Rizza Lee Saga Cizek

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Brentwood, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bond support structure and microelectronic package including w...
- Patent number 9,947,641
- Issue date Apr 17, 2018
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,087,815
- Issue date Jul 21, 2015
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND SUPPORT STRUCTURE AND MICROELECTRONIC PACKAGE INCLUDING W...
- Publication number 20160329308
- Publication date Nov 10, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20150129646
- Publication date May 14, 2015
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS