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Ruopeng Deng

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  • San Jose, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-layer feature fill
    • Patent number 12,014,928
    • Issue date Jun 18, 2024
    • Lam Research Corporation
    • Xiaolan Ba
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Atomic layer deposition on 3D NAND structures
    • Patent number 11,972,952
    • Issue date Apr 30, 2024
    • Lam Research Corporation
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    TUNGSTEN DEPOSITION
    • Publication number 20220364232
    • Publication date Nov 17, 2022
    • LAM RESEARCH CORPORATION
    • Pragna NANNAPANENI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    NUCLEATION-FREE TUNGSTEN DEPOSITION
    • Publication number 20220254685
    • Publication date Aug 11, 2022
    • LAM RESEARCH CORPORATION
    • Sema ERMEZ
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION
    • Publication number 20220186370
    • Publication date Jun 16, 2022
    • LAM RESEARCH CORPORATION
    • Pragna Nannapaneni
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES
    • Publication number 20210335617
    • Publication date Oct 28, 2021
    • LAM RESEARCH CORPORATION
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYER FEATURE FILL
    • Publication number 20210313183
    • Publication date Oct 7, 2021
    • LAM RESEARCH CORPORATION
    • Xiaolan Ba
    • H01 - BASIC ELECTRIC ELEMENTS