Richard F. Indyk

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Spacer for die-to-die communication in an integrated circuit and me...
- Patent number 11,521,952
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polygon integrated circuit (IC) packaging
- Patent number 11,410,894
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spacer for die-to-die communication in an integrated circuit
- Patent number 11,031,373
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fins for enhanced die communication
- Patent number 11,031,343
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge trim processes and resultant structures
- Patent number 10,134,577
- Issue date Nov 20, 2018
- GLOBALFOUNDRIES Inc.
- Richard F. Indyk
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dicing channels for glass interposers
- Patent number 10,090,255
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Brittany L. Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for establishing interconnects in packages using thin int...
- Patent number 10,002,835
- Issue date Jun 19, 2018
- GLOBALFOUNDRIES Inc.
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for establishing interconnects in packages using thin interp...
- Patent number 9,607,973
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing employing edge region underfill removal
- Patent number 8,652,941
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High tin solder etching solution
- Patent number 7,897,059
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Richard F. Indyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,724,527
- Issue date May 25, 2010
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to improve thermal dissipation from semiconduc...
- Patent number 7,468,886
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package repair process
- Patent number 7,294,909
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to produce low strength temporary solder joints
- Patent number 7,087,513
- Issue date Aug 8, 2006
- International Business Machines Corporation
- Benjamin V. Fasano
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus to form a reworkable seal on an electronic module
- Patent number 6,955,543
- Issue date Oct 18, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package repair process
- Patent number 6,916,670
- Issue date Jul 12, 2005
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to produce pedestal features in constrained sintered substrates
- Patent number 6,835,260
- Issue date Dec 28, 2004
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of selective plating on a substrate
- Patent number 6,823,585
- Issue date Nov 30, 2004
- International Business Machines Corporation
- Mark J. LaPlante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming defect-free ceramic structures using thermally de...
- Patent number 6,597,058
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface metallization structure for multiple chip test and burn-in
- Patent number 6,376,054
- Issue date Apr 23, 2002
- International Business Machines Corporation
- Scott I. Langenthal
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,312,791
- Issue date Nov 6, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming defect-free ceramic structures using thermally de...
- Patent number 6,261,927
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Govindarajan Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for increasing the strength of crystalline cer...
- Patent number 6,258,191
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,187,418
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing ceramic surfaces with easily removable contact...
- Patent number 6,139,666
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic substrate having a sealed layer
- Patent number 6,136,419
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of making a multilayer ceramic substrate having reduced stress
- Patent number 5,755,903
- Issue date May 26, 1998
- International Business Machines Corporation
- John J. Garant
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Structure to reduce stress in multilayer ceramic substrates
- Patent number 5,700,549
- Issue date Dec 23, 1997
- International Business Machines Corporation
- John J. Garant
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Screenable paste for use as a barrier layer on a substrate during m...
- Patent number 4,663,186
- Issue date May 5, 1987
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20210175207
- Publication date Jun 10, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20210074599
- Publication date Mar 11, 2021
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINS FOR ENHANCED DIE COMMUNICATION
- Publication number 20200402912
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
- Publication number 20200312812
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING CHANNELS FOR GLASS INTERPOSERS
- Publication number 20170221837
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES Inc.
- Brittany L. Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USI...
- Publication number 20170148737
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Benjamin V. FASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE TRIM PROCESSES AND RESULTANT STRUCTURES
- Publication number 20160343564
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Richard F. INDYK
- B32 - LAYERED PRODUCTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20150001714
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20140151879
- Publication date Jun 5, 2014
- Disco Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
- Publication number 20130149841
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TIN SOLDER ETCHING SOLUTION
- Publication number 20090120999
- Publication date May 14, 2009
- International Business Machines Corporation
- Richard F. Indyk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080310117
- Publication date Dec 18, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...
- Publication number 20080218971
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENTS FOR UNDERFILL CONTROL
- Publication number 20070099346
- Publication date May 3, 2007
- International Business Machines Corporation
- Mukta Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PRODUCE LOW STRENGTH TEMPORARY SOLDER JOINTS
- Publication number 20060088997
- Publication date Apr 27, 2006
- International Business Machines Corporation
- Benjamin V. Fasano
- G01 - MEASURING TESTING
Information Patent Application
Temporary chip attach method using reworkable conductive adhesive i...
- Publication number 20060014309
- Publication date Jan 19, 2006
- Krishna Gandhi Sachdev
- G01 - MEASURING TESTING
Information Patent Application
Electronic package repair process
- Publication number 20050176255
- Publication date Aug 11, 2005
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE
- Publication number 20050037640
- Publication date Feb 17, 2005
- International Business Machines Corporation
- Gaetano P. Messina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective plating using dual lift-off mask
- Publication number 20040187303
- Publication date Sep 30, 2004
- International Business Machines Corporation
- Mark J. LaPlante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package repair process
- Publication number 20040148765
- Publication date Aug 5, 2004
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method to produce pedestal features in constrained sintered substrates
- Publication number 20040065401
- Publication date Apr 8, 2004
- International Business Machines Corporation
- Benjamin V. Fasano
- B32 - LAYERED PRODUCTS

Richard F. Indyk

Person

Patents Grantslast 30 patents

Spacer for die-to-die communication in an integrated circuit and me...

Polygon integrated circuit (IC) packaging

Spacer for die-to-die communication in an integrated circuit

Fins for enhanced die communication

Edge trim processes and resultant structures

Dicing channels for glass interposers

Structure for establishing interconnects in packages using thin int...

Method for establishing interconnects in packages using thin interp...

Wafer dicing employing edge region underfill removal

High tin solder etching solution

Method and structure to improve thermal dissipation from semiconduc...

Method and structure to improve thermal dissipation from semiconduc...

Electronic package repair process

Method to produce low strength temporary solder joints

Method and apparatus to form a reworkable seal on an electronic module

Electronic package repair process

Method to produce pedestal features in constrained sintered substrates

Method of selective plating on a substrate

Method of forming defect-free ceramic structures using thermally de...

Surface metallization structure for multiple chip test and burn-in

Multilayer ceramic substrate with anchored pad

Method of forming defect-free ceramic structures using thermally de...

Method and materials for increasing the strength of crystalline cer...

Multilayer ceramic substrate with anchored pad

Method for producing ceramic surfaces with easily removable contact...

Ceramic substrate having a sealed layer

Method of making a multilayer ceramic substrate having reduced stress

Structure to reduce stress in multilayer ceramic substrates

Screenable paste for use as a barrier layer on a substrate during m...

Patents Applicationslast 30 patents

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

POLYGON INTEGRATED CIRCUIT (IC) PACKAGING

FINS FOR ENHANCED DIE COMMUNICATION

SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT

DICING CHANNELS FOR GLASS INTERPOSERS

METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USI...

EDGE TRIM PROCESSES AND RESULTANT STRUCTURES

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL

HIGH TIN SOLDER ETCHING SOLUTION

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUC...

SURFACE TREATMENTS FOR UNDERFILL CONTROL

METHOD TO PRODUCE LOW STRENGTH TEMPORARY SOLDER JOINTS

Temporary chip attach method using reworkable conductive adhesive i...

Electronic package repair process

METHOD AND APPARATUS TO FORM A REWORKABLE SEAL ON AN ELECTRONIC MODULE

Selective plating using dual lift-off mask

Electronic package repair process

Method to produce pedestal features in constrained sintered substrates