Sanjay Gopinath

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nucleation-free tungsten deposition
- Patent number 12,237,221
- Issue date Feb 25, 2025
- Lam Research Corporation
- Sema Ermez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal deposition
- Patent number 12,203,168
- Issue date Jan 21, 2025
- Lam Research Corporation
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten deposition
- Patent number 12,077,858
- Issue date Sep 3, 2024
- Lam Research Corporation
- Pragna Nannapaneni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Rapid flush purging during atomic layer deposition
- Patent number 12,060,639
- Issue date Aug 13, 2024
- Lam Research Corporation
- Pragna Nannapaneni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-layer feature fill
- Patent number 12,014,928
- Issue date Jun 18, 2024
- Lam Research Corporation
- Xiaolan Ba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 11,355,345
- Issue date Jun 7, 2022
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal fill process for three-dimensional vertical NAND wordline
- Patent number 11,348,795
- Issue date May 31, 2022
- Lam Research Corporation
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preventing line bending during metal fill process
- Patent number 10,573,522
- Issue date Feb 25, 2020
- Lam Research Corporation
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact integration for reduced interface and series contact resist...
- Patent number 9,484,251
- Issue date Nov 1, 2016
- Lam Research Corporation
- Paul Raymond Besser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to tune TiOx stoichiometry using atomic layer deposited Ti f...
- Patent number 9,478,411
- Issue date Oct 25, 2016
- Lam Research Corporation
- Shruti Vivek Thombare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus to deposit pure titanium thin film at low temp...
- Patent number 9,478,438
- Issue date Oct 25, 2016
- Lam Research Corporation
- Shruti Vivek Thombare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery
- Patent number 9,447,499
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Shambhu N. Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for void-free cobalt gap fill
- Patent number 9,349,637
- Issue date May 24, 2016
- Lam Research Corporation
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for remote plasma atomic layer deposition
- Patent number 9,255,326
- Issue date Feb 9, 2016
- Novellus Systems, Inc.
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal films on semiconductor substrates
- Patent number 9,117,884
- Issue date Aug 25, 2015
- Novellus Systems, Inc.
- Roey Shaviv
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal films on semiconductor substrates
- Patent number 8,298,933
- Issue date Oct 30, 2012
- Novellus Systems, Inc.
- Roey Shaviv
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for processing semiconductor substrates using...
- Patent number 7,503,334
- Issue date Mar 17, 2009
- Novellus Systems, Inc.
- Krishnan Shrinivasan
- B08 - CLEANING
Information Patent Grant
Method for enhancing the nucleation and morphology of ruthenium fil...
- Patent number 7,456,101
- Issue date Nov 25, 2008
- Novellus Systems, Inc.
- Sanjay Gopinath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of metallocenes to inhibit copper oxidation during semiconducto...
- Patent number 7,279,417
- Issue date Oct 9, 2007
- Novellus Systems, Inc.
- Jeremie Dalton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing the nucleation and morphology of ruthenium fil...
- Patent number 7,211,509
- Issue date May 1, 2007
- Novellus Systems, Inc,
- Sanjay Gopinath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treatment using iodine plasma to improve metal deposition
- Patent number 7,041,596
- Issue date May 9, 2006
- Novellus Systems, Inc.
- Jeremie James Dalton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition for fabricating thin films
- Patent number 7,037,574
- Issue date May 2, 2006
- Veeco Instruments, Inc.
- Ajit P. Paranjpe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for introduction of solid precursors and react...
- Patent number 6,951,765
- Issue date Oct 4, 2005
- Novellus Systems, Inc.
- Sanjay Gopinath
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for processing semiconductor substrates using...
- Patent number 6,848,458
- Issue date Feb 1, 2005
- Novellus Systems, Inc.
- Krishnan Shrinivasan
- B08 - CLEANING
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,645,847
- Issue date Nov 11, 2003
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,627,995
- Issue date Sep 30, 2003
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for maintaining wafer back side and edge exclusion during...
- Patent number 6,550,484
- Issue date Apr 22, 2003
- Novellus Systems, Inc.
- Sanjay Gopinath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chemical-vapor deposition of a material
- Patent number 6,444,263
- Issue date Sep 3, 2002
- CVC Products, Inc.
- Ajit P. Paranjpe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microelectronic interconnect material with adhesion promotion layer...
- Patent number 6,365,502
- Issue date Apr 2, 2002
- CVC Products, Inc.
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NUCLEATION-FREE DEPOSITION
- Publication number 20250132201
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Sema ERMEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL DEPOSITION
- Publication number 20250115998
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FEATURE FILL
- Publication number 20240282580
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Xiaolan BA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES
- Publication number 20240234152
- Publication date Jul 11, 2024
- LAM RESEARCH CORPORATION
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20240158913
- Publication date May 16, 2024
- LAM RESEARCH CORPORATION
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES
- Publication number 20240136192
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES
- Publication number 20230049157
- Publication date Feb 16, 2023
- LAM RESEARCH CORPORATION
- Kapil Umesh Sawlani
- G05 - CONTROLLING REGULATING
Information Patent Application
TUNGSTEN DEPOSITION
- Publication number 20220364232
- Publication date Nov 17, 2022
- LAM RESEARCH CORPORATION
- Pragna NANNAPANENI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL DEPOSITION
- Publication number 20220290300
- Publication date Sep 15, 2022
- LAM RESEARCH CORPORATION
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20220262640
- Publication date Aug 18, 2022
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NUCLEATION-FREE TUNGSTEN DEPOSITION
- Publication number 20220254685
- Publication date Aug 11, 2022
- LAM RESEARCH CORPORATION
- Sema ERMEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION
- Publication number 20220186370
- Publication date Jun 16, 2022
- LAM RESEARCH CORPORATION
- Pragna Nannapaneni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER FEATURE FILL
- Publication number 20210313183
- Publication date Oct 7, 2021
- LAM RESEARCH CORPORATION
- Xiaolan Ba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILL PROCESS FOR THREE-DIMENSIONAL VERTICAL NAND WORDLINE
- Publication number 20200211853
- Publication date Jul 2, 2020
- LAM RESEARCH CORPORATION
- Lawrence Schloss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20200144066
- Publication date May 7, 2020
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS
- Publication number 20180053660
- Publication date Feb 22, 2018
- LAM RESEARCH CORPORATION
- Adam Jandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER FILM INCLUDING A TANTALUM AND TITANIUM ALLOY AS A SCALAB...
- Publication number 20170170114
- Publication date Jun 15, 2017
- LAM RESEARCH CORPORATION
- Paul Raymond Besser
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR VOID-FREE COBALT GAP FILL
- Publication number 20160056074
- Publication date Feb 25, 2016
- LAM RESEARCH CORPORATION
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO TUNE TIOX STOICHIOMETRY USING ATOMIC LAYER DEPOSITED TI F...
- Publication number 20160056037
- Publication date Feb 25, 2016
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS TO DEPOSIT PURE TITANIUM THIN FILM AT LOW TEMP...
- Publication number 20160056053
- Publication date Feb 25, 2016
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR REMOTE PLASMA ATOMIC LAYER DEPOSITION
- Publication number 20140272185
- Publication date Sep 18, 2014
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DUAL PLENUM, AXI-SYMMETRIC SHOWERHEAD WITH EDGE-TO-CENTER GAS DELIVERY
- Publication number 20130341433
- Publication date Dec 26, 2013
- Shambhu N. Roy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conformal Films on Semiconductor Substrates
- Publication number 20100009533
- Publication date Jan 14, 2010
- Novellus Systems, Inc.
- Roey Shaviv
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic layer deposition for fabricating thin films
- Publication number 20030003635
- Publication date Jan 2, 2003
- Ajit P. Paranjpe
- B82 - NANO-TECHNOLOGY
Information Patent Application
Microelectronic interconnect material with adhesion promotion layer...
- Publication number 20020137332
- Publication date Sep 26, 2002
- CVC Products, Inc., a Delware corporation
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic interconnect material with adhesion promotion layer...
- Publication number 20020102838
- Publication date Aug 1, 2002
- CVC Products, Inc., a Delaware corporation
- Ajit P. Paranjpe
- H01 - BASIC ELECTRIC ELEMENTS

Sanjay Gopinath

Person

Patents Grantslast 30 patents

Nucleation-free tungsten deposition

Metal deposition

Tungsten deposition

Rapid flush purging during atomic layer deposition

Multi-layer feature fill

Method for preventing line bending during metal fill process

Metal fill process for three-dimensional vertical NAND wordline

Method for preventing line bending during metal fill process

Contact integration for reduced interface and series contact resist...

Method to tune TiOx stoichiometry using atomic layer deposited Ti f...

Method and apparatus to deposit pure titanium thin film at low temp...

Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery

Method for void-free cobalt gap fill

Systems and methods for remote plasma atomic layer deposition

Conformal films on semiconductor substrates

Conformal films on semiconductor substrates

Apparatus and methods for processing semiconductor substrates using...

Method for enhancing the nucleation and morphology of ruthenium fil...

Use of metallocenes to inhibit copper oxidation during semiconducto...

Method for enhancing the nucleation and morphology of ruthenium fil...

Surface treatment using iodine plasma to improve metal deposition

Atomic layer deposition for fabricating thin films

Method and apparatus for introduction of solid precursors and react...

Apparatus and methods for processing semiconductor substrates using...

Microelectronic interconnect material with adhesion promotion layer...

Microelectronic interconnect material with adhesion promotion layer...

Apparatus for maintaining wafer back side and edge exclusion during...

Method of chemical-vapor deposition of a material

Microelectronic interconnect material with adhesion promotion layer...

Patents Applicationslast 30 patents

NUCLEATION-FREE DEPOSITION

METAL DEPOSITION

GRADIENT LINER IN METAL FILL

MULTI-LAYER FEATURE FILL

NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES

REDUCING LINE BENDING DURING METAL FILL PROCESS

NON-METAL INCORPORATION IN MOLYBDENUM ON DIELECTRIC SURFACES

PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING PROCESSES

TUNGSTEN DEPOSITION

METAL DEPOSITION

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

NUCLEATION-FREE TUNGSTEN DEPOSITION

RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION

MULTI-LAYER FEATURE FILL

METAL FILL PROCESS FOR THREE-DIMENSIONAL VERTICAL NAND WORDLINE

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

METHOD FOR PREVENTING LINE BENDING DURING METAL FILL PROCESS

MULTILAYER FILM INCLUDING A TANTALUM AND TITANIUM ALLOY AS A SCALAB...

METHOD FOR VOID-FREE COBALT GAP FILL

METHOD TO TUNE TIOX STOICHIOMETRY USING ATOMIC LAYER DEPOSITED TI F...

METHOD AND APPARATUS TO DEPOSIT PURE TITANIUM THIN FILM AT LOW TEMP...

SYSTEMS AND METHODS FOR REMOTE PLASMA ATOMIC LAYER DEPOSITION

DUAL PLENUM, AXI-SYMMETRIC SHOWERHEAD WITH EDGE-TO-CENTER GAS DELIVERY

Conformal Films on Semiconductor Substrates

Atomic layer deposition for fabricating thin films

Microelectronic interconnect material with adhesion promotion layer...

Microelectronic interconnect material with adhesion promotion layer...