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Ryugo Oba

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,811,458
    • Issue date Oct 20, 2020
    • Disco Corporation
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Optical device wafer processing method
    • Patent number 10,109,527
    • Issue date Oct 23, 2018
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 9,724,783
    • Issue date Aug 8, 2017
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam processing machine
    • Patent number 8,610,030
    • Issue date Dec 17, 2013
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam machining apparatus
    • Patent number 8,049,133
    • Issue date Nov 1, 2011
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing beam machine
    • Patent number 7,968,821
    • Issue date Jun 28, 2011
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Dividing method for wafer having film on the front side thereof
    • Patent number 7,897,488
    • Issue date Mar 1, 2011
    • Disco Corporation
    • Yosuke Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,772,092
    • Issue date Aug 10, 2010
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method and laser processing apparatus
    • Patent number 7,655,541
    • Issue date Feb 2, 2010
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer laser processing method
    • Patent number 7,601,616
    • Issue date Oct 13, 2009
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam processing machine
    • Patent number 7,482,554
    • Issue date Jan 27, 2009
    • Disco Corporation
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for laser processing of wafer
    • Patent number 7,396,780
    • Issue date Jul 8, 2008
    • Disco Corporation
    • Hitoshi Hoshino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,179,723
    • Issue date Feb 20, 2007
    • Disco Corporation
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20190109173
    • Publication date Apr 11, 2019
    • Disco Corporation
    • Ryugo OBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OPTICAL DEVICE WAFER PROCESSING METHOD
    • Publication number 20170098579
    • Publication date Apr 6, 2017
    • Disco Corporation
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER PROCESSING APPARATUS
    • Publication number 20160151857
    • Publication date Jun 2, 2016
    • Disco Corporation
    • Wataru Odagiri
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL DEVICE CONFIGURED BY BONDING FIRST AND SECOND TRANSPARENT M...
    • Publication number 20110261457
    • Publication date Oct 27, 2011
    • Disco Corporation
    • Keiji Nomaru
    • G02 - OPTICS
  • Information Patent Application

    LASER PROCESSING MACHINE
    • Publication number 20100084386
    • Publication date Apr 8, 2010
    • Disco Corporation
    • Yukiyasu Masuda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DIVIDING METHOD FOR WAFER HAVING FILM ON THE FRONT SIDE THEREOF
    • Publication number 20090298263
    • Publication date Dec 3, 2009
    • Disco Corporation
    • Yosuke Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20090191692
    • Publication date Jul 30, 2009
    • DISCO CORPORATION
    • Kentaro IIzuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER BEAM MACHINING APPARATUS
    • Publication number 20080296275
    • Publication date Dec 4, 2008
    • Disco Corporation
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method and laser processing apparatus
    • Publication number 20080200012
    • Publication date Aug 21, 2008
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer dividing method
    • Publication number 20080047408
    • Publication date Feb 28, 2008
    • DISCO CORPORATION
    • Ryugo Oba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer laser processing method
    • Publication number 20080020548
    • Publication date Jan 24, 2008
    • DISCO CORPORATION
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of processing sapphire substrate
    • Publication number 20080003708
    • Publication date Jan 3, 2008
    • Hitoshi Hoshino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser beam processing machine
    • Publication number 20070235430
    • Publication date Oct 11, 2007
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing beam machine
    • Publication number 20070228020
    • Publication date Oct 4, 2007
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer laser processing method and laser beam processing machine
    • Publication number 20060255022
    • Publication date Nov 16, 2006
    • Hitoshi Hoshino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser beam processing machine
    • Publication number 20060148210
    • Publication date Jul 6, 2006
    • DISCO CORPORATION
    • Kenji Furuta
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for laser processing of wafer
    • Publication number 20060094260
    • Publication date May 4, 2006
    • DISCO CORPORATION
    • Hitoshi Hoshino
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing method
    • Publication number 20060035411
    • Publication date Feb 16, 2006
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for the laser processing of a wafer
    • Publication number 20060009008
    • Publication date Jan 12, 2006
    • DISCO CORPORATION
    • Yasuomi Kaneuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor wafer processing method
    • Publication number 20050155954
    • Publication date Jul 21, 2005
    • DISCO CORPORATION
    • Ryugo Oba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20050106782
    • Publication date May 19, 2005
    • Satoshi Genda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR