Roger S. Krabbenhoft

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component comprising first and second conductive traces...
- Patent number 12,207,392
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Matthew Doyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,595,416
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,390,439
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Brian L. Carlson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit boards and electronic packages with embedded tamper-respond...
- Patent number 10,378,925
- Issue date Aug 13, 2019
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and electronic packages with embedded tamper-respond...
- Patent number 10,378,924
- Issue date Aug 13, 2019
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and electronic packages with embedded tamper-respond...
- Patent number 10,175,064
- Issue date Jan 8, 2019
- International Business Machines Corporation
- William L. Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Circuit boards and electronic packages with embedded tamper-respond...
- Patent number 10,168,185
- Issue date Jan 1, 2019
- International Business Machines Corporation
- William L. Brodsky
- G01 - MEASURING TESTING
Information Patent Grant
Embedding an integrated venting system into a printed circuit board
- Patent number 9,949,357
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Michael J. Fisher
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 9,942,990
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded venting system
- Patent number 9,930,768
- Issue date Mar 27, 2018
- International Business Machine Corporation
- Michael J. Fisher
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Digital processing equipment
- Patent number 9,873,132
- Issue date Jan 23, 2018
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- John Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of fabricating printed circuit board
- Patent number 9,648,723
- Issue date May 9, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded venting system
- Patent number 9,578,735
- Issue date Feb 21, 2017
- International Business Machines Corporation
- Michael J. Fisher
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Enhanced-reliability printed circuit board for tight-pitch components
- Patent number 8,819,931
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing connection of two large electronic boards utilizing LG...
- Patent number 8,747,122
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Terry F. Banitt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method implementing short-pulse propagation technique on...
- Patent number 8,035,409
- Issue date Oct 11, 2011
- International Business Machines Corporation
- Alina Deutsch
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced-reliability printed circuit board for tight-pitch components
- Patent number 7,615,705
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structures for implementing enhanced reliability for pri...
- Patent number 7,180,752
- Issue date Feb 20, 2007
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for implementing printed circuit board high po...
- Patent number 6,822,468
- Issue date Nov 23, 2004
- International Business Machines Corporation
- David J. Braun
- G01 - MEASURING TESTING
Information Patent Grant
Universal surface finish for DCA, SMT and pad on pad interconnections
- Patent number 5,910,644
- Issue date Jun 8, 1999
- International Business Machines Corporation
- Dale E. Goodman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROSTRIP CROSSTALK REDUCTION
- Publication number 20240098882
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Matthew Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS
- Publication number 20230397331
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20190254172
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...
- Publication number 20190049269
- Publication date Feb 14, 2019
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...
- Publication number 20190017844
- Publication date Jan 17, 2019
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANGLED FIBERGLASS CLOTH WEAVES
- Publication number 20180228023
- Publication date Aug 9, 2018
- International Business Machines Corporation
- MICHAEL A. CHRISTO
- D03 - WEAVING
Information Patent Application
Neural Network Based Prediction of PCB Glass Weave Induced Skew
- Publication number 20180113974
- Publication date Apr 26, 2018
- International Business Machines Corporation
- Dylan J. Boday
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...
- Publication number 20170089729
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...
- Publication number 20170094808
- Publication date Mar 30, 2017
- International Business Machines Corporation
- William L. BRODSKY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20170079133
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF FABRICATING PRINTED CIRCUIT BOARD
- Publication number 20170079131
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Brian L. Carlson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded Venting System
- Publication number 20170064809
- Publication date Mar 2, 2017
- International Business Machines Corporation
- Michael J. Fisher
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Embedded Venting System
- Publication number 20170020005
- Publication date Jan 19, 2017
- International Business Machines Corporation
- Michael J. Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED VENTING SYSTEM
- Publication number 20170019986
- Publication date Jan 19, 2017
- International Business Machines Corporation
- Michael J. Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Digital Processing Equipment
- Publication number 20160358830
- Publication date Dec 8, 2016
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- John Dangler
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LG...
- Publication number 20140127915
- Publication date May 8, 2014
- International Business Machines Corporation
- Terry F. Banitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED MODELING OF PRINTED CIRCUIT BOARD COSTS
- Publication number 20130024400
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Casimer M. DeCusatis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Meeting Calendar Optimization
- Publication number 20110320237
- Publication date Dec 29, 2011
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON...
- Publication number 20100277197
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Alina Deutsch
- G01 - MEASURING TESTING
Information Patent Application
ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS
- Publication number 20080271314
- Publication date Nov 6, 2008
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Enhanced-Reliability Printed Circuit Board for Tight-Pitch Components
- Publication number 20080014419
- Publication date Jan 17, 2008
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and structures for implementing enhanced reliability for pri...
- Publication number 20050265008
- Publication date Dec 1, 2005
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for implementing printed circuit board high po...
- Publication number 20040183524
- Publication date Sep 23, 2004
- International Business Machines Corporation
- David J. Braun
- G01 - MEASURING TESTING

Roger S. Krabbenhoft

Person

Patents Grantslast 30 patents

Electronic component comprising first and second conductive traces...

Method to manufacture conductive anodic filament-resistant microvias

Insertion loss reduction and increased bonding in a circuit apparatus

Insertion loss reduction and increased bonding in a circuit apparatus

Circuit boards and electronic packages with embedded tamper-respond...

Circuit boards and electronic packages with embedded tamper-respond...

Circuit boards and electronic packages with embedded tamper-respond...

Circuit boards and electronic packages with embedded tamper-respond...

Embedding an integrated venting system into a printed circuit board

Insertion loss reduction and increased bonding in a circuit apparatus

Embedded venting system

Digital processing equipment

Process of fabricating printed circuit board

Embedded venting system

Enhanced-reliability printed circuit board for tight-pitch components

Implementing connection of two large electronic boards utilizing LG...

System and method implementing short-pulse propagation technique on...

Enhanced-reliability printed circuit board for tight-pitch components

Method and structures for implementing enhanced reliability for pri...

Method and apparatus for implementing printed circuit board high po...

Universal surface finish for DCA, SMT and pad on pad interconnections

Patents Applicationslast 30 patents

MICROSTRIP CROSSTALK REDUCTION

METHOD TO MANUFACTURE CONDUCTIVE ANODIC FILAMENT-RESISTANT MICROVIAS

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...

CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...

ANGLED FIBERGLASS CLOTH WEAVES

Neural Network Based Prediction of PCB Glass Weave Induced Skew

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...

CIRCUIT BOARDS AND ELECTRONIC PACKAGES WITH EMBEDDED TAMPER-RESPOND...

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

PROCESS OF FABRICATING PRINTED CIRCUIT BOARD

Embedded Venting System

Embedded Venting System

EMBEDDED VENTING SYSTEM

Digital Processing Equipment

IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LG...

ADVANCED MODELING OF PRINTED CIRCUIT BOARD COSTS

Meeting Calendar Optimization

SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON...

ENHANCED-RELIABILITY PRINTED CIRCUIT BOARD FOR TIGHT-PITCH COMPONENTS

Enhanced-Reliability Printed Circuit Board for Tight-Pitch Components

Method and structures for implementing enhanced reliability for pri...

Method and apparatus for implementing printed circuit board high po...