Sam S. Garcia

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to form a via
- Patent number 8,586,474
- Issue date Nov 19, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including a bridgeable mate...
- Patent number 8,168,468
- Issue date May 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects for 3-D applications
- Patent number 8,003,517
- Issue date Aug 23, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a via
- Patent number 7,932,175
- Issue date Apr 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropad formation for a semiconductor
- Patent number 7,807,572
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropad for bonding and a method therefor
- Patent number 7,572,723
- Issue date Aug 11, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having a diffusion barrier...
- Patent number 7,422,979
- Issue date Sep 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Lynne M. Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning electroless process tank
- Patent number 7,410,544
- Issue date Aug 12, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Sam S. Garcia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor process and composition for forming a barrier materia...
- Patent number 6,924,232
- Issue date Aug 2, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Percent backsputtering as a control parameter for metallization
- Patent number 6,476,623
- Issue date Nov 5, 2002
- Motorola, Inc.
- Scott C. Bolton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a semiconductor device barrier layer
- Patent number 6,451,181
- Issue date Sep 17, 2002
- Motorola, Inc.
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device adhesive layer structure and process for formi...
- Patent number 6,294,458
- Issue date Sep 25, 2001
- Motorola, Inc.
- Jiming Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inert plasma gas surface cleaning process performed insitu with phy...
- Patent number 6,187,682
- Issue date Feb 13, 2001
- Motorola Inc.
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with a copper barrier layer and formation thereof
- Patent number 6,093,966
- Issue date Jul 25, 2000
- Motorola, Inc.
- Ramnath Venkatraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of decreasing resistivity in an electrically conductive layer
- Patent number 5,801,098
- Issue date Sep 1, 1998
- Motorola, Inc.
- Robert Fiordalice
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO FORM A VIA
- Publication number 20110151663
- Publication date Jun 23, 2011
- Freescale Semiconductor Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF MAKING...
- Publication number 20090218567
- Publication date Sep 3, 2009
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FORMATION FOR A SEMICONDUCTOR
- Publication number 20090176366
- Publication date Jul 9, 2009
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming interconnects for 3-D applications
- Publication number 20080299762
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form a via
- Publication number 20080299759
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FOR BONDING AND A METHOD THEREFOR
- Publication number 20080099799
- Publication date May 1, 2008
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning electroless process tank
- Publication number 20070246075
- Publication date Oct 25, 2007
- Freescale Semiconductor, Inc.
- Sam S. Garcia
- B08 - CLEANING
Information Patent Application
Method for forming a capping layer on a semiconductor device
- Publication number 20070049008
- Publication date Mar 1, 2007
- Gerald A. Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and composition for preparing a semiconductor surface for de...
- Publication number 20060270234
- Publication date Nov 30, 2006
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a semiconductor device having a diffusion barrier...
- Publication number 20060202339
- Publication date Sep 14, 2006
- Lynne M. Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a fully silicided semiconductor device
- Publication number 20050266664
- Publication date Dec 1, 2005
- Michael G. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor process and composition for forming a barrier materia...
- Publication number 20050048773
- Publication date Mar 3, 2005
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an inlaid structure in a semiconductor device
- Publication number 20030134504
- Publication date Jul 17, 2003
- Dean J. Denning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a barrier layer for use in a copper interconnect
- Publication number 20020092763
- Publication date Jul 18, 2002
- Dean J. Denning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sam S. Garcia

Person

Patents Grantslast 30 patents

Method to form a via

Method of making a semiconductor device including a bridgeable mate...

Method for forming interconnects for 3-D applications

Method to form a via

Micropad formation for a semiconductor

Micropad for bonding and a method therefor

Method of forming a semiconductor device having a diffusion barrier...

Method for cleaning electroless process tank

Semiconductor process and composition for forming a barrier materia...

Percent backsputtering as a control parameter for metallization

Method of forming a semiconductor device barrier layer

Semiconductor device adhesive layer structure and process for formi...

Inert plasma gas surface cleaning process performed insitu with phy...

Semiconductor device with a copper barrier layer and formation thereof

Method of decreasing resistivity in an electrically conductive layer

Patents Applicationslast 30 patents

METHOD TO FORM A VIA

CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF MAKING...

MICROPAD FORMATION FOR A SEMICONDUCTOR

Method for forming interconnects for 3-D applications

Method to form a via

MICROPAD FOR BONDING AND A METHOD THEREFOR

Method for cleaning electroless process tank

Method for forming a capping layer on a semiconductor device

Method and composition for preparing a semiconductor surface for de...

Method of forming a semiconductor device having a diffusion barrier...

Method for forming a fully silicided semiconductor device

Semiconductor process and composition for forming a barrier materia...

Method of making an inlaid structure in a semiconductor device

Method for forming a barrier layer for use in a copper interconnect