Robert L. Duffin

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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Structure and method for metallization of semiconductor devices
- Patent number 5,700,721
- Issue date Dec 23, 1997
- Motorola, Inc.
- Hank Hukyoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for metallization of semiconductor devices
- Patent number 5,554,889
- Issue date Sep 10, 1996
- Motorola, Inc.
- Hank H. Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple step metallization process
- Patent number 4,970,176
- Issue date Nov 13, 1990
- Motorola, Inc.
- Clarence J. Tracy
- H01 - BASIC ELECTRIC ELEMENTS