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Richard S. Graf
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Falmouth, ME, US
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Patents Grants
last 30 patents
Information
Patent Grant
Heat sink configuration for multi-chip module
Patent number
11,810,832
Issue date
Nov 7, 2023
MARVELL ASIA PTE. LTD.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,682,646
Issue date
Jun 20, 2023
MARVELL ASIA PTE. LTD.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Enabling of functional logic in IC using thermal sequence enabling...
Patent number
11,366,154
Issue date
Jun 21, 2022
GLOBALFOUNDRIES U.S. INC.
Sebastian T. Ventrone
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
IC chip package with dummy solder structure under corner, and relat...
Patent number
11,171,104
Issue date
Nov 9, 2021
Marvell Asia Pte, Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Dual bond pad structure for photonics
Patent number
10,978,416
Issue date
Apr 13, 2021
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual bond pad structure for photonics
Patent number
10,833,038
Issue date
Nov 10, 2020
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
Patent number
10,734,346
Issue date
Aug 4, 2020
ELPIS TECHNOLOGIES INC.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tamper detection for a chip package
Patent number
10,651,135
Issue date
May 12, 2020
Marvell Asia Pte, Ltd.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual bond pad structure for photonics
Patent number
10,476,227
Issue date
Nov 12, 2019
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-on-chip structure and methods of manufacture
Patent number
10,340,241
Issue date
Jul 2, 2019
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Producing wafer level packaging using leadframe strip and related d...
Patent number
10,304,763
Issue date
May 28, 2019
GLOBALFOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked dies using one or more interposers
Patent number
10,249,590
Issue date
Apr 2, 2019
GLOBALFOUNDRIES Inc.
Sudeep Mandal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature fabrication of lateral thin film varistor
Patent number
10,170,224
Issue date
Jan 1, 2019
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory having thermoelectric heat pump and related IC chip package...
Patent number
10,083,891
Issue date
Sep 25, 2018
GLOBALFOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermoelectric cooling using through-silicon vias
Patent number
10,043,962
Issue date
Aug 7, 2018
GLOBALFOUNDRIES Inc.
Sudeep Mandal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional hybrid packaging with through-silicon-vias and ta...
Patent number
9,972,606
Issue date
May 15, 2018
GLOBALFOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit cooling using embedded peltier micro-vias in sub...
Patent number
9,941,458
Issue date
Apr 10, 2018
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass interposer with embedded thermoelectric devices
Patent number
9,913,405
Issue date
Mar 6, 2018
GLOBALFOUNDRIES Inc.
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Producing wafer level packaging using leadframe strip and related d...
Patent number
9,892,999
Issue date
Feb 13, 2018
GLOBALFOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature fabrication of lateral thin film varistor
Patent number
9,870,851
Issue date
Jan 16, 2018
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature fabrication of lateral thin film varistor
Patent number
9,865,674
Issue date
Jan 9, 2018
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor TSV device package to which other semiconductor devic...
Patent number
9,818,653
Issue date
Nov 14, 2017
International Business Machines Corporation
Richard Stephen Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC structure with angled interconnect elements
Patent number
9,754,911
Issue date
Sep 5, 2017
GLOBALFOUNDRIES Inc.
David J. West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional hybrid packaging with through-silicon-vias and ta...
Patent number
9,741,695
Issue date
Aug 22, 2017
GLOBALFOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor TSV device package to which other semiconductor devic...
Patent number
9,721,852
Issue date
Aug 1, 2017
International Business Machines Corporation
Richard Stephen Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for integrating thermal via structures in integrated cir...
Patent number
9,659,835
Issue date
May 23, 2017
GlobalFoundries Inc.
Jeffrey P. Gambino
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Dual bond pad structure for photonics
Patent number
9,608,403
Issue date
Mar 28, 2017
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a glass interposer with thermal vias
Patent number
9,585,257
Issue date
Feb 28, 2017
GLOBALFOUNDRIES Inc.
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor TSV device package for circuit board connection
Patent number
9,570,422
Issue date
Feb 14, 2017
International Business Machines Corporation
David J. West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit cooling using embedded peltier micro-vias in sub...
Patent number
9,559,283
Issue date
Jan 31, 2017
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Three-Dimensional Device Package with Vertical Heat Pipes
Publication number
20230260871
Publication date
Aug 17, 2023
Marvell Asia Pte Ltd.
Janak G. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER RING FOR PACKAGES WITH MICRO-CABLE/OPTICAL CONNECTORS
Publication number
20230197635
Publication date
Jun 22, 2023
Marvell Asia Pte Ltd.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
heat dissipation and electrical robustness in a three-dimensional p...
Publication number
20230035100
Publication date
Feb 2, 2023
Marvell Asia Pte Ltd.
Janak G. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CARRIER STACKED PACKAGE ASSEMBLY METHOD
Publication number
20220270909
Publication date
Aug 25, 2022
Marvell Asia Pte Ltd.
Richard Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
Publication number
20220059488
Publication date
Feb 24, 2022
Marvell Asia Pte, Ltd.
Manish NAYINI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Packaging stacked substrates and an integrated circuit die using a...
Publication number
20220051963
Publication date
Feb 17, 2022
Marvell Asia Pte Ltd.
Luke England
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat Sink Configuration for Multi-Chip Module
Publication number
20210407879
Publication date
Dec 30, 2021
Marvell Asia Pte, Ltd.
Janak PATEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP PACKAGE WITH DUMMY SOLDER STRUCTURE UNDER CORNER, AND RELAT...
Publication number
20210125952
Publication date
Apr 29, 2021
Marvell International Ltd.
Manish Nayini
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ENABLING OF FUNCTIONAL LOGIC IN IC USING THERMAL SEQUENCE ENABLING...
Publication number
20210033660
Publication date
Feb 4, 2021
GLOBALFOUNDRIES INC.
Sebastian T. Ventrone
G01 - MEASURING TESTING
Information
Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
Publication number
20200014171
Publication date
Jan 9, 2020
International Business Machines Corporation
Jeffrey P. GAMBINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
Publication number
20190244926
Publication date
Aug 8, 2019
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
Publication number
20190148328
Publication date
May 16, 2019
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES USING ONE OR MORE INTERPOSERS
Publication number
20180350684
Publication date
Dec 6, 2018
GLOBALFOUNDRIES INC.
SUDEEP MANDAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRODUCING WAFER LEVEL PACKAGING USING LEADFRAME STRIP AND RELATED D...
Publication number
20180122730
Publication date
May 3, 2018
GLOBALFOUNDRIES INC.
Richard S. GRAF
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE FABRICATION OF LATERAL THIN FILM VARISTOR
Publication number
20180096760
Publication date
Apr 5, 2018
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAMPER DETECTION FOR A CHIP PACKAGE
Publication number
20170373024
Publication date
Dec 28, 2017
GLOBALFOUNDRIES INC.
Richard S. Graf
G01 - MEASURING TESTING
Information
Patent Application
PRODUCING WAFER LEVEL PACKAGING USING LEADFRAME STRIP AND RELATED D...
Publication number
20170352611
Publication date
Dec 7, 2017
GLOBALFOUNDRIES Inc.
Richard S. GRAF
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOELECTRIC COOLING USING THROUGH-SILICON VIAS
Publication number
20170324015
Publication date
Nov 9, 2017
GLOBALFOUNDRIES INC.
Sudeep Mandal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND...
Publication number
20170271285
Publication date
Sep 21, 2017
GLOBALFOUNDRIES INC.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...
Publication number
20170271309
Publication date
Sep 21, 2017
GLOBALFOUNDRIES INC.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TA...
Publication number
20170200698
Publication date
Jul 13, 2017
GLOBAL FOUNDRIES Inc.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
Publication number
20170125973
Publication date
May 4, 2017
International Business Machines Corporation
Jeffrey P. GAMBINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
Publication number
20170125974
Publication date
May 4, 2017
International Business Machines Corporation
Jeffrey P. GAMBINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE FABRICATION OF LATERAL THIN FILM VARISTOR
Publication number
20170104054
Publication date
Apr 13, 2017
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC STRUCTURE WITH ANGLED INTERCONNECT ELEMENTS
Publication number
20170098623
Publication date
Apr 6, 2017
GLOBALFOUNDRIES INC.
David J. West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
Publication number
20160365328
Publication date
Dec 15, 2016
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
Publication number
20160365329
Publication date
Dec 15, 2016
International Business Machines Corporation
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT COOLING USING EMBEDDED PELTIER MICRO-VIAS IN SUB...
Publication number
20160293822
Publication date
Oct 6, 2016
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT COOLING USING EMBEDDED PELTIER MICRO-VIAS IN SUB...
Publication number
20160293825
Publication date
Oct 6, 2016
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS INTERPOSER WITH THERMAL VIAS
Publication number
20160286660
Publication date
Sep 29, 2016
International Business Machines Corporation
Jeffrey P. Gambino
H01 - BASIC ELECTRIC ELEMENTS