Robert Charles Dry

Person

Oak Ridge, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 12,087,656
- Issue date Sep 10, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 11,637,050
- Issue date Apr 25, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with floating heat spreader and process for m...
- Patent number 11,244,884
- Issue date Feb 8, 2022
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package arrangements and related methods
- Patent number 11,114,363
- Issue date Sep 7, 2021
- Qorvo US, Inc.
- Deepukumar M. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-cavity semiconductor package with low cost high thermal carrier
- Patent number 10,872,837
- Issue date Dec 22, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for spatial power-combining devices
- Patent number 10,855,240
- Issue date Dec 1, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,832,984
- Issue date Nov 10, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with floating heat spreader and process for m...
- Patent number 10,734,301
- Issue date Aug 4, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,651,103
- Issue date May 12, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,615,091
- Issue date Apr 7, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring-frame power package
- Patent number 10,199,313
- Issue date Feb 5, 2019
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package lid
- Patent number 10,008,473
- Issue date Jun 26, 2018
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring-frame power package
- Patent number 9,666,498
- Issue date May 30, 2017
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power module with improved isolation and thermal conduct...
- Patent number 9,536,803
- Issue date Jan 3, 2017
- Qorvo US, Inc.
- David Charles Sheridan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20230298958
- Publication date Sep 21, 2023
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20220319945
- Publication date Oct 6, 2022
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CAVITY SEMICONDUCTOR PACKAGE WITH LOW COST HIGH THERMAL CARRIER
- Publication number 20200357716
- Publication date Nov 12, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...
- Publication number 20200343157
- Publication date Oct 29, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ARRANGEMENTS AND RELATED METHODS
- Publication number 20200203248
- Publication date Jun 25, 2020
- Qorvo US, Inc.
- Deepukumar M. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES
- Publication number 20200162046
- Publication date May 21, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...
- Publication number 20200152533
- Publication date May 14, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...
- Publication number 20200083136
- Publication date Mar 12, 2020
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...
- Publication number 20180122716
- Publication date May 3, 2018
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING-FRAME POWER PACKAGE
- Publication number 20170358524
- Publication date Dec 14, 2017
- Qorvo US, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE LID
- Publication number 20160240511
- Publication date Aug 18, 2016
- TriQuint Semiconductor, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER MODULE WITH IMPROVED ISOLATION AND THERMAL CONDUCT...
- Publication number 20160071781
- Publication date Mar 10, 2016
- RF Micro Devices, Inc.
- David Charles Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RING-FRAME POWER PACKAGE
- Publication number 20150348897
- Publication date Dec 3, 2015
- RF Micro Devices, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS

Robert Charles Dry

Person

Patents Grantslast 30 patents

Package architecture utilizing wafer to wafer bonding

Package architecture utilizing wafer to wafer bonding

Semiconductor package with floating heat spreader and process for m...

Electronic package arrangements and related methods

Air-cavity semiconductor package with low cost high thermal carrier

Structures for spatial power-combining devices

Environmental protection for wafer level and package level applicat...

Semiconductor package with floating heat spreader and process for m...

Environmental protection for wafer level and package level applicat...

Environmental protection for wafer level and package level applicat...

Ring-frame power package

Power package lid

Ring-frame power package

Integrated power module with improved isolation and thermal conduct...

Patents Applicationslast 30 patents

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

AIR-CAVITY SEMICONDUCTOR PACKAGE WITH LOW COST HIGH THERMAL CARRIER

SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...

ELECTRONIC PACKAGE ARRANGEMENTS AND RELATED METHODS

STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES

ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...

SEMICONDUCTOR PACKAGE WITH FLOATING HEAT SPREADER AND PROCESS FOR M...

ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...

RING-FRAME POWER PACKAGE

POWER PACKAGE LID

INTEGRATED POWER MODULE WITH IMPROVED ISOLATION AND THERMAL CONDUCT...

RING-FRAME POWER PACKAGE