Richard A. Faust

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation resistant barrier metal process for semiconductor devices
- Patent number 10,665,543
- Issue date May 26, 2020
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation resistant barrier metal process for semiconductor devices
- Patent number 10,008,450
- Issue date Jun 26, 2018
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation resistant barrier metal process for semiconductor devices
- Patent number 9,704,804
- Issue date Jul 11, 2017
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple depth vias in an integrated circuit
- Patent number 9,455,312
- Issue date Sep 27, 2016
- Texas Instruments Incorporated
- Kaiping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple depth vias in an integrated circuit
- Patent number 9,230,887
- Issue date Jan 5, 2016
- Texas Instruments Incorporated
- Kaiping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation process to prevent TiW corrosion
- Patent number 9,082,649
- Issue date Jul 14, 2015
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple depth vias in an integrated circuit
- Patent number 8,980,723
- Issue date Mar 17, 2015
- Texas Instruments Incorporated
- Kaiping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating metal-bearing integrated circuit structures h...
- Patent number 8,258,041
- Issue date Sep 4, 2012
- Texas Instruments Incorporated
- Srinivas Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ co-deposition of Si in diffusion barrier material depositio...
- Patent number 7,655,555
- Issue date Feb 2, 2010
- Texas Instruments Incorporated
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively encased surface metal structures in a semiconductor device
- Patent number 7,215,000
- Issue date May 8, 2007
- Texas Instruments Incorporated
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for providing improved layer adhesion in a semiconductor de...
- Patent number 6,927,159
- Issue date Aug 9, 2005
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with silicon-carbon-oxygen dielectric having i...
- Patent number 6,720,255
- Issue date Apr 13, 2004
- Texas Instruments Incorporated
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Si-rich surface layer capped diffusion barriers
- Patent number 6,680,249
- Issue date Jan 20, 2004
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES
- Publication number 20180308802
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Conditioning And Material Modification In A Semiconductor D...
- Publication number 20170345780
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Murlidhar Bashyam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES
- Publication number 20170271269
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES
- Publication number 20170179033
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Depth Vias In an Integrated Circuit
- Publication number 20160079343
- Publication date Mar 17, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Kaiping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEPTH VIAS IN AN INTEGRATED CIRCUIT
- Publication number 20150170999
- Publication date Jun 18, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Kaiping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION PROCESS TO PREVENT TIW CORROSION
- Publication number 20150145125
- Publication date May 28, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION ASH/OXIDATION OF BARE COPPER
- Publication number 20150147881
- Publication date May 28, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Jennifer Jean McComb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple Depth Vias In An Integrated Circuit
- Publication number 20130334659
- Publication date Dec 19, 2013
- Kaiping LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING METAL-BEARING INTEGRATED CIRCUIT STRUCTURES H...
- Publication number 20110306207
- Publication date Dec 15, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Srinivas Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature Surface Preparation for Removal of Organometallic P...
- Publication number 20110053372
- Publication date Mar 3, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Srinivas Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING ELECTROMIGRATION LIFETIME FOR CU INTERCONNECT...
- Publication number 20090170305
- Publication date Jul 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURED USING AN ELECTROCHEMICAL DEPOSITI...
- Publication number 20080111237
- Publication date May 15, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Montray Cantrell Leavy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Selectively encased surface metal structures in a semiconductor device
- Publication number 20060038295
- Publication date Feb 23, 2006
- Texas Instruments, Incorporated
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for providing improved layer adhesion in a semiconductor de...
- Publication number 20040241979
- Publication date Dec 2, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving adhesion between layers in integ...
- Publication number 20030207562
- Publication date Nov 6, 2003
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Si-rich surface layer capped diffusion barriers
- Publication number 20020192950
- Publication date Dec 19, 2002
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Si-rich surface layer capped diffusion barriers
- Publication number 20020180044
- Publication date Dec 5, 2002
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving barrier properties of refractory metals/metal...
- Publication number 20020072227
- Publication date Jun 13, 2002
- Noel Russell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ co-deposition of Si iN diffusion barrier material depositio...
- Publication number 20020001944
- Publication date Jan 3, 2002
- Richard A. Faust
- H01 - BASIC ELECTRIC ELEMENTS

Richard A. Faust

Person

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Oxidation resistant barrier metal process for semiconductor devices

Oxidation resistant barrier metal process for semiconductor devices

Oxidation resistant barrier metal process for semiconductor devices

Multiple depth vias in an integrated circuit

Multiple depth vias in an integrated circuit

Passivation process to prevent TiW corrosion

Multiple depth vias in an integrated circuit

Method of fabricating metal-bearing integrated circuit structures h...

In-situ co-deposition of Si in diffusion barrier material depositio...

Selectively encased surface metal structures in a semiconductor device

Methods for providing improved layer adhesion in a semiconductor de...

Semiconductor device with silicon-carbon-oxygen dielectric having i...

Si-rich surface layer capped diffusion barriers

Patents Applicationslast 30 patents

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES

Surface Conditioning And Material Modification In A Semiconductor D...

OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES

OXIDATION RESISTANT BARRIER METAL PROCESS FOR SEMICONDUCTOR DEVICES

Multiple Depth Vias In an Integrated Circuit

MULTIPLE DEPTH VIAS IN AN INTEGRATED CIRCUIT

PASSIVATION PROCESS TO PREVENT TIW CORROSION

PASSIVATION ASH/OXIDATION OF BARE COPPER

Multiple Depth Vias In An Integrated Circuit

METHOD OF FABRICATING METAL-BEARING INTEGRATED CIRCUIT STRUCTURES H...

Low Temperature Surface Preparation for Removal of Organometallic P...

METHOD FOR IMPROVING ELECTROMIGRATION LIFETIME FOR CU INTERCONNECT...

SEMICONDUCTOR DEVICE MANUFACTURED USING AN ELECTROCHEMICAL DEPOSITI...

Selectively encased surface metal structures in a semiconductor device

Methods for providing improved layer adhesion in a semiconductor de...

Method and apparatus for improving adhesion between layers in integ...

Si-rich surface layer capped diffusion barriers

Si-rich surface layer capped diffusion barriers

Method for improving barrier properties of refractory metals/metal...

In-situ co-deposition of Si iN diffusion barrier material depositio...