Roy Dale Hollaway

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical module having cavity substrate
- Patent number 7,609,461
- Issue date Oct 27, 2009
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module with lens integral holder fabrication method
- Patent number 7,059,040
- Issue date Jun 13, 2006
- Amkor Technology, Inc.
- Steven Webster
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting for a package containing a chip
- Patent number 6,967,395
- Issue date Nov 22, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer having alignment marks extending from a first to a second sur...
- Patent number 6,943,429
- Issue date Sep 13, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side wafer singulation method
- Patent number 6,869,861
- Issue date Mar 22, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip on glass sensor package
- Patent number 6,849,916
- Issue date Feb 1, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
VCSEL package and fabrication method
- Patent number 6,816,523
- Issue date Nov 9, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting for a package containing a chip
- Patent number 6,777,789
- Issue date Aug 17, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical track drain package
- Patent number 6,765,801
- Issue date Jul 20, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an image sensor package with vision die in lens...
- Patent number 6,734,419
- Issue date May 11, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pre-drilled image sensor package fabrication method
- Patent number 6,730,536
- Issue date May 4, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating and using an image sensor package with reflector
- Patent number 6,717,126
- Issue date Apr 6, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with reflector
- Patent number 6,686,580
- Issue date Feb 3, 2004
- Amkor Technology, Inc.
- Thomas P. Glenn
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module with lens integral holder
- Patent number 6,686,588
- Issue date Feb 3, 2004
- Amkor Technology, Inc.
- Steven Webster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package mounting
- Patent number 6,670,698
- Issue date Dec 30, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for backside saw cavity protection
- Patent number 6,661,080
- Issue date Dec 9, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromachine stacked wirebonded package fabrication method
- Patent number 6,638,789
- Issue date Oct 28, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic semiconductor package and method for fabricating the package
- Patent number 6,627,987
- Issue date Sep 30, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromirror device package fabrication method
- Patent number 6,624,921
- Issue date Sep 23, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating a special-purpose die using a polymerizable...
- Patent number 6,610,167
- Issue date Aug 26, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced thickness packaged electronic device
- Patent number 6,586,824
- Issue date Jul 1, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for protecting a micromachine with a cavity in a UV tape
- Patent number 6,580,153
- Issue date Jun 17, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader with spring IC package
- Patent number 6,580,167
- Issue date Jun 17, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for fabricating a special-purpose die using a polymerizab...
- Patent number 6,572,944
- Issue date Jun 3, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat spreader with spring IC package fabrication method
- Patent number 6,562,655
- Issue date May 13, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-drilled image sensor package
- Patent number 6,548,759
- Issue date Apr 15, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting for a package containing a chip
- Patent number 6,545,345
- Issue date Apr 8, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromachine stacked flip chip package fabrication method
- Patent number 6,530,515
- Issue date Mar 11, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Angulated semiconductor packages
- Patent number 6,532,157
- Issue date Mar 11, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with molded substrate and recessed input/outp...
- Patent number 6,528,869
- Issue date Mar 4, 2003
- Amkor Technology, Inc.
- Thomas P. Glenn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Roy Dale Hollaway

Person

Patents Grantslast 30 patents

Optical module having cavity substrate

Optical module with lens integral holder fabrication method

Mounting for a package containing a chip

Wafer having alignment marks extending from a first to a second sur...

Back-side wafer singulation method

Flip chip on glass sensor package

VCSEL package and fabrication method

Mounting for a package containing a chip

Optical track drain package

Method for forming an image sensor package with vision die in lens...

Pre-drilled image sensor package fabrication method

Method of fabricating and using an image sensor package with reflector

Image sensor package with reflector

Optical module with lens integral holder

Integrated circuit package mounting

Structure for backside saw cavity protection

Micromachine stacked wirebonded package fabrication method

Ceramic semiconductor package and method for fabricating the package

Micromirror device package fabrication method

Method for fabricating a special-purpose die using a polymerizable...

Reduced thickness packaged electronic device

Structure for protecting a micromachine with a cavity in a UV tape

Heat spreader with spring IC package

Structure for fabricating a special-purpose die using a polymerizab...

Heat spreader with spring IC package fabrication method

Pre-drilled image sensor package

Mounting for a package containing a chip

Micromachine stacked flip chip package fabrication method

Angulated semiconductor packages

Semiconductor package with molded substrate and recessed input/outp...