Roelf Anco Jacob GROENHUIS

Person

Nijmegen, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier
- Patent number 10,315,821
- Issue date Jun 11, 2019
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 10,177,111
- Issue date Jan 8, 2019
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale semiconductor package
- Patent number 10,109,564
- Issue date Oct 23, 2018
- NXP B.V.
- Roelf Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 10,056,343
- Issue date Aug 21, 2018
- Nexperia B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and molding approaches therefor
- Patent number 9,842,776
- Issue date Dec 12, 2017
- NXP B.V.
- John Suman Nakka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,704,823
- Issue date Jul 11, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing defects in wafer level chip scale package (WLCSP) devices
- Patent number 9,466,585
- Issue date Oct 11, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead for connection to a semiconductor device
- Patent number 9,418,918
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier having improved mountability
- Patent number 9,418,919
- Issue date Aug 16, 2016
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with interior polygonal pads
- Patent number 9,269,690
- Issue date Feb 23, 2016
- NXP B.V.
- Roelf A. J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 9,263,335
- Issue date Feb 16, 2016
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods for a sensor package including a lead frame
- Patent number 9,222,989
- Issue date Dec 29, 2015
- NXP B.V.
- Paulus Martinus Catharina Hesen
- G01 - MEASURING TESTING
Information Patent Grant
Discrete semiconductor device package and manufacturing method
- Patent number 8,981,566
- Issue date Mar 17, 2015
- NXP B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a microelectronic package comprising at le...
- Patent number 8,884,410
- Issue date Nov 11, 2014
- NXP B.V.
- Peter Wilhelmus Maria Van De Water
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages including a lead frame and moulding body and method...
- Patent number 8,664,946
- Issue date Mar 4, 2014
- NXP B.V.
- Paulus Martinus Catharina Hesen
- G01 - MEASURING TESTING
Information Patent Grant
Circuit connector apparatus and method therefor
- Patent number 8,508,035
- Issue date Aug 13, 2013
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatments for contact pads used in semiconductor chip pack...
- Patent number 8,159,826
- Issue date Apr 17, 2012
- NXP B.V.
- Paul Dijkstra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Miniature semiconductor device for surface mounting
- Patent number 5,703,401
- Issue date Dec 30, 1997
- U.S. Philips Corporation
- Peter W. M. van de Water
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
- Publication number 20220020670
- Publication date Jan 20, 2022
- NEXPERIA B.V.
- Hartmut Bünning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE
- Publication number 20220020679
- Publication date Jan 20, 2022
- NEXPERIA B.V.
- Hartmut Bünning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER
- Publication number 20180134473
- Publication date May 17, 2018
- NXP B.V.
- Jeroen Johannes Maria Zaal
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE
- Publication number 20170372988
- Publication date Dec 28, 2017
- NXP B.V.
- ROELF GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND MOLDING APPROACHES THEREFOR
- Publication number 20170200646
- Publication date Jul 13, 2017
- NXP B.V.
- John Suman Nakka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20170179076
- Publication date Jun 22, 2017
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276176
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES
- Publication number 20160276306
- Publication date Sep 22, 2016
- NXP B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY
- Publication number 20160211197
- Publication date Jul 21, 2016
- NXP B.V.
- Roelf Anco Jacob GROENHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
- Publication number 20160118357
- Publication date Apr 28, 2016
- NXP B.V.
- Roelf A.J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
- Publication number 20160005679
- Publication date Jan 7, 2016
- NXP B.V.
- Emil Casey Israel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE
- Publication number 20150287666
- Publication date Oct 8, 2015
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS
- Publication number 20150162298
- Publication date Jun 11, 2015
- NXP B.V.
- Roelf A.J. Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20150140739
- Publication date May 21, 2015
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE
- Publication number 20140130346
- Publication date May 15, 2014
- NXP B.V.
- Paulus Martinus Catharina HESEN
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
- Publication number 20130334695
- Publication date Dec 19, 2013
- Edwin TIJSSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD
- Publication number 20130320551
- Publication date Dec 5, 2013
- NXP B.V.
- Tim BOETTCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit connector apparatus and method therefor
- Publication number 20130140705
- Publication date Jun 6, 2013
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatments for Contact Pads Used in Semiconductor Chip Pack...
- Publication number 20080230926
- Publication date Sep 25, 2008
- NXP B.V.
- Paul Dijkstra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and method of manufacturing thereof
- Publication number 20070052097
- Publication date Mar 8, 2007
- Koninklijke Philips Electronincs N.V.
- Cornelis Gerardus Schriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier, method of manufacturing a carrier and an electronic device
- Publication number 20050153483
- Publication date Jul 14, 2005
- Kononklijke Philips Electronics N.V. a corporation
- Roelf Anco Jacob Groenhuis
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
Method of manufacturing an electronic component and electronic comp...
- Publication number 20040253768
- Publication date Dec 16, 2004
- Johan Bosman
- H01 - BASIC ELECTRIC ELEMENTS

Roelf Anco Jacob GROENHUIS

Person

Patents Grantslast 30 patents

Component carrier

Reduction of defects in wafer level chip scale package (WLCSP) devices

Wafer level chip scale semiconductor package

Packaged semiconductor device with interior polygonal pads

Integrated circuits and molding approaches therefor

Reduction of defects in wafer level chip scale package (WLCSP) devices

Reducing defects in wafer level chip scale package (WLCSP) devices

Lead for connection to a semiconductor device

Leadless chip carrier having improved mountability

Packaged semiconductor device with interior polygonal pads

Discrete semiconductor device package and manufacturing method

Manufacturing methods for a sensor package including a lead frame

Discrete semiconductor device package and manufacturing method

Method for manufacturing a microelectronic package comprising at le...

Sensor packages including a lead frame and moulding body and method...

Circuit connector apparatus and method therefor

Surface treatments for contact pads used in semiconductor chip pack...

Miniature semiconductor device for surface mounting

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURE

COMPONENT CARRIER

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUITS AND MOLDING APPROACHES THEREFOR

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

REDUCTION OF DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

REDUCING DEFECTS IN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) DEVICES

LEADLESS CHIP CARRIER HAVING IMPROVED MOUNTABILITY

PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS

EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE

LEAD FOR CONNECTION TO A SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE WITH INTERIOR POLYGONAL PADS

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

SENSOR PACKAGE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE

DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD

Circuit connector apparatus and method therefor

Surface Treatments for Contact Pads Used in Semiconductor Chip Pack...

Electronic device and method of manufacturing thereof

Carrier, method of manufacturing a carrier and an electronic device

Method of manufacturing an electronic component and electronic comp...