Claims
- 1. An unsintered structure comprising at least one semiconductor substrate having at least one metallized feature and at least a portion of at least one thermally depolymerizable/decomposable layer conformably secured to a portion of said metallized feature and said at least one semiconductor substrate, wherein material for said depolymerizable/decomposable layer is selected from a group consisting of poly(ethyl methacrylate-co-methyl acrylate-co-butyl methacrylate), poly(methyl acrylate-co-methacrylic acid-co-ethyl methacrylate), poly(ethyl methacrylate-methacrylic acid-co-methacrylate), poly(fluorobutyl methacrylate), and poly(ethyl acrylate-co-ethyl methacrylate-co-methacrylic acid).
- 2. The unsintered structure of claim 1, wherein said semiconductor substrate is selected from a group consisting of ceramic substrate, multi-layer ceramic substrate and glass ceramic substrate.
- 3. The unsintered structure of claim 1, wherein said thermally depolymerizable/decomposable layer is flexible, moldable with glass transition temperature below about 75° C. and has an elongation-at-break (% Eb) above about 150 percent.
- 4. The unsintered structure of claim 1, wherein said unsintered structure has at least one alignment hole.
- 5. The unsintered structure of claim 1, wherein said unsintered structure has at least one alignment mark.
- 6. The unsintered structure of claim 1, wherein material for said unsintered structure is selected from a group consisting of alumina, alumina with glass frit, borosilicate glass, aluminum nitride, ceramic and glass ceramic.
- 7. The unsintered structure of claim 1, wherein said surface feature is selected from a group consisting of copper, molybdenum, nickel, tungsten, metal with glass frit, electrically conductive filler and electrically conductive polymer.
CROSS-REFERENCE TO RELATED PATENT APPLICATION
This Patent Application is a Divisional Patent Application of U.S. patent application Ser. No. 09/302,943 now U.S. Pat. No. 6,261,927, filed on Apr. 30, 1999.
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