Rockwell Smith

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and system for removing carrier film from a singulated die
- Patent number 6,751,853
- Issue date Jun 22, 2004
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing carrier film from a singulated die
- Patent number 6,658,718
- Issue date Dec 9, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing carrier tape from a singulated die
- Patent number 6,505,395
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing carrier film from a semiconductor die
- Patent number 6,202,292
- Issue date Mar 20, 2001
- Micron Technology, Inc.
- Warren M. Farnworth
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Dissimilar adhesive die attach for semiconductor devices
- Patent number 5,304,842
- Issue date Apr 19, 1994
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for removing carrier film from a singulated die
- Publication number 20020178567
- Publication date Dec 5, 2002
- Warren M. Farnworth.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for removing carrier film from a singulated die
- Publication number 20010010119
- Publication date Aug 2, 2001
- Warren M. Farnworth.
- H01 - BASIC ELECTRIC ELEMENTS