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Ryoichi Kimizuka
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Fujisawa, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Copper plating bath containing a tertiary amine compound and use th...
Patent number
9,321,741
Issue date
Apr 26, 2016
JCU CORPORATION
Hiroki Yasuda
C07 - ORGANIC CHEMISTRY
Information
Patent Grant
Plating apparatus and plating method
Patent number
7,553,400
Issue date
Jun 30, 2009
Ebara Corporation
Mizuki Nagai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of managing a plating liquid used in a plating apparatus
Patent number
7,172,683
Issue date
Feb 6, 2007
Ebara Corporation
Yasushi Isayama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Substrate plating method and apparatus
Patent number
7,033,463
Issue date
Apr 25, 2006
Ebara Corporation
Akihisa Hongo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Substrate plating method and apparatus
Patent number
6,908,534
Issue date
Jun 21, 2005
Ebara Corporation
Akihisa Hongo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for forming interconnects
Patent number
6,811,658
Issue date
Nov 2, 2004
Ebara Corporation
Akihisa Hongo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper plating bath and plating method for substrate using the copp...
Patent number
6,800,188
Issue date
Oct 5, 2004
Ebara-Udylite Co., Ltd.
Hideki Hagiwara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper-plating liquid, plating method and plating apparatus
Patent number
6,709,563
Issue date
Mar 23, 2004
Ebara Corporation
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and apparatus for plating substrate with copper
Patent number
6,638,411
Issue date
Oct 28, 2003
Ebara Corporation
Koji Mishima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of measuring the concentration of a leveler in a plating liquid
Patent number
6,627,066
Issue date
Sep 30, 2003
Ebara Corporation
Yasushi Isayama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method for plating a first layer on a substrate and a second layer...
Patent number
6,517,894
Issue date
Feb 11, 2003
Ebara Corporation
Akihisa Hongo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Via-filling process
Patent number
6,518,182
Issue date
Feb 11, 2003
Ebara-Udylite Co., Ltd.
Masami Ishikawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Zinc-nickel alloy electrolyte and process
Patent number
4,699,696
Issue date
Oct 13, 1987
OMI International Corporation
Daniel J. Combs
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANAGING COPPER SULFATE PLATING SOLUTION
Publication number
20180298515
Publication date
Oct 18, 2018
JCU CORPORATION
Tetsuro EDA
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
NOVEL COMPOUND AND USE THEREOF
Publication number
20130043137
Publication date
Feb 21, 2013
JCU CORPORATION
Hiroki Yasuda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper Plating Bath and Plating Method
Publication number
20080264798
Publication date
Oct 30, 2008
EBARA CORPORATION
Tsutomu Nakada
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Additive For Copper Plating And Process For Producing Electronic Ci...
Publication number
20080087549
Publication date
Apr 17, 2008
EBARA-UDYLITE CO.,LTD.
Hiroshi Ishizuka
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Apparatus for managing a plating liquid
Publication number
20070102285
Publication date
May 10, 2007
Yasushi Isayama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate plating method and apparatus
Publication number
20060144714
Publication date
Jul 6, 2006
Akihisa Hongo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method for forming protective film and electroless plating bath
Publication number
20050282384
Publication date
Dec 22, 2005
Hidemi Nawafune
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Plating apparatus and plating method
Publication number
20050241946
Publication date
Nov 3, 2005
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Plating method, plating apparatus and a method of forming fine circ...
Publication number
20050126919
Publication date
Jun 16, 2005
Makoto Kubota
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate plating method and apparatus
Publication number
20050098439
Publication date
May 12, 2005
Akihisa Hongo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper plating bath and plating method
Publication number
20050072683
Publication date
Apr 7, 2005
EBARA CORPORATION
Tsutomu Nakada
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Plating method and plating solution
Publication number
20050045486
Publication date
Mar 3, 2005
Tsuyoshi Sahoda
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
Publication number
20040200728
Publication date
Oct 14, 2004
Akihisa Hongo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Polishing liquid, polishing method and polishing apparatus
Publication number
20040154931
Publication date
Aug 12, 2004
Akihisa Hongo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Copper-plating liquid, plating method and plating apparatus
Publication number
20040060825
Publication date
Apr 1, 2004
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for plating substrate with copper
Publication number
20040050711
Publication date
Mar 18, 2004
Koji Mishima
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Cooper-plating solution, plating method and plating apparatus
Publication number
20040022940
Publication date
Feb 5, 2004
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method of measuring the concentration of a leveler in a plating liq...
Publication number
20040016644
Publication date
Jan 29, 2004
Yasushi Isayama
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for forming fine circuit interconnects
Publication number
20030186540
Publication date
Oct 2, 2003
Nobukazu Ito
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Copper plating bath and plating method for substrate using the copp...
Publication number
20030106802
Publication date
Jun 12, 2003
Hideki Hagiwara
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for forming interconnects, and polishing liqui...
Publication number
20020088709
Publication date
Jul 11, 2002
Akihisa Hongo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Substrate plating method and apparatus
Publication number
20020064591
Publication date
May 30, 2002
Akihisa Hongo
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Copper-plating liquid, plating method and plating apparatus
Publication number
20020027081
Publication date
Mar 7, 2002
Mizuki Nagai
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR