Sam Vaziri

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapsulant comprising conductive f...
- Patent number 11,842,946
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250218899
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250210446
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250201646
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CHARACTERIZATION METHOD AND MANUFACTURING OF SEMICONDUCTOR...
- Publication number 20250201633
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250189383
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192103
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...
- Publication number 20250140640
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME AND INTEGRATED CIRCUIT
- Publication number 20230240081
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacture
- Publication number 20220310480
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...
- Publication number 20220149020
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor package having an encapsulant comprising conductive f...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

THERMAL CHARACTERIZATION METHOD AND MANUFACTURING OF SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

MEMORY DEVICE AND METHOD OF FORMING THE SAME AND INTEGRATED CIRCUIT

Semiconductor Package and Method of Manufacture

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD TH...