TREA

SANG-JIN CHA

Follow

Person

  • KYUNGGI-DO, KR
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Chip package
    • Patent number 8,866,280
    • Issue date Oct 21, 2014
    • Advanced Semiconductor Engineering, Inc.
    • Soo-Min Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    EMI shielded semiconductor package
    • Patent number 7,576,415
    • Issue date Aug 18, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Sang Jin Cha
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    DISPLAY APPARATUS
    • Publication number 20230217606
    • Publication date Jul 6, 2023
    • LG Display Co., Ltd.
    • Sang-Hyup CHA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20140346654
    • Publication date Nov 27, 2014
    • Advanced Semiconductor Engineering, Inc.
    • SOO-MIN CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE
    • Publication number 20090261470
    • Publication date Oct 22, 2009
    • Advanced Semiconductor Engineering, Inc.
    • SOO-MIN CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMI SHIELDED SEMICONDUCTOR PACKAGE
    • Publication number 20080308912
    • Publication date Dec 18, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Sang Jin Cha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure and method of manufacturing the same
    • Publication number 20080237820
    • Publication date Oct 2, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Hyeongno Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure and manufacturing method thereof
    • Publication number 20080237821
    • Publication date Oct 2, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Hyeongno Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure and manufacturing method thereof
    • Publication number 20080197468
    • Publication date Aug 21, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Hyeongno Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND FABRICATING PROCESS THEREOF
    • Publication number 20080128890
    • Publication date Jun 5, 2008
    • Advanced Semiconductor Engineering, Inc.
    • SOO-MIN CHOI
    • H01 - BASIC ELECTRIC ELEMENTS