Ron Zhang

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication systems having optical power supplies
- Patent number 12,164,142
- Issue date Dec 10, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication systems having optical power supplies
- Patent number 12,066,653
- Issue date Aug 20, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication systems having co-packaged optical modules
- Patent number 12,055,766
- Issue date Aug 6, 2024
- Nubis Communications, Inc.
- Peter James Pupalaikis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 12,029,004
- Issue date Jul 2, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication systems having pluggable modules
- Patent number 12,019,289
- Issue date Jun 25, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 12,004,318
- Issue date Jun 4, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical fiber-to-chip interconnection
- Patent number 11,982,848
- Issue date May 14, 2024
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Grant
Stacked die integrated circuit
- Patent number 9,991,231
- Issue date Jun 5, 2018
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die integrated circuit
- Patent number 9,418,924
- Issue date Aug 16, 2016
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism for determining an accelerated test specification for dev...
- Patent number 7,571,059
- Issue date Aug 4, 2009
- Sun Microsystems, Inc.
- Ron Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
EMI shielding apparatus
- Patent number 6,944,025
- Issue date Sep 13, 2005
- Sun Microsystems, Inc.
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM heat sink assembly and method of assembling
- Patent number 6,243,264
- Issue date Jun 5, 2001
- Sun Microsystems, Inc.
- Vernon P. Bollesen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20250031336
- Publication date Jan 23, 2025
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL FIBER-TO-CHIP INTERCONNECTION
- Publication number 20250020877
- Publication date Jan 16, 2025
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20240266255
- Publication date Aug 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20240159979
- Publication date May 16, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
COMMUNICATION SYSTEMS HAVING OPTICAL POWER SUPPLIES
- Publication number 20240118484
- Publication date Apr 11, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20230380095
- Publication date Nov 23, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20230358979
- Publication date Nov 9, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
COMMUNICATION SYSTEMS HAVING CO-PACKAGED OPTICAL MODULES
- Publication number 20230258873
- Publication date Aug 17, 2023
- Nubis Communications, Inc.
- Peter James Pupalaikis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20230209761
- Publication date Jun 29, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATION SYSTEMS HAVING CO-PACKAGED OPTICAL MODULES
- Publication number 20230161109
- Publication date May 25, 2023
- Nubis Communications, Inc.
- Peter James Pupalaikis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMMUNICATION SYSTEMS HAVING OPTICAL POWER SUPPLIES
- Publication number 20230043794
- Publication date Feb 9, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20230018654
- Publication date Jan 19, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
OPTICAL FIBER-TO-CHIP INTERCONNECTION
- Publication number 20220404566
- Publication date Dec 22, 2022
- Nubis Communications, Inc.
- Clinton Randy Giles
- G02 - OPTICS
Information Patent Application
OPTICAL FIBER-TO-CHIP INTERCONNECTION
- Publication number 20220291461
- Publication date Sep 15, 2022
- Nubis Communications, Inc.
- Lukas Elsinger
- G02 - OPTICS
Information Patent Application
THERMAL DESIGN FOR RACK MOUNT SYSTEMS INCLUDING OPTICAL COMMUNICATI...
- Publication number 20220264759
- Publication date Aug 18, 2022
- Nubis Communications, Inc.
- Brett Michael Dunn Sawyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DIE INTEGRATED CIRCUIT
- Publication number 20170033088
- Publication date Feb 2, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE INTEGRATED CIRCUIT
- Publication number 20150270209
- Publication date Sep 24, 2015
- Invensas Corporation
- Charles G. WOYCHIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanism for determining an accelerated test specification for dev...
- Publication number 20080004826
- Publication date Jan 3, 2008
- Ron Zhang
- G05 - CONTROLLING REGULATING
Information Patent Application
EMI shielding apparatus
- Publication number 20040037042
- Publication date Feb 26, 2004
- David M. Hockanson
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Manifold designs for embedded liquid cooling in a package

Communication systems having optical power supplies

Communication systems having optical power supplies

Communication systems having co-packaged optical modules

Data processing systems including optical communication modules

Communication systems having pluggable modules

Data processing systems including optical communication modules

Optical fiber-to-chip interconnection

Stacked die integrated circuit

Stacked die integrated circuit

Mechanism for determining an accelerated test specification for dev...

EMI shielding apparatus

SRAM heat sink assembly and method of assembling

Patents Applicationslast 30 patents

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

OPTICAL FIBER-TO-CHIP INTERCONNECTION

ELECTRONIC DEVICE COOLING STRUCTURES

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

COMMUNICATION SYSTEMS HAVING OPTICAL POWER SUPPLIES

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

COMMUNICATION SYSTEMS HAVING CO-PACKAGED OPTICAL MODULES

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

COMMUNICATION SYSTEMS HAVING CO-PACKAGED OPTICAL MODULES

COMMUNICATION SYSTEMS HAVING OPTICAL POWER SUPPLIES

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

OPTICAL FIBER-TO-CHIP INTERCONNECTION

OPTICAL FIBER-TO-CHIP INTERCONNECTION

THERMAL DESIGN FOR RACK MOUNT SYSTEMS INCLUDING OPTICAL COMMUNICATI...

STACKED DIE INTEGRATED CIRCUIT

STACKED DIE INTEGRATED CIRCUIT

Mechanism for determining an accelerated test specification for dev...

EMI shielding apparatus