Roland D. Vandamme

Person

St. Peters, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for post-epitaxial warp prediction and control
- Patent number 9,601,395
- Issue date Mar 21, 2017
- Sunedison Semiconductor Limited (UEN201334164H)
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Center flex single side polishing head having recess and cap
- Patent number 9,566,687
- Issue date Feb 14, 2017
- Sunedison Semiconductor Limited (UEN201334164H)
- Peter Albrecht
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for mounting an ingot on a wire saw
- Patent number 9,156,187
- Issue date Oct 13, 2015
- SunEdison Semiconductor Ltd.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Hydrostatic pad pressure modulation in a simultaneous double side w...
- Patent number 8,712,575
- Issue date Apr 29, 2014
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor and solar wafers
- Patent number 8,310,031
- Issue date Nov 13, 2012
- MEMC Electronic Materials, Inc.
- Guoqiang David Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for etching the edge of a silicon wafer
- Patent number 8,309,464
- Issue date Nov 13, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of grinding semiconductor wafers having improved nanotopology
- Patent number 8,267,745
- Issue date Sep 18, 2012
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Edge etched silicon wafers
- Patent number 8,192,822
- Issue date Jun 5, 2012
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods and systems for adjusting operation of a wafer grinder usin...
- Patent number 8,145,342
- Issue date Mar 27, 2012
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer clamping device for a double side grinder
- Patent number 8,066,553
- Issue date Nov 29, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method for assessing workpiece nanotopology using a double side waf...
- Patent number 7,927,185
- Issue date Apr 19, 2011
- MEMC Electronic Materials, Inc.
- Roland R. Vandamme
- B24 - GRINDING POLISHING
Information Patent Grant
Nanotopography control and optimization using feedback from warp data
- Patent number 7,930,058
- Issue date Apr 19, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Wire saw ingot slicing system and method with ingot preheating, web...
- Patent number 7,878,883
- Issue date Feb 1, 2011
- MEMC Electronics Materials, Inc.
- Puneet Gupta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Double side wafer grinder and methods for assessing workpiece nanot...
- Patent number 7,601,049
- Issue date Oct 13, 2009
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing a semiconductor wafer
- Patent number 7,559,825
- Issue date Jul 14, 2009
- MEMC Electronic Materials, Inc.
- Henry Frank Erk
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing a semiconductor wafer including back side gri...
- Patent number 7,416,962
- Issue date Aug 26, 2008
- Siltronic Corporation
- Wesley Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for reducing waviness in semiconductor wafers
- Patent number 6,200,908
- Issue date Mar 13, 2001
- MEMC Electronic Materials, Inc.
- Roland Vandamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing semiconductor wafers
- Patent number 6,114,245
- Issue date Sep 5, 2000
- MEMC Electronic Materials, Inc.
- Roland Vandamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for etching semiconductor wafers
- Patent number 5,340,437
- Issue date Aug 23, 1994
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP
- Publication number 20160101502
- Publication date Apr 14, 2016
- SunEdison Semiconductor Limited (UEN201334164H)
- Peter Albrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR POST-EPITAXIAL WARP PREDICTION AND CONTROL
- Publication number 20150371909
- Publication date Dec 24, 2015
- SUNEDISON SEMICONDUCTOR LIMITED
- Sumeet S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CENTER FLEX SINGLE SIDE POLISHING HEAD
- Publication number 20140357161
- Publication date Dec 4, 2014
- Sumeet Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Systems For Removing Contaminants From A Wire Of A Saw
- Publication number 20130206163
- Publication date Aug 15, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B08 - CLEANING
Information Patent Application
Methods For Mounting An Ingot On A Wire Saw
- Publication number 20130174829
- Publication date Jul 11, 2013
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Systems and Methods For Controlling Surface Profiles Of Wafers Slic...
- Publication number 20130174828
- Publication date Jul 11, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Methods For Controlling Displacement Of Bearings In A Wire Saw
- Publication number 20130139801
- Publication date Jun 6, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire...
- Publication number 20130144420
- Publication date Jun 6, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Systems For Controlling Temperature Of Bearings In A Wire Saw
- Publication number 20130144421
- Publication date Jun 6, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire...
- Publication number 20130139800
- Publication date Jun 6, 2013
- MEMC ELECTRONIC MATERIALS, S.P.A.
- Carlo Zavattari
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor And Solar Wafers And Method For Processing Same
- Publication number 20120028439
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Guoqiang David Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor And Solar Wafers
- Publication number 20120025353
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Guoqiang David Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Grinding Tool For Trapezoid Grinding Of A Wafer
- Publication number 20120028555
- Publication date Feb 2, 2012
- MEMC Electronic Materials, Inc.
- Guoqiang David Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side W...
- Publication number 20110237160
- Publication date Sep 29, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
- Publication number 20110101504
- Publication date May 5, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Methods and Systems For Adjusting Operation Of A Wafer Grinder Usin...
- Publication number 20110045740
- Publication date Feb 24, 2011
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Method For Assessing Workpiece Nanotopology Using A Double Side Waf...
- Publication number 20100087123
- Publication date Apr 8, 2010
- MEMC Electronic Materials, Inc.
- Roland R. Vandamme
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090247055
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHED SILICON WAFERS
- Publication number 20090246444
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER
- Publication number 20090242126
- Publication date Oct 1, 2009
- MEMC Electronic Materials, Inc.
- Henry F. Erk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTOPOGRAPHY CONTROL AND OPTIMIZATION USING FEEDBACK FROM WARP DATA
- Publication number 20080166948
- Publication date Jul 10, 2008
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POLISHING A SEMICONDUCTOR WAFER
- Publication number 20080153391
- Publication date Jun 26, 2008
- MEMC Electronic Materials, Inc.
- Henry Frank Erk
- B24 - GRINDING POLISHING
Information Patent Application
Wafer Clamping Device For A Double Side Grinder
- Publication number 20080020684
- Publication date Jan 24, 2008
- MEMC ELECTRONIC MATERIALS, INCORPORATED
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Wire saw ingot slicing system and method with ingot preheating, web...
- Publication number 20070178807
- Publication date Aug 2, 2007
- MEMC Electronic Materials, Inc.
- Puneet Gupta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Double side wafer grinder and methods for assessing workpiece nanot...
- Publication number 20070179660
- Publication date Aug 2, 2007
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Double side wafer grinder and methods for assessing workpiece nanot...
- Publication number 20070179659
- Publication date Aug 2, 2007
- MEMC Electronic Materials, Inc.
- Roland D. Vandamme
- B24 - GRINDING POLISHING
Information Patent Application
Method for processing a semiconductor wafer including back side gri...
- Publication number 20040043616
- Publication date Mar 4, 2004
- Wesley Harrison
- H01 - BASIC ELECTRIC ELEMENTS

Roland D. Vandamme

Person

Patents Grantslast 30 patents

Methods for post-epitaxial warp prediction and control

Center flex single side polishing head having recess and cap

Methods for mounting an ingot on a wire saw

Hydrostatic pad pressure modulation in a simultaneous double side w...

Semiconductor and solar wafers

Methods for etching the edge of a silicon wafer

Methods of grinding semiconductor wafers having improved nanotopology

Edge etched silicon wafers

Methods and systems for adjusting operation of a wafer grinder usin...

Wafer clamping device for a double side grinder

Method for assessing workpiece nanotopology using a double side waf...

Nanotopography control and optimization using feedback from warp data

Wire saw ingot slicing system and method with ingot preheating, web...

Double side wafer grinder and methods for assessing workpiece nanot...

Method of polishing a semiconductor wafer

Method for processing a semiconductor wafer including back side gri...

Process for reducing waviness in semiconductor wafers

Method of processing semiconductor wafers

Process and apparatus for etching semiconductor wafers

Patents Applicationslast 30 patents

CENTER FLEX SINGLE SIDE POLISHING HEAD HAVING RECESS AND CAP

METHODS FOR POST-EPITAXIAL WARP PREDICTION AND CONTROL

CENTER FLEX SINGLE SIDE POLISHING HEAD

Methods and Systems For Removing Contaminants From A Wire Of A Saw

Methods For Mounting An Ingot On A Wire Saw

Systems and Methods For Controlling Surface Profiles Of Wafers Slic...

Methods For Controlling Displacement Of Bearings In A Wire Saw

Systems For Controlling Surface Profiles Of Wafers Sliced In A Wire...

Systems For Controlling Temperature Of Bearings In A Wire Saw

Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire...

Semiconductor And Solar Wafers And Method For Processing Same

Semiconductor And Solar Wafers

Grinding Tool For Trapezoid Grinding Of A Wafer

Hydrostatic Pad Pressure Modulation in a Simultaneous Double Side W...

Methods of Grinding Semiconductor Wafers Having Improved Nanotopology

Methods and Systems For Adjusting Operation Of A Wafer Grinder Usin...

Method For Assessing Workpiece Nanotopology Using A Double Side Waf...

METHODS FOR ETCHING THE EDGE OF A SILICON WAFER

EDGE ETCHED SILICON WAFERS

EDGE ETCHING APPARATUS FOR ETCHING THE EDGE OF A SILICON WAFER

NANOTOPOGRAPHY CONTROL AND OPTIMIZATION USING FEEDBACK FROM WARP DATA

METHOD OF POLISHING A SEMICONDUCTOR WAFER

Wafer Clamping Device For A Double Side Grinder

Wire saw ingot slicing system and method with ingot preheating, web...

Double side wafer grinder and methods for assessing workpiece nanot...

Double side wafer grinder and methods for assessing workpiece nanot...

Method for processing a semiconductor wafer including back side gri...