Number | Name | Date | Kind |
---|---|---|---|
4658332 | Baker et al. | Apr 1987 | |
4740414 | Shaheen | Apr 1988 | |
4847146 | Yeh et al. | Jul 1989 | |
4873615 | Grabbe | Oct 1989 | |
5026624 | Day et al. | Jun 1991 | |
5049981 | Dahringer | Sep 1991 | |
5258648 | Lin | Nov 1993 | |
5262280 | Knudsen et al. | Nov 1993 | |
5278010 | Day et al. | Jan 1994 | |
5304457 | Day et al. | Apr 1994 | |
5347162 | Pasch | Sep 1994 | |
5371404 | Juskey et al. | Dec 1994 | |
5439766 | Day et al. | Aug 1995 | |
5439779 | Day et al. | Aug 1995 | |
5473119 | Rosenmayer et al. | Dec 1995 | |
5473814 | White | Dec 1995 | |
5493075 | Chong et al. | Feb 1996 | |
5496769 | Marion et al. | Mar 1996 | |
5511306 | Denton et al. | Apr 1996 | |
5535101 | Miles et al. | Jul 1996 | |
5579573 | Baker et al. | Dec 1996 | |
5633535 | Chao et al. | May 1997 |
Entry |
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IBM Technical Disclosure Bulletin, pp. 85-86, vol. 40 No. 04, Apr. 1997. |
09/067,708; filed Apr. 28, 1998; inventor Jimarez et al. for Methods and Apparatus for Balancing Differences in Thermal Expansion in Electric Packaging. |
09/080,117; field May 15, 1998; inventor Caletka et al.. for Thermally Enhanced and Mechanically Balanced Flip Chip Package and Method of Forming. |