Sai Vadlamani

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 12,154,715
- Issue date Nov 26, 2024
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,935,805
- Issue date Mar 19, 2024
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,901,115
- Issue date Feb 13, 2024
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,881,463
- Issue date Jan 23, 2024
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,862,552
- Issue date Jan 2, 2024
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,735,537
- Issue date Aug 22, 2023
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,664,290
- Issue date May 30, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning of thin film capacitors in organic substrate packages
- Patent number 11,651,902
- Issue date May 16, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release layer-assisted selective embedding of magnetic material in...
- Patent number 11,610,706
- Issue date Mar 21, 2023
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity structures in integrated circuit package supports
- Patent number 11,557,489
- Issue date Jan 17, 2023
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to selectively embed magnetic materials in substrate and co...
- Patent number 11,450,471
- Issue date Sep 20, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly with encapsulated magnetic feature
- Patent number 11,443,892
- Issue date Sep 13, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to embed magnetic material as first layer on coreless subst...
- Patent number 11,417,614
- Issue date Aug 16, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magnetic material, in a cored or coreless semiconductor p...
- Patent number 11,355,459
- Issue date Jun 7, 2022
- INTEL CORPOATION
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor structures for package devices
- Patent number 11,335,632
- Issue date May 17, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded magnetic material using photo...
- Patent number 11,289,263
- Issue date Mar 29, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of embedding magnetic structures in substrates
- Patent number 11,251,113
- Issue date Feb 15, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a coaxial first layer interconnect
- Patent number 11,244,912
- Issue date Feb 8, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 11,205,626
- Issue date Dec 21, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded dielectric magnetic material...
- Patent number 11,189,409
- Issue date Nov 30, 2021
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 11,158,558
- Issue date Oct 26, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,971,492
- Issue date Apr 6, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated through hole socketing coupled to a solder ball to engage wi...
- Patent number 10,741,947
- Issue date Aug 11, 2020
- Intel Corporation
- Amruthavalli Pallavi Alur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless organic packages with embedded die and magnetic inductor s...
- Patent number 10,700,021
- Issue date Jun 30, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D conductive ink printing method and inductor formed thereof
- Patent number 10,692,965
- Issue date Jun 23, 2020
- Intel Corporation
- Chong Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Embedded magnetic inductor
- Patent number 10,672,859
- Issue date Jun 2, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,643,994
- Issue date May 5, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded thin-film capacitors, package-integral magnetic in...
- Patent number 10,373,951
- Issue date Aug 6, 2019
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20240331921
- Publication date Oct 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20240186202
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM
- Publication number 20230420396
- Publication date Dec 28, 2023
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20230245940
- Publication date Aug 3, 2023
- Intel Corporation
- Rahul JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE STAIRCASE CAVITIES
- Publication number 20230101340
- Publication date Mar 30, 2023
- Intel Corporation
- Kaveh HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CAVITY WITH ALIGNMENT FEATURES TO ALIGN AN OPTICAL CONNECTOR
- Publication number 20220413240
- Publication date Dec 29, 2022
- Intel Corporation
- Srikant NEKKANTY
- G02 - OPTICS
Information Patent Application
MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE
- Publication number 20220415770
- Publication date Dec 29, 2022
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...
- Publication number 20220406512
- Publication date Dec 22, 2022
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE CORE HAVING AN EMBEDDED LASER STOP TO CONTROL...
- Publication number 20220399307
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND MAGNETIC CORE...
- Publication number 20220375865
- Publication date Nov 24, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...
- Publication number 20220367104
- Publication date Nov 17, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE
- Publication number 20220359115
- Publication date Nov 10, 2022
- Intel Corporation
- Kyu-Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...
- Publication number 20220328431
- Publication date Oct 13, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES
- Publication number 20220230951
- Publication date Jul 21, 2022
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE WITH SELF-ALIGNED MIRROR IN PACKAGE FOR LONG RANGE CHIP-T...
- Publication number 20220196914
- Publication date Jun 23, 2022
- Intel Corporation
- Jeremy D. ECTON
- G02 - OPTICS
Information Patent Application
FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PA...
- Publication number 20220187548
- Publication date Jun 16, 2022
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS CORES
- Publication number 20220189880
- Publication date Jun 16, 2022
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES
- Publication number 20220130748
- Publication date Apr 28, 2022
- Intel Corporation
- Sai Vadlamani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220093316
- Publication date Mar 24, 2022
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC WIRES AND THEIR APPLICATIONS
- Publication number 20220085143
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20220068847
- Publication date Mar 3, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...
- Publication number 20220013265
- Publication date Jan 13, 2022
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210391232
- Publication date Dec 16, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH UNDERFILL CONTAINMENT BARRIER
- Publication number 20210111088
- Publication date Apr 15, 2021
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...
- Publication number 20200279819
- Publication date Sep 3, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...
- Publication number 20200251467
- Publication date Aug 6, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT
- Publication number 20200168569
- Publication date May 28, 2020
- Intel Corporation
- Sai VADLAMANI
- H01 - BASIC ELECTRIC ELEMENTS

Sai Vadlamani

Person

Patents Grantslast 30 patents

Methods to selectively embed magnetic materials in substrate and co...

Electronic substrates having embedded inductors

Package with underfill containment barrier

Substrate assembly with encapsulated magnetic feature

Coreless organic packages with embedded die and magnetic inductor s...

Methods of embedding magnetic structures in substrates

Methods to embed magnetic material as first layer on coreless subst...

Package with underfill containment barrier

Patterning of thin film capacitors in organic substrate packages

Release layer-assisted selective embedding of magnetic material in...

Cavity structures in integrated circuit package supports

Asymmetric cored integrated circuit package supports

Methods to selectively embed magnetic materials in substrate and co...

Substrate assembly with encapsulated magnetic feature

Methods to embed magnetic material as first layer on coreless subst...

Embedding magnetic material, in a cored or coreless semiconductor p...

Magnetic inductor structures for package devices

Electronic substrates having embedded magnetic material using photo...

Methods of embedding magnetic structures in substrates

Semiconductor package having a coaxial first layer interconnect

Coreless organic packages with embedded die and magnetic inductor s...

Electronic substrates having embedded dielectric magnetic material...

Package with underfill containment barrier

Package-embedded thin-film capacitors, package-integral magnetic in...

Plated through hole socketing coupled to a solder ball to engage wi...

Coreless organic packages with embedded die and magnetic inductor s...

3D conductive ink printing method and inductor formed thereof

Embedded magnetic inductor

Package-embedded thin-film capacitors, package-integral magnetic in...

Package-embedded thin-film capacitors, package-integral magnetic in...

Patents Applicationslast 30 patents

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

MULTICHIP PACKAGE STAIRCASE CAVITIES

SUBSTRATE CAVITY WITH ALIGNMENT FEATURES TO ALIGN AN OPTICAL CONNECTOR

MULTI-LEVEL DIE COUPLED WITH A SUBSTRATE

DEVICE, METHOD, AND SYSTEM TO PROVIDE PASSIVATION STRUCTURES OF A M...

ELECTRONIC SUBSTRATE CORE HAVING AN EMBEDDED LASER STOP TO CONTROL...

MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND MAGNETIC CORE...

METHODS TO SELECTIVELY EMBED MAGNETIC MATERIALS IN SUBSTRATE AND CO...

SUBSTRATE ASSEMBLY WITH ENCAPSULATED MAGNETIC FEATURE

METHODS TO EMBED MAGNETIC MATERIAL AS FIRST LAYER ON CORELESS SUBST...

MAGNETIC INDUCTOR STRUCTURES FOR PACKAGE DEVICES

WAVEGUIDE WITH SELF-ALIGNED MIRROR IN PACKAGE FOR LONG RANGE CHIP-T...

FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PA...

MICROELECTRONIC STRUCTURES INCLUDING GLASS CORES

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

MAGNETIC WIRES AND THEIR APPLICATIONS

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

ELECTRONIC SUBSTRATES HAVING EMBEDDED DIELECTRIC MAGNETIC MATERIAL...

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

PACKAGE WITH UNDERFILL CONTAINMENT BARRIER

CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR S...

PACKAGE-EMBEDDED THIN-FILM CAPACITORS, PACKAGE-INTEGRAL MAGNETIC IN...

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT