Robin A. Susko

Person

Owego, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sandwiched organic LGA structure
- Patent number 7,795,724
- Issue date Sep 14, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pillow
- Patent number 7,709,951
- Issue date May 4, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,255,571
- Issue date Aug 14, 2007
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature dependent semiconductor module connectors
- Patent number 7,137,826
- Issue date Nov 21, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hook interconnect
- Patent number 7,128,579
- Issue date Oct 31, 2006
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for balancing differences in thermal expansio...
- Patent number 6,569,711
- Issue date May 27, 2003
- International Business Machines Corporation
- Robin A. Susko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated circuit chip device having balanced thermal expansion
- Patent number 6,177,728
- Issue date Jan 23, 2001
- International Business Machines Corporation
- Robin A. Susko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure interconnector and assembly
- Patent number 6,059,579
- Issue date May 9, 2000
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexibly connecting electronic devices
- Patent number 5,956,235
- Issue date Sep 21, 1999
- International Business Machines Corporation
- John S. Kresge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification of organic materials to improve adhesion
- Patent number 5,208,067
- Issue date May 4, 1993
- International Business Machines Corporation
- Carol R. Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical and/or thermal interconnections and methods for obtainin...
- Patent number 5,189,261
- Issue date Feb 23, 1993
- IBM Corporation
- Lawrence C. Alexander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification of organic materials to improve adhesion
- Patent number 5,039,569
- Issue date Aug 13, 1991
- IBM Corporation
- Carol R. Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for laminating organic materials via surface modification
- Patent number 4,908,094
- Issue date Mar 13, 1990
- International Business Machines Corporation
- Carol R. Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor having segmented electrodes
- Patent number 4,885,074
- Issue date Dec 5, 1989
- International Business Machines Corporation
- Robin A. Susko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making sloped vias
- Patent number 4,830,706
- Issue date May 16, 1989
- International Business Machines Corporation
- Ronald S. Horwath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification of organic materials to improve adhesion
- Patent number 4,715,941
- Issue date Dec 29, 1987
- International Business Machines Corporation
- Carol R. Jones
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for removing contaminant
- Patent number 4,654,115
- Issue date Mar 31, 1987
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICHED ORGANIC LGA STRUCTURE
- Publication number 20090057865
- Publication date Mar 5, 2009
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PILLOW
- Publication number 20080225484
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature dependent semiconductor module connectors
- Publication number 20070010111
- Publication date Jan 11, 2007
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS
- Publication number 20060205273
- Publication date Sep 14, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Robin A. Susko

Person

Patents Grantslast 30 patents

Structures and methods to reduce maximum current density in a solde...

Structures and methods to reduce maximum current density in a solde...

Sandwiched organic LGA structure

Thermal pillow

Temperature dependent semiconductor module connectors

Temperature dependent semiconductor module connectors

Hook interconnect

Methods and apparatus for balancing differences in thermal expansio...

Removal of metal skin from a copper-Invar-copper laminate

Integrated circuit chip device having balanced thermal expansion

Semiconductor structure interconnector and assembly

Method and apparatus for flexibly connecting electronic devices

Surface modification of organic materials to improve adhesion

Electrical and/or thermal interconnections and methods for obtainin...

Surface modification of organic materials to improve adhesion

Method for laminating organic materials via surface modification

Plasma reactor having segmented electrodes

Method of making sloped vias

Surface modification of organic materials to improve adhesion

Process for removing contaminant

Patents Applicationslast 30 patents

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SANDWICHED ORGANIC LGA STRUCTURE

THERMAL PILLOW

Temperature dependent semiconductor module connectors

TEMPERATURE DEPENDENT SEMICONDUCTOR MODULE CONNECTORS