Seiki Sakuyama

Person

Yamato, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device, method of manufacturing electronic device, and e...
- Patent number 11,114,418
- Issue date Sep 7, 2021
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, method of manufacturing circuit board, and electroni...
- Patent number 11,057,996
- Issue date Jul 6, 2021
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, method for manufacturing the electronic device,...
- Patent number 10,283,434
- Issue date May 7, 2019
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for manufacturing the same
- Patent number 10,167,537
- Issue date Jan 1, 2019
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and electronic device
- Patent number 10,062,658
- Issue date Aug 28, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 10,056,342
- Issue date Aug 21, 2018
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic part, and solder
- Patent number 9,831,199
- Issue date Nov 28, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and electronic apparatus
- Patent number 9,831,210
- Issue date Nov 28, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical apparatus
- Patent number 9,640,508
- Issue date May 2, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having connection terminal of solder
- Patent number 9,620,470
- Issue date Apr 11, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 9,462,693
- Issue date Oct 4, 2016
- Fujitsu Limited
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 9,402,313
- Issue date Jul 26, 2016
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device capable of enhancing b...
- Patent number 9,305,875
- Issue date Apr 5, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 9,137,926
- Issue date Sep 15, 2015
- Fujitsu Limited
- Yoshitaka Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sheet structure, method of manufacturing sheet structure, and elect...
- Patent number 9,105,600
- Issue date Aug 11, 2015
- Fujitsu Limited
- Yoshitaka Yamaguchi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit board, semiconductor device, and method of manufacturing se...
- Patent number 8,952,271
- Issue date Feb 10, 2015
- Fujitsu Limited
- Masaharu Furuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 8,901,751
- Issue date Dec 2, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,740,047
- Issue date Jun 3, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 8,713,792
- Issue date May 6, 2014
- Fujitsu Limited
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, soldering method, and semiconductor device
- Patent number 8,673,762
- Issue date Mar 18, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 8,673,050
- Issue date Mar 18, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,556,157
- Issue date Oct 15, 2013
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member formed with coating film having tin as its main component, c...
- Patent number 7,984,841
- Issue date Jul 26, 2011
- Fujitsu Limited
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Whiskerless plated structure and plating method
- Patent number 7,931,760
- Issue date Apr 26, 2011
- Fujitsu Limited
- Seiki Sakuyama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composition
- Patent number 7,926,696
- Issue date Apr 19, 2011
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...
- Publication number 20190289715
- Publication date Sep 19, 2019
- Fujitsu Limited
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...
- Publication number 20190252357
- Publication date Aug 15, 2019
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
- Publication number 20170207186
- Publication date Jul 20, 2017
- Fujitsu Limited
- Taiki Uemura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE,...
- Publication number 20170125359
- Publication date May 4, 2017
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER
- Publication number 20170125366
- Publication date May 4, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20170062373
- Publication date Mar 2, 2017
- Fujitsu Limited
- KOZO SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20170012013
- Publication date Jan 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160354871
- Publication date Dec 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20160247776
- Publication date Aug 25, 2016
- Fujitsu Limited
- KOZO SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20160228999
- Publication date Aug 11, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160233181
- Publication date Aug 11, 2016
- FUJITSU LIMITED
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160212849
- Publication date Jul 21, 2016
- Fujitsu Limited
- Taiki Uemura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20160172322
- Publication date Jun 16, 2016
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160133595
- Publication date May 12, 2016
- FUJITSU LIMITED
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20150311171
- Publication date Oct 29, 2015
- FUJITSU LIMITED
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20150162312
- Publication date Jun 11, 2015
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20150049450
- Publication date Feb 19, 2015
- FUJITSU LIMITED
- Keishiro Okamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20150024555
- Publication date Jan 22, 2015
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20140210086
- Publication date Jul 31, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20140140030
- Publication date May 22, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...
- Publication number 20140103097
- Publication date Apr 17, 2014
- Fujitsu Limited
- Masaharu FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20140008114
- Publication date Jan 9, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET STRUCTURE, METHOD OF MANUFACTURING SHEET STRUCTURE, AND ELECT...
- Publication number 20130307136
- Publication date Nov 21, 2013
- FUJITSU LIMITED
- Yoshitaka YAMAGUCHI
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130188319
- Publication date Jul 25, 2013
- Fujitsu Limited
- Yoshitaka YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
- Publication number 20130164956
- Publication date Jun 27, 2013
- Fujitsu Limited
- Seiki SAKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120193800
- Publication date Aug 2, 2012
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, C...
- Publication number 20110244261
- Publication date Oct 6, 2011
- Fujitsu Limited
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, C...
- Publication number 20110244133
- Publication date Oct 6, 2011
- Fujitsu Limited
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Seiki Sakuyama

Person

Patents Grantslast 30 patents

Electronic device, method of manufacturing electronic device, and e...

Circuit board, method of manufacturing circuit board, and electroni...

Electronic device, method for manufacturing the electronic device,...

Electronic apparatus and method for manufacturing the same

Electronic component and electronic device

Electronic component and electronic device

Electronic device, electronic part, and solder

Electronic device and electronic apparatus

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Electrical apparatus

Semiconductor device having connection terminal of solder

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Electronic device and method of manufacturing electronic device

Semiconductor device, electronic device, and semiconductor device m...

Conductive material, conductive paste, circuit board, and semicondu...

Method of manufacturing semiconductor device capable of enhancing b...

Electronic device and method of manufacturing the same

Sheet structure, method of manufacturing sheet structure, and elect...

Circuit board, semiconductor device, and method of manufacturing se...

Semiconductor device, electronic device, and semiconductor device m...

Method of manufacturing electronic apparatus, electronic component-...

Method of manufacturing a printed wiring board

Solder, soldering method, and semiconductor device

Conductive material, conductive paste, circuit board, and semicondu...

Method of manufacturing electronic apparatus, electronic component-...

Member formed with coating film having tin as its main component, c...

Whiskerless plated structure and plating method

Composition

Patents Applicationslast 30 patents

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONI...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND E...

ELECTRONIC DEVICE AND ELECTRONIC APPARATUS

ELECTRONIC DEVICE, METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE,...

ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER

ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME

ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME

FLUX AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME

FLUX AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRICAL APPARATUS AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SE...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

SHEET STRUCTURE, METHOD OF MANUFACTURING SHEET STRUCTURE, AND ELECT...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, C...

MEMBER FORMED WITH COATING FILM HAVING TIN AS ITS MAIN COMPONENT, C...