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Scott Churchwell
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Image sensor packages formed using temporary protection layers and...
Patent number
11,728,360
Issue date
Aug 15, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Larry Duane Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor packages formed using temporary protection layers and...
Patent number
11,342,369
Issue date
May 24, 2022
Semiconductor Components Industries, LLC
Larry Duane Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor packages formed using temporary protection layers and...
Patent number
10,388,684
Issue date
Aug 20, 2019
Semiconductor Components Industries, LLC
Larry Duane Kinsman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array cameras with light barriers
Patent number
9,215,361
Issue date
Dec 15, 2015
Semiconductor Components Industries, LLC
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Backside illuminated image sensors with stacked dies
Patent number
9,041,840
Issue date
May 26, 2015
Semiconductor Components Industries, LLC
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Imaging systems with circuit element in carrier wafer
Patent number
9,024,406
Issue date
May 5, 2015
Semiconductor Components Industries, LLC
Scott Churchwell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus providing an imager module with a permanent ca...
Patent number
8,680,634
Issue date
Mar 25, 2014
Micron Technology, Inc.
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Method and apparatus providing an imager module with a permanent ca...
Patent number
8,048,708
Issue date
Nov 1, 2011
Micron Technology, Inc.
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Patents Applications
last 30 patents
Information
Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
Publication number
20220139982
Publication date
May 5, 2022
Semiconductor Components Industries, LLC
Larry Duane KINSMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
Publication number
20190189662
Publication date
Jun 20, 2019
Semiconductor Components Industries, LLC
Larry Duane KINSMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
Publication number
20190189663
Publication date
Jun 20, 2019
Semiconductor Components Industries, LLC
Larry Duane KINSMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGES FORMED USING TEMPORARY PROTECTION LAYERS AND...
Publication number
20180097028
Publication date
Apr 5, 2018
Semiconductor Components Industries, LLC
Larry Duane KINSMAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ARRAY CAMERAS WITH LIGHT BARRIERS
Publication number
20150054993
Publication date
Feb 26, 2015
Aptina Imaging Corporation
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
IMAGING SYSTEMS WITH CIRCUIT ELEMENT IN CARRIER WAFER
Publication number
20140084407
Publication date
Mar 27, 2014
Aptina Imaging Corporation
Scott Churchwell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE ILLUMINATED IMAGE SENSORS WITH STACKED DIES
Publication number
20140055654
Publication date
Feb 27, 2014
Aptina Imaging Corporation
Swarnal Borthakur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR UNITS WITH STACKED IMAGE SENSORS AND IMAGE PROCESSORS
Publication number
20120194719
Publication date
Aug 2, 2012
Scott Churchwell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS PROVIDING AN IMAGER MODULE WITH A PERMANENT CA...
Publication number
20110204462
Publication date
Aug 25, 2011
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Method and apparatus providing an imager module with a permanent ca...
Publication number
20090321863
Publication date
Dec 31, 2009
Micron Technology, Inc.
Swarnal Borthakur
H04 - ELECTRIC COMMUNICATION TECHNIQUE