible routing for chip on board applications
- Patent number 9,287,189
- Issue date Mar 15, 2016
- Broadcom Corporation
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with integrated socket
- Patent number 9,275,976
- Issue date Mar 1, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of chips and silicon-based trench capacitors using low...
- Patent number 9,236,442
- Issue date Jan 12, 2016
- Broadcom Corporation
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package structure for wireless communication element, th...
- Patent number 9,230,875
- Issue date Jan 5, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compliant dielectric layer for semiconductor device
- Patent number 9,219,054
- Issue date Dec 22, 2015
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved testability
- Patent number 9,153,507
- Issue date Oct 6, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package 3D interconnection and method of making same
- Patent number 9,129,980
- Issue date Sep 8, 2015
- Broadcom Corporation
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package structure
- Patent number 9,070,627
- Issue date Jun 30, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package 3D interconnection and method of making same
- Patent number 9,064,781
- Issue date Jun 23, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,059,179
- Issue date Jun 16, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interposer with conductive particles
- Patent number 9,041,171
- Issue date May 26, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material for integrated circuit package
- Patent number 9,024,436
- Issue date May 5, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with ultra-thin interposer without through-se...
- Patent number 9,013,041
- Issue date Apr 21, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal improvement for hotspots on dies in integrated circuit pack...
- Patent number 9,013,035
- Issue date Apr 21, 2015
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated electromagnetic shielding
- Patent number 8,928,128
- Issue date Jan 6, 2015
- Broadcom Corporation
- Sampath K. V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated heat spreaders
- Patent number 8,872,321
- Issue date Oct 28, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...
- Publication number 20180308791
- Publication date Oct 25, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...
- Publication number 20170365565
- Publication date Dec 21, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SYSTEM IN PACKAGE (SIP) USING A RECONSTITUTED WAFER AND...
- Publication number 20170301651
- Publication date Oct 19, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out 3D IC Integration Structure without Substrate and Method of...
- Publication number 20170117251
- Publication date Apr 27, 2017
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreader Having Thermal Interface Material Retainment
- Publication number 20170110384
- Publication date Apr 20, 2017
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...
- Publication number 20170011993
- Publication date Jan 12, 2017
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES
- Publication number 20160190057
- Publication date Jun 30, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20160155728
- Publication date Jun 2, 2016
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Cooling Semiconductor Device Hot Blocks an...
- Publication number 20160148890
- Publication date May 26, 2016
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20150340308
- Publication date Nov 26, 2015
- BROADCOM CORPORATION
- Edward LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES
- Publication number 20150303172
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...
- Publication number 20150302974
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20150249061
- Publication date Sep 3, 2015
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
- Publication number 20150235992
- Publication date Aug 20, 2015
- BROADCOM CORPORATION
- Sampath K. KARIKALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20150206821
- Publication date Jul 23, 2015
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- B82 - NANO-TECHNOLOGY
Information Patent Application
THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACK...
- Publication number 20150200149
- Publication date Jul 16, 2015
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIELECTRIC LAYER FOR SEMICONDUCTOR DEVICE
- Publication number 20150179610
- Publication date Jun 25, 2015
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20150069637
- Publication date Mar 12, 2015
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...
- Publication number 20140374897
- Publication date Dec 25, 2014
- Sam Ziqun ZHAO
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES
- Publication number 20140367854
- Publication date Dec 18, 2014
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device Facilitating Package on Package Connections
- Publication number 20140291818
- Publication date Oct 2, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE STRUCTURE FOR WIRELESS COMMUNICATION ELEMENT, TH...
- Publication number 20140235183
- Publication date Aug 21, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGING USING RECONSTITUTED WAFERS
- Publication number 20140151900
- Publication date Jun 5, 2014
- BROADCOM CORPORATION
- Kevin Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF CHIPS AND SILICON-BASED TRENCH CAPACITORS USING LOW...
- Publication number 20140145300
- Publication date May 29, 2014
- BROADCOM CORPORATION
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS
- Publication number 20140124940
- Publication date May 8, 2014
- BROADCOM CORPORATION
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE DOWN INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SPREADER A...
- Publication number 20140103505
- Publication date Apr 17, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Interposer
- Publication number 20140061886
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including a Substrate and an Interposer
- Publication number 20140061945
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Interposer with Through-Semiconduct...
- Publication number 20140061946
- Publication date Mar 6, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Rezaur Rahman Khan

Person

Patents Grantslast 30 patents

Thin recon interposer package without TSV for fine input/output pit...

High density redistribution layer (RDL) interconnect bridge using a...

Heat spreader having thermal interface material retainment

Thin recon interposer package without TSV for fine input/output pit...

Wafer level system in package (SiP) using a reconstituted wafer and...

Fan-out 3D IC integration structure without substrate and method of...

Magnetic-core three-dimensional (3D) inductors and packaging integr...

Semiconductor interposer having a cavity for intra-interposer die

Semiconductor package with a bridge interposer

Compliant dielectric layer for semiconductor device

Interposer package-on-package structure

Mutual capacitance and magnetic field distribution control for tran...

Method and apparatus for cooling semiconductor device hot blocks an...

Stacked packaging using reconstituted wafers

Flexible routing for chip on board applications

System-in-package with integrated socket

Integration of chips and silicon-based trench capacitors using low...

Interposer package structure for wireless communication element, th...

Compliant dielectric layer for semiconductor device

Semiconductor package with improved testability

Package 3D interconnection and method of making same

Interposer package-on-package structure

Package 3D interconnection and method of making same

Semiconductor package with a bridge interposer

Programmable interposer with conductive particles

Thermal interface material for integrated circuit package

Semiconductor package with ultra-thin interposer without through-se...

Thermal improvement for hotspots on dies in integrated circuit pack...

Semiconductor package with integrated electromagnetic shielding

Semiconductor packages with integrated heat spreaders

Patents Applicationslast 30 patents

THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

HIGH DENSITY REDISTRIBUTION LAYER (RDL) INTERCONNECT BRIDGE USING A...

WAFER LEVEL SYSTEM IN PACKAGE (SIP) USING A RECONSTITUTED WAFER AND...

Fan-out 3D IC Integration Structure without Substrate and Method of...

Heat Spreader Having Thermal Interface Material Retainment

Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

STACKED PACKAGING USING RECONSTITUTED WAFERS

Method and Apparatus for Cooling Semiconductor Device Hot Blocks an...

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES

MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...

INTERPOSER PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER

THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...

THERMAL IMPROVEMENT FOR HOTSPOTS ON DIES IN INTEGRATED CIRCUIT PACK...

COMPLIANT DIELECTRIC LAYER FOR SEMICONDUCTOR DEVICE

INTERPOSER PACKAGE-ON-PACKAGE STRUCTURE

THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE AND METHO...

INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

Integrated Circuit Device Facilitating Package on Package Connections

INTERPOSER PACKAGE STRUCTURE FOR WIRELESS COMMUNICATION ELEMENT, TH...

STACKED PACKAGING USING RECONSTITUTED WAFERS

INTEGRATION OF CHIPS AND SILICON-BASED TRENCH CAPACITORS USING LOW...

FLEXIBLE ROUTING FOR CHIP ON BOARD APPLICATIONS

DIE DOWN INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SPREADER A...

Semiconductor Package with Interposer

Semiconductor Package Including a Substrate and an Interposer

Semiconductor Package Including Interposer with Through-Semiconduct...