Richard P. Sheridan

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge stack integrated circuit package system
- Patent number 7,994,619
- Issue date Aug 9, 2011
- Stats Chippac Ltd.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate fabrication method
- Patent number 7,501,338
- Issue date Mar 10, 2009
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded leadframe semiconductor package
- Patent number 7,190,062
- Issue date Mar 13, 2007
- Amkor Technology, Inc.
- Richard Peter Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a chip carrier package using laser ablation
- Patent number 6,660,559
- Issue date Dec 9, 2003
- Amkor Technology, Inc.
- Ronald P. Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20080111222
- Publication date May 15, 2008
- STATS ChipPAC Ltd.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS