Sameer R. PAITAL

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form high capacitance thin film capacitors (TFCs) as embe...
- Patent number 11,929,212
- Issue date Mar 12, 2024
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,929,330
- Issue date Mar 12, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film barrier seed metallization in magnetic-plugged through ho...
- Patent number 11,443,885
- Issue date Sep 13, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 11,348,718
- Issue date May 31, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,322,444
- Issue date May 3, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless-catalyst doped-mold materials for integrated-circuit di...
- Patent number 11,227,849
- Issue date Jan 18, 2022
- Intel Corporation
- Brandon C Marin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING
- Publication number 20240421043
- Publication date Dec 19, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240243066
- Publication date Jul 18, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKA...
- Publication number 20240222282
- Publication date Jul 4, 2024
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING
- Publication number 20240222293
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240178145
- Publication date May 30, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE
- Publication number 20240114623
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE LAYER UNDER A COPPER PAD
- Publication number 20230420357
- Publication date Dec 28, 2023
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES
- Publication number 20230420378
- Publication date Dec 28, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395445
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...
- Publication number 20230395467
- Publication date Dec 7, 2023
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
- Publication number 20230146165
- Publication date May 11, 2023
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE COATING ON AN EDGE OF A GLASS CORE
- Publication number 20230087838
- Publication date Mar 23, 2023
- Intel Corporation
- Rahul N. MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...
- Publication number 20230092242
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SLEEVES AROUND TGVS FOR IMPROVED HEAT DISSIPAT...
- Publication number 20230088392
- Publication date Mar 23, 2023
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE
- Publication number 20230092903
- Publication date Mar 23, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...
- Publication number 20230085411
- Publication date Mar 16, 2023
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
- Publication number 20220254559
- Publication date Aug 11, 2022
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20220223527
- Publication date Jul 14, 2022
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
ELECTROLESS-CATALYST DOPED-MOLD MATERIALS FOR INTEGRATED-CIRCUIT DI...
- Publication number 20210091030
- Publication date Mar 25, 2021
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM HIGH CAPACITANCE THIN FILM CAPACITORS (TFCS) AS EMBE...
- Publication number 20200343049
- Publication date Oct 29, 2020
- Intel Corporation
- Sameer PAITAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORTS HAVING INDUCTORS WITH MAGNETIC...
- Publication number 20200091053
- Publication date Mar 19, 2020
- Intel Corporation
- Sameer Paital
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...
- Publication number 20200083164
- Publication date Mar 12, 2020
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
- Publication number 20200005987
- Publication date Jan 2, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES WITHIN A SUBSTRATE LAYER TO CURE MAGNETIC PASTE
- Publication number 20200005990
- Publication date Jan 2, 2020
- Intel Corporation
- Sameer PAITAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20190295951
- Publication date Sep 26, 2019
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS

Sameer R. PAITAL

Person

Patents Grantslast 30 patents

Substrate embedded magnetic core inductors and method of making

Method to form high capacitance thin film capacitors (TFCs) as embe...

Lithographic cavity formation to enable EMIB bump pitch scaling

Patternable die attach materials and processes for patterning

Selective deposition of embedded thin-film resistors for semiconduc...

Thin film barrier seed metallization in magnetic-plugged through ho...

Substrate embedded magnetic core inductors and method of making

Lithographic cavity formation to enable EMIB bump pitch scaling

Electroless-catalyst doped-mold materials for integrated-circuit di...

Patents Applicationslast 30 patents

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKA...

TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

SILICON NITRIDE LAYER UNDER A COPPER PAD

PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

GLASS CORE ARCHITECTURES WITH DIELECTRIC BUFFER LAYER BETWEEN GLASS...

SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING

PROTECTIVE COATING ON AN EDGE OF A GLASS CORE

DIELECTRIC LAYER SEPARATING A METAL PAD OF A THROUGH GLASS VIA FROM...

THERMALLY CONDUCTIVE SLEEVES AROUND TGVS FOR IMPROVED HEAT DISSIPAT...

METHODS AND APPARATUS TO EMBED HOST DIES IN A SUBSTRATE

GLASS CORE WITH CAVITY STRUCTURE FOR HETEROGENEOUS PACKAGING ARCHIT...

SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

ELECTROLESS-CATALYST DOPED-MOLD MATERIALS FOR INTEGRATED-CIRCUIT DI...

METHOD TO FORM HIGH CAPACITANCE THIN FILM CAPACITORS (TFCS) AS EMBE...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

INTEGRATED CIRCUIT PACKAGE SUPPORTS HAVING INDUCTORS WITH MAGNETIC...

SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...

SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING

STRUCTURES WITHIN A SUBSTRATE LAYER TO CURE MAGNETIC PASTE

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING