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Sayeh Khalili
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Stacked semiconductor module
Patent number
RE44019
Issue date
Feb 19, 2013
Rambus Inc.
Thomas F. Fox
438 - Semiconductor device manufacturing: process
Information
Patent Grant
Integrated circuit device having stacked dies and impedance balance...
Patent number
RE43720
Issue date
Oct 9, 2012
Rambus Inc.
Donald V. Perino
257 - Active solid-state devices
Information
Patent Grant
Semiconductor package with low and high-speed signal paths
Patent number
7,705,445
Issue date
Apr 27, 2010
Rambus Inc.
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor module
Patent number
7,285,443
Issue date
Oct 23, 2007
Rambus, Inc.
Thomas F. Fox
G11 - INFORMATION STORAGE
Information
Patent Grant
Stacked semiconductor module
Patent number
7,037,757
Issue date
May 2, 2006
Rambus Inc.
Thomas F. Fox
G11 - INFORMATION STORAGE
Information
Patent Grant
Multi-channel memory architecture
Patent number
6,853,557
Issue date
Feb 8, 2005
Rambus, Inc.
Belgacem Haba
G11 - INFORMATION STORAGE
Information
Patent Grant
Stacked semiconductor module
Patent number
6,720,643
Issue date
Apr 13, 2004
Rambus, Inc.
Thomas F. Fox
G11 - INFORMATION STORAGE
Information
Patent Grant
Multiple channel modules and bus systems using same
Patent number
6,657,871
Issue date
Dec 2, 2003
Rambus Inc.
Donald V. Perino
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated circuit device having stacked dies and impedance balance...
Patent number
6,621,155
Issue date
Sep 16, 2003
Rambus Inc.
Donald V. Perino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple channel modules and bus systems using same
Patent number
6,545,875
Issue date
Apr 8, 2003
Rambus, Inc.
Donald V. Perino
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Redistributed bond pads in stacked integrated circuit die package
Patent number
6,514,794
Issue date
Feb 4, 2003
Rambus Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistributed bond pads in stacked integrated circuit die package
Patent number
6,376,904
Issue date
Apr 23, 2002
Rambus Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Package With Rigid And Flexible Circuits
Publication number
20080150123
Publication date
Jun 26, 2008
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package with low and high-speed signal paths
Publication number
20060180902
Publication date
Aug 17, 2006
Rambus, Inc.
Ming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked semiconductor module
Publication number
20060160271
Publication date
Jul 20, 2006
Thomas F. Fox
G11 - INFORMATION STORAGE
Information
Patent Application
Stacked semiconductor module
Publication number
20040164393
Publication date
Aug 26, 2004
Rambus, Inc.
Thomas F. Fox
G11 - INFORMATION STORAGE
Information
Patent Application
Multiple channel modules and bus systems using same
Publication number
20030007337
Publication date
Jan 9, 2003
Rambus Inc.
Donald V. Perino
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Redistributed bond pads in stacked integrated circuit die package
Publication number
20020127775
Publication date
Sep 12, 2002
Rambus Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS