Richard W. Wensel

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transfer mold semiconductor packaging processes
- Patent number 7,384,805
- Issue date Jun 10, 2008
- Micron Technology, Inc.
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer mold semiconductor packaging processes
- Patent number 7,148,083
- Issue date Dec 12, 2006
- Micron Technology, Inc.
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrates, semiconductor packages, and ball grid arrays
- Patent number 7,095,115
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with attached heat sink and transfer mold
- Patent number 7,061,082
- Issue date Jun 13, 2006
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component assemblies having exposed contacts
- Patent number 6,921,860
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Darin L. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for transfer molding encapsulation of a semiconductor die w...
- Patent number 6,869,811
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate area relief strip for a molded I/C package
- Patent number 6,734,372
- Issue date May 11, 2004
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of residual organic compounds to facilitate gate break on a car...
- Patent number 6,707,165
- Issue date Mar 16, 2004
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate and carrier assembly using residual organic compo...
- Patent number 6,677,681
- Issue date Jan 13, 2004
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-board assemblies, carrier assemblies and carrier substrates...
- Patent number 6,664,646
- Issue date Dec 16, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with attached heat sink and transfer mold
- Patent number 6,583,504
- Issue date Jun 24, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for application of spray adhesive to a leadfra...
- Patent number 6,576,057
- Issue date Jun 10, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chip and method of making same
- Patent number 6,555,412
- Issue date Apr 29, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam structure for center-bonded chip package
- Patent number 6,555,898
- Issue date Apr 29, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of an oxide surface to facilitate gate break on a carrier subst...
- Patent number 6,545,368
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of residual organic compounds to facilitate gate break on a car...
- Patent number 6,524,960
- Issue date Feb 25, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of residual organic compounds to facilitate gate break on a car...
- Patent number 6,518,186
- Issue date Feb 11, 2003
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for application of spray adhesive to a leadfra...
- Patent number 6,486,004
- Issue date Nov 26, 2002
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate area relief strip for a molded I/C package
- Patent number 6,473,311
- Issue date Oct 29, 2002
- Micro Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing BGA warpage caused by encapsulation
- Patent number 6,444,497
- Issue date Sep 3, 2002
- Micron Technology, Inc.
- Richard Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing contaminants on electronic devices
- Patent number 6,417,028
- Issue date Jul 9, 2002
- Micron Technology, Inc.
- Richard W. Wensel
- B08 - CLEANING
Information Patent Grant
Method and apparatus for transfer molding encapsulation of a semico...
- Patent number 6,403,387
- Issue date Jun 11, 2002
- Micron Technology
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of oxide surface to facilitate gate break on a carrier substrat...
- Patent number 6,404,069
- Issue date Jun 11, 2002
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing BGA warpage caused by encapsulation
- Patent number 6,387,731
- Issue date May 14, 2002
- Micron Technology, Inc.
- Richard Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with attached heat sink and transfer mold
- Patent number 6,373,132
- Issue date Apr 16, 2002
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device utilizing a residual o...
- Patent number 6,316,290
- Issue date Nov 13, 2001
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing BGA warpage caused by encapsulation
- Patent number 6,291,899
- Issue date Sep 18, 2001
- Micron Technology, Inc.
- Richard Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of an oxide surface to facilitate gate break on a carrier subst...
- Patent number 6,251,702
- Issue date Jun 26, 2001
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated transfer molding of a semiconductor die with attached...
- Patent number 6,249,050
- Issue date Jun 19, 2001
- Micron Technology, Inc.
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing contaminants on electronic devices
- Patent number 6,230,719
- Issue date May 15, 2001
- Micron Technology, Inc.
- Richard W. Wensel
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Transfer mold semiconductor packaging processes, circuit substrates...
- Publication number 20050101061
- Publication date May 12, 2005
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT ASSEMBLIES HAVING EXPOSED CONTACTS
- Publication number 20040188123
- Publication date Sep 30, 2004
- Darin L. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrates, semiconductor packages, and ball grid arrays
- Publication number 20040097011
- Publication date May 20, 2004
- Micron Technology, Inc.
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for transfer molding encapsulation of a semiconductor die w...
- Publication number 20040033644
- Publication date Feb 19, 2004
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die with attached heat sink and transfer mold
- Publication number 20040004274
- Publication date Jan 8, 2004
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATES, SEMICONDUCTOR PACKAGES, AND BALL GRID ARRAYS
- Publication number 20030205828
- Publication date Nov 6, 2003
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer mold semiconductor packaging processes
- Publication number 20030104657
- Publication date Jun 5, 2003
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate area relief strip for a molded I/C package
- Publication number 20020166695
- Publication date Nov 14, 2002
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of residual organic compounds to facilitate gate break on a car...
- Publication number 20020151176
- Publication date Oct 17, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer mold semiconductor packaging processes, circuit substrates...
- Publication number 20020145208
- Publication date Oct 10, 2002
- Larry Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of residual organic compounds to facilitate gate break on a car...
- Publication number 20020142602
- Publication date Oct 3, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of an oxide surface to facilitate gate break on a carrier subst...
- Publication number 20020117763
- Publication date Aug 29, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die with attached heat sink and transfer mold
- Publication number 20020074648
- Publication date Jun 20, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for transfer molding encapsulation of a semico...
- Publication number 20020076856
- Publication date Jun 20, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of residual organic compounds to facilitate gate break on a car...
- Publication number 20020038915
- Publication date Apr 4, 2002
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for reducing BGA warpage caused by encapsulation
- Publication number 20020019080
- Publication date Feb 14, 2002
- Micron Technology, Inc.
- Richard Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of residual organic compounds to facilitate gate break on a car...
- Publication number 20010039120
- Publication date Nov 8, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged semiconductor chip and method of making same
- Publication number 20010038141
- Publication date Nov 8, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for removing contaminants on electronic devices
- Publication number 20010032706
- Publication date Oct 25, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated transfer molding of a semiconductor die with attached...
- Publication number 20010013649
- Publication date Aug 16, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for removing contaminants on electronic devices
- Publication number 20010012681
- Publication date Aug 9, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of oxide surface to facilitate gate break on a carrier substrat...
- Publication number 20010010409
- Publication date Aug 2, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for application of spray adhesive to a leadfra...
- Publication number 20010006041
- Publication date Jul 5, 2001
- Richard W. Wensel
- H01 - BASIC ELECTRIC ELEMENTS

Richard W. Wensel

Person

Patents Grantslast 30 patents

Transfer mold semiconductor packaging processes

Transfer mold semiconductor packaging processes

Circuit substrates, semiconductor packages, and ball grid arrays

Semiconductor die with attached heat sink and transfer mold

Microelectronic component assemblies having exposed contacts

Methods for transfer molding encapsulation of a semiconductor die w...

Gate area relief strip for a molded I/C package

Use of residual organic compounds to facilitate gate break on a car...

Carrier substrate and carrier assembly using residual organic compo...

Chip-on-board assemblies, carrier assemblies and carrier substrates...

Semiconductor die with attached heat sink and transfer mold

Method and apparatus for application of spray adhesive to a leadfra...

Packaged semiconductor chip and method of making same

Dam structure for center-bonded chip package

Use of an oxide surface to facilitate gate break on a carrier subst...

Use of residual organic compounds to facilitate gate break on a car...

Use of residual organic compounds to facilitate gate break on a car...

Method and apparatus for application of spray adhesive to a leadfra...

Gate area relief strip for a molded I/C package

Method and apparatus for reducing BGA warpage caused by encapsulation

Method and apparatus for removing contaminants on electronic devices

Method and apparatus for transfer molding encapsulation of a semico...

Use of oxide surface to facilitate gate break on a carrier substrat...

Method and apparatus for reducing BGA warpage caused by encapsulation

Semiconductor die with attached heat sink and transfer mold

Method of fabricating a semiconductor device utilizing a residual o...

Method and apparatus for reducing BGA warpage caused by encapsulation

Use of an oxide surface to facilitate gate break on a carrier subst...

Encapsulated transfer molding of a semiconductor die with attached...

Apparatus for removing contaminants on electronic devices

Patents Applicationslast 30 patents

Transfer mold semiconductor packaging processes, circuit substrates...

MICROELECTRONIC COMPONENT ASSEMBLIES HAVING EXPOSED CONTACTS

Circuit substrates, semiconductor packages, and ball grid arrays

Methods for transfer molding encapsulation of a semiconductor die w...

Semiconductor die with attached heat sink and transfer mold

CIRCUIT SUBSTRATES, SEMICONDUCTOR PACKAGES, AND BALL GRID ARRAYS

Transfer mold semiconductor packaging processes

Gate area relief strip for a molded I/C package

Use of residual organic compounds to facilitate gate break on a car...

Transfer mold semiconductor packaging processes, circuit substrates...

Use of residual organic compounds to facilitate gate break on a car...

Use of an oxide surface to facilitate gate break on a carrier subst...

Semiconductor die with attached heat sink and transfer mold

Method and apparatus for transfer molding encapsulation of a semico...

Use of residual organic compounds to facilitate gate break on a car...

Method and apparatus for reducing BGA warpage caused by encapsulation

Use of residual organic compounds to facilitate gate break on a car...

Packaged semiconductor chip and method of making same

Method and apparatus for removing contaminants on electronic devices

Encapsulated transfer molding of a semiconductor die with attached...

Method and apparatus for removing contaminants on electronic devices

Use of oxide surface to facilitate gate break on a carrier substrat...

Method and apparatus for application of spray adhesive to a leadfra...