Risto Ilkka Tuominen

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 11,177,204
- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package for light emitting semiconductor devices and me...
- Patent number 10,957,832
- Issue date Mar 23, 2021
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,892,231
- Issue date Jan 12, 2021
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,115
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,116
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,553,556
- Issue date Feb 4, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,541,153
- Issue date Jan 21, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,541,209
- Issue date Jan 21, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 10,453,786
- Issue date Oct 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronics package using device-last or...
- Patent number 10,332,832
- Issue date Jun 25, 2019
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,312,194
- Issue date Jun 4, 2019
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with pre-defined via patterns and methods of ma...
- Patent number 10,141,251
- Issue date Nov 27, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 9,966,371
- Issue date May 8, 2018
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 9,966,361
- Issue date May 8, 2018
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONICS PACKAGE FOR LIGHT EMITTING SEMICONDUCTOR DEVICES AND ME...
- Publication number 20200127178
- Publication date Apr 23, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20200066544
- Publication date Feb 27, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20200066652
- Publication date Feb 27, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190311981
- Publication date Oct 10, 2019
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FU...
- Publication number 20190043794
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20190043733
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20190043810
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20190043734
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONICS PACKAGE USING DEVICE-LAST OR...
- Publication number 20190043802
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180247924
- Publication date Aug 30, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180240779
- Publication date Aug 23, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130747
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130783
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130732
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130770
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130731
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE BACKSIDE DEVICES AND METHODS OF FABRICATION THEREOF
- Publication number 20170373011
- Publication date Dec 28, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20170207160
- Publication date Jul 20, 2017
- General Electronic Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...
- Publication number 20160183376
- Publication date Jun 23, 2016
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Risto Ilkka Tuominen

Person

Patents Grantslast 30 patents

Power electronics package and method of manufacturing thereof

Electronics package for light emitting semiconductor devices and me...

Electronics package including integrated electromagnetic interferen...

Electronics package with integrated interconnect structure and meth...

Electronics package with integrated interconnect structure and meth...

Electronics package having a multi-thickness conductor layer and me...

Stacked electronics package and method of manufacturing thereof

Electronics package having a multi-thickness conductor layer and me...

Electronics package with integrated interconnect structure and meth...

Electronics package including integrated electromagnetic interferen...

Power electronics package and method of manufacturing thereof

Method of manufacturing an electronics package using device-last or...

Stacked electronics package and method of manufacturing thereof

Electronic packages with pre-defined via patterns and methods of ma...

Electronics package having a multi-thickness conductor layer and me...

Electronics package having a multi-thickness conductor layer and me...

Patents Applicationslast 30 patents

ELECTRONICS PACKAGE FOR LIGHT EMITTING SEMICONDUCTOR DEVICES AND ME...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FU...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

METHOD OF MANUFACTURING AN ELECTRONICS PACKAGE USING DEVICE-LAST OR...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

SEMICONDUCTOR DIE BACKSIDE DEVICES AND METHODS OF FABRICATION THEREOF

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...