Number | Name | Date | Kind |
---|---|---|---|
5093186 | Kimura et al. | Mar 1992 | |
5130498 | Yoshida et al. | Jul 1992 | |
5293503 | Nishigoori | Mar 1994 | |
5354599 | McClanahan et al. | Oct 1994 | |
5451720 | Estes et al. | Sep 1995 | |
5453913 | Koyanagi | Sep 1995 |
Entry |
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IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977 "Dummy Pads For Increased Creep Resistance". |
IBM Technical Disclosure Bulletin, vol. 20, No. 11B, Apr. 1978, "Via Design Minimize Stress Levels In Multilayer Ceramic Substrates". |