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Robert M. Smith

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  • Jericho, VT, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    QUAD FLAT NO-LEAD CHIP CARRIER WITH STANDOFF
    • Publication number 20080265396
    • Publication date Oct 30, 2008
    • International Business Machines Corporation
    • John J. Maloney
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF
    • Publication number 20080203546
    • Publication date Aug 28, 2008
    • International Business Machines Corporation
    • John J. Maloney
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Method and structure for improving the reliability of leadframe int...
    • Publication number 20070278629
    • Publication date Dec 6, 2007
    • International Business Machines Corporation
    • Robert M. Smith
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Quad flat no-lead chip carrier with stand-off
    • Publication number 20070273017
    • Publication date Nov 29, 2007
    • International Business Machines Corporation
    • John J. Maloney
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Ultra mold for encapsulating very thin packages
    • Publication number 20010030382
    • Publication date Oct 18, 2001
    • International Business Machines Corporation
    • John J. Lajza
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL