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Sailesh M. Merchant
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Macungie, PA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integration of shallow trench isolation and through-substrate vias...
Patent number
9,613,847
Issue date
Apr 4, 2017
Avago Technologies General IP (Singapore) Pte. Ltd.
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked interconnect heat sink
Patent number
9,054,064
Issue date
Jun 9, 2015
Avago Technologies General IP (Singapore) Pte. Ltd.
Mark A Bachman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabrication of through-substrate vias
Patent number
8,987,137
Issue date
Mar 24, 2015
LSI Corporation
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Preventing electronic device counterfeits
Patent number
8,854,115
Issue date
Oct 7, 2014
LSI Corporation
Sailesh M. Merchant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integration of shallow trench isolation and through-substrate vias...
Patent number
8,742,535
Issue date
Jun 3, 2014
LSI Corporation
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
Patent number
8,507,317
Issue date
Aug 13, 2013
Agere Systems LLC
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked interconnect heat sink
Patent number
8,492,911
Issue date
Jul 23, 2013
LSI Corporation
Mark A. Bachman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Routing under bond pad for the replacement of an interconnect layer
Patent number
8,319,343
Issue date
Nov 27, 2012
Agere Systems LLC
Vance D. Archer, III
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal monitoring and management of integrated circuits
Patent number
7,973,544
Issue date
Jul 5, 2011
Agere Systems Inc.
Vance D. Archer, III
G01 - MEASURING TESTING
Information
Patent Grant
Solder bump structure for flip chip semiconductor devices and metho...
Patent number
7,952,206
Issue date
May 31, 2011
Agere Systems Inc.
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power learning security in wireless routers
Patent number
7,948,914
Issue date
May 24, 2011
Agere Systems Inc.
Kouros Azimi
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Semiconductor test device with heating circuit
Patent number
7,804,291
Issue date
Sep 28, 2010
Agere Systems Inc.
Seung H. Kang
G01 - MEASURING TESTING
Information
Patent Grant
Structure and method for fabricating flip chip devices
Patent number
7,777,333
Issue date
Aug 17, 2010
Agere Systems Inc.
Mark Adam Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Formation of an integrated circuit structure with reduced dishing i...
Patent number
7,727,894
Issue date
Jun 1, 2010
Agere Systems Inc.
Sailesh Chittipeddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductor formed in an integrated circuit
Patent number
7,678,639
Issue date
Mar 16, 2010
Agere Systems Inc.
Edward Belden Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aluminum pad power bus and signal routing for integrated circuit de...
Patent number
7,566,964
Issue date
Jul 28, 2009
Agere Systems Inc.
Seung H. Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductor formed in an integrated circuit
Patent number
7,541,238
Issue date
Jun 2, 2009
Agere Systems Inc.
Edward Belden Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device incorporating metallurgical bond to enhan...
Patent number
7,429,502
Issue date
Sep 30, 2008
Agere Systems, INC
Vance D. Archer, III
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor with damage detection circuitry
Patent number
7,397,103
Issue date
Jul 8, 2008
Agere Systems, INC
Vance D. Archer
G01 - MEASURING TESTING
Information
Patent Grant
Test semiconductor device and method for determining Joule heating...
Patent number
7,388,395
Issue date
Jun 17, 2008
Agere Systems Inc.
Seung H. Kang
G01 - MEASURING TESTING
Information
Patent Grant
Structure and method for bonding to copper interconnect structures
Patent number
7,328,830
Issue date
Feb 12, 2008
Agere Systems Inc.
Mark Adam Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device incorporating metallurigical bond to enha...
Patent number
7,327,029
Issue date
Feb 5, 2008
Agere Systems, INC
Vance D. Archer, III
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having reduced intra-level and inter-level cap...
Patent number
7,301,107
Issue date
Nov 27, 2007
Agere Systems, Inc.
Subramanian Karthikeyan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reinforced bond pad for a semiconductor device
Patent number
7,301,231
Issue date
Nov 27, 2007
Agere Systems, INC
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structures for testing a semiconductor wafer prior to pe...
Patent number
7,221,173
Issue date
May 22, 2007
Agere Systems, INC
Mark Adam Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor for integration with copper damascene processes and a met...
Patent number
7,135,733
Issue date
Nov 14, 2006
Agere Systems Inc.
Stephen Downey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reinforced bond pad for a semiconductor device
Patent number
7,115,985
Issue date
Oct 3, 2006
Agere Systems, INC
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier layer for interconnect structures of a semiconductor wafer...
Patent number
7,071,563
Issue date
Jul 4, 2006
Agere Systems, INC
Siddhartha Bhowmik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inductor formed in an integrated circuit
Patent number
7,068,139
Issue date
Jun 27, 2006
Agere Systems Inc.
Edward Belden Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test semiconductor device and method for determining Joule heating...
Patent number
7,061,264
Issue date
Jun 13, 2006
Agere Systems, INC
Seung H. Kang
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
STACKED INTERCONNECT HEAT SINK
Publication number
20150214130
Publication date
Jul 30, 2015
Avago Technologies General IP (Singapore) PTE. LTD.
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTING ELECTRONIC DEVICE COUNTERFEITS
Publication number
20140253222
Publication date
Sep 11, 2014
LSI Corporation
Sailesh M. Merchant
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...
Publication number
20140220760
Publication date
Aug 7, 2014
LSI Corporation
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
Publication number
20140015127
Publication date
Jan 16, 2014
AGERE SYSTEMS LLC
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTERCONNECT HEAT SINK
Publication number
20130280864
Publication date
Oct 24, 2013
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR AUTOMATICALLY CONTROLLING A VIDEO PRESENTATION
Publication number
20130155207
Publication date
Jun 20, 2013
Joseph M. Freund
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
Publication number
20130056868
Publication date
Mar 7, 2013
AGERE SYSTEMS LLC
Vance D. Archer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOBILE COMMUNICATION DEVICE APPARATUS HAVING MULTIPLE MOBILE DEVICES
Publication number
20120282980
Publication date
Nov 8, 2012
LSI Corporation
Joseph Michael Freund
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS...
Publication number
20120153430
Publication date
Jun 21, 2012
LSI Corporation
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS
Publication number
20120153492
Publication date
Jun 21, 2012
LSI Corporation
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTERCONNECT HEAT SINK
Publication number
20120020028
Publication date
Jan 26, 2012
LSI Corporation
Mark A. Bachman
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
Publication number
20110195544
Publication date
Aug 11, 2011
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wireless Monitoring and Control of Medical Devices
Publication number
20100331628
Publication date
Dec 30, 2010
LSI CORPORATION
Sailesh Merchant
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
Receipt Translation for Vouchering
Publication number
20100250234
Publication date
Sep 30, 2010
LSI CORPORATION
Kouros Azimi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Power learning security in wireless routers
Publication number
20100188987
Publication date
Jul 29, 2010
Agere Systems, Inc.
Kouros Azimi
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS
Publication number
20100045326
Publication date
Feb 25, 2010
Agere Systems Inc.
Vance D. Archer, III
G01 - MEASURING TESTING
Information
Patent Application
INDUCTOR FORMED IN AN INTEGRATED CIRCUIT
Publication number
20090100668
Publication date
Apr 23, 2009
Agere Systems Inc.
Edward Belden Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for Fabricating Flip Chip Devices
Publication number
20090072393
Publication date
Mar 19, 2009
Agere Systems Inc.
Mark Adam Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...
Publication number
20080026508
Publication date
Jan 31, 2008
Agere Systems Inc.
Vance D. Archer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Formation of an integrated circuit structure with reduced dishing i...
Publication number
20070228572
Publication date
Oct 4, 2007
Sailesh Chittipeddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR TEST DEVICE WITH HEATING CIRCUIT
Publication number
20070168818
Publication date
Jul 19, 2007
Agere Systems, Inc.
Seung H. Kang
G01 - MEASURING TESTING
Information
Patent Application
SOLDER BUMP STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICES AND METHO...
Publication number
20070069394
Publication date
Mar 29, 2007
Agere Systems Inc.
Mark A. Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor with damage detection circuitry
Publication number
20070069365
Publication date
Mar 29, 2007
Vance D. Archer
G01 - MEASURING TESTING
Information
Patent Application
Integrated circuit device incorporating metallurigacal bond to enha...
Publication number
20070069368
Publication date
Mar 29, 2007
Vance D. Archer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
Publication number
20070063352
Publication date
Mar 22, 2007
Agere Systems Inc.
Vance D. Archer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reinforced bond pad for a semiconductor device
Publication number
20060226535
Publication date
Oct 12, 2006
Joze E. Antol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Test semiconductor device and method for determining Joule heating...
Publication number
20060192584
Publication date
Aug 31, 2006
Seung H. Kang
G01 - MEASURING TESTING
Information
Patent Application
Inductor formed in an integrated circuit
Publication number
20060192647
Publication date
Aug 31, 2006
Edward Belden Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and structures for testing a semiconductor wafer prior to pe...
Publication number
20060066327
Publication date
Mar 30, 2006
Mark Adam Bachman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Test semiconductor device and method for determining Joule heating...
Publication number
20060066337
Publication date
Mar 30, 2006
Seung H. Kang
G01 - MEASURING TESTING