Rose Guino

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Irvine, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Pre-cut wafer applied underfill film on dicing tape
- Patent number 9,362,105
- Issue date Jun 7, 2016
- Henkel IP & Holding GmbH
- Gina Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-cut wafer applied underfill film
- Patent number 9,281,182
- Issue date Mar 8, 2016
- Henkel IP & Holding GmbH
- YounSang Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM
- Publication number 20130210239
- Publication date Aug 15, 2013
- Henkel Corporation
- YounSang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
- Publication number 20130196472
- Publication date Aug 1, 2013
- Henkel Corporation
- Gina Hoang
- H01 - BASIC ELECTRIC ELEMENTS