Setho Sing Fee

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming integrated circuit packages
- Patent number 8,709,866
- Issue date Apr 29, 2014
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having intermediate contacts for connection...
- Patent number 8,703,599
- Issue date Apr 22, 2014
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 8,531,031
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having intermediate contacts for connection...
- Patent number 8,319,332
- Issue date Nov 27, 2012
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuit packages, and methods of asse...
- Patent number 7,977,157
- Issue date Jul 12, 2011
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having intermediate contacts for connection...
- Patent number 7,745,944
- Issue date Jun 29, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of assembling integrated circuit packages
- Patent number 7,700,406
- Issue date Apr 20, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 7,573,136
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling semiconductor devices and interposers
- Patent number 7,528,007
- Issue date May 5, 2009
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin leadframe BGA circuit package
- Patent number 7,294,911
- Issue date Nov 13, 2007
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) grid array package, method of making and me...
- Patent number 7,279,780
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers with receptacles for receiving semiconductor devices an...
- Patent number 7,274,095
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for assembling multiple semiconductor devices
- Patent number 7,198,980
- Issue date Apr 3, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin leadframe BGA circuit package
- Patent number 7,183,134
- Issue date Feb 27, 2007
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers and other carriers including a slot with laterally rece...
- Patent number 7,112,876
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad flat no lead (QFN) grid array package
- Patent number 7,109,572
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) grid array package, method of making and me...
- Patent number 7,075,816
- Issue date Jul 11, 2006
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no lead (QFN) grid array package, method of making and me...
- Patent number 6,967,125
- Issue date Nov 22, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic component assemblies
- Patent number 6,951,982
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Lim Thiam Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,951,777
- Issue date Oct 4, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods of forming same
- Patent number 6,943,450
- Issue date Sep 13, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and packages including multiple sem...
- Patent number 6,906,415
- Issue date Jun 14, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods of forming same
- Patent number 6,876,066
- Issue date Apr 5, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with a lateral recess in a slot to facilitate connection...
- Patent number 6,870,247
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced BGA grounded heatsink
- Patent number 6,828,671
- Issue date Dec 7, 2004
- ST Assembly Test Services PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a slot with a laterally recessed area at an end...
- Patent number 6,773,960
- Issue date Aug 10, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader hole pin 1 identifier
- Patent number 6,750,534
- Issue date Jun 15, 2004
- ST Assembly Test Services Ltd.
- Weddie Pacio Aquien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array interposer, packages and methods
- Patent number 6,746,894
- Issue date Jun 8, 2004
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced BGA grounded heatsink
- Patent number 6,537,857
- Issue date Mar 25, 2003
- ST Assembly Test Service Ltd.
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader hole pin 1 identifier
- Patent number 6,403,401
- Issue date Jun 11, 2002
- ST Assembly Test Services PTE LTD
- Weddie Pacio Aquien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packages, Methods of Forming Integrated Circuit...
- Publication number 20130330882
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION...
- Publication number 20130082384
- Publication date Apr 4, 2013
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages
- Publication number 20110233745
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION...
- Publication number 20100224989
- Publication date Sep 9, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Circuit Packages, and Methods of Asse...
- Publication number 20100151630
- Publication date Jun 17, 2010
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages, Methods of Forming Integrated Circuit...
- Publication number 20080284000
- Publication date Nov 20, 2008
- Micron Technology, Inc.
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin leadframe BGA circuit package
- Publication number 20070099344
- Publication date May 3, 2007
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic devices having intermediate contacts for connection...
- Publication number 20070045872
- Publication date Mar 1, 2007
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling semiconductor devices and interposers
- Publication number 20060194373
- Publication date Aug 31, 2006
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposers and other carriers including a slot with laterally rece...
- Publication number 20060006513
- Publication date Jan 12, 2006
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20050285241
- Publication date Dec 29, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20050218518
- Publication date Oct 6, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices and methods of forming same
- Publication number 20050023655
- Publication date Feb 3, 2005
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin leadframe BGA circuit package
- Publication number 20050026386
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20040217459
- Publication date Nov 4, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20040203191
- Publication date Oct 14, 2004
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20040114426
- Publication date Jun 17, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for assembling multiple semiconductor devices
- Publication number 20040106229
- Publication date Jun 3, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic component assemblies
- Publication number 20040100772
- Publication date May 27, 2004
- Lim Thiam Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quad flat no-lead (QFN) grid array package, method of making and me...
- Publication number 20040080030
- Publication date Apr 29, 2004
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device assemblies and packages including multiple sem...
- Publication number 20030230801
- Publication date Dec 18, 2003
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrathin leadframe BGA circuit package
- Publication number 20030197267
- Publication date Oct 23, 2003
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for forming a slot with a laterally recessed area at an end...
- Publication number 20030176045
- Publication date Sep 18, 2003
- Setho Sing Fee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Quad flat no lead (QFN) grid array package, method of making and me...
- Publication number 20030164554
- Publication date Sep 4, 2003
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced BGA grounded heatsink
- Publication number 20030085462
- Publication date May 8, 2003
- ST Assembly Test Services, Ltd.
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS OF FORMING SAME
- Publication number 20030042581
- Publication date Mar 6, 2003
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer, packages including the interposer, and methods
- Publication number 20020167092
- Publication date Nov 14, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced BGA grounded heatsink
- Publication number 20020163064
- Publication date Nov 7, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array interposer, packages and methods
- Publication number 20020142513
- Publication date Oct 3, 2002
- Setho Sing Fee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader hole pin 1 identifier
- Publication number 20020093095
- Publication date Jul 18, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Weddie Pacio Aquien
- H01 - BASIC ELECTRIC ELEMENTS

Setho Sing Fee

Person

Patents Grantslast 30 patents

Methods of forming integrated circuit packages

Microelectronic devices having intermediate contacts for connection...

Integrated circuit packages

Microelectronic devices having intermediate contacts for connection...

Methods of forming integrated circuit packages, and methods of asse...

Microelectronic devices having intermediate contacts for connection...

Methods of assembling integrated circuit packages

Semiconductor device assemblies and packages including multiple sem...

Methods for assembling semiconductor devices and interposers

Ultrathin leadframe BGA circuit package

Quad flat no-lead (QFN) grid array package, method of making and me...

Interposers with receptacles for receiving semiconductor devices an...

Methods for assembling multiple semiconductor devices

Ultrathin leadframe BGA circuit package

Interposers and other carriers including a slot with laterally rece...

Quad flat no lead (QFN) grid array package

Quad flat no-lead (QFN) grid array package, method of making and me...

Quad flat no lead (QFN) grid array package, method of making and me...

Packaged microelectronic component assemblies

Methods for forming a slot with a laterally recessed area at an end...

Packaged microelectronic devices and methods of forming same

Semiconductor device assemblies and packages including multiple sem...

Packaged microelectronic devices and methods of forming same

Interposer with a lateral recess in a slot to facilitate connection...

Enhanced BGA grounded heatsink

Methods for forming a slot with a laterally recessed area at an end...

Heat spreader hole pin 1 identifier

Ball grid array interposer, packages and methods

Enhanced BGA grounded heatsink

Heat spreader hole pin 1 identifier

Patents Applicationslast 30 patents

Integrated Circuit Packages, Methods of Forming Integrated Circuit...

MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION...

Integrated Circuit Packages

MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION...

Methods of Forming Integrated Circuit Packages, and Methods of Asse...

Integrated Circuit Packages, Methods of Forming Integrated Circuit...

Ultrathin leadframe BGA circuit package

Microelectronic devices having intermediate contacts for connection...

Methods for assembling semiconductor devices and interposers

Interposers and other carriers including a slot with laterally rece...

Quad flat no-lead (QFN) grid array package, method of making and me...

Semiconductor device assemblies and packages including multiple sem...

Packaged microelectronic devices and methods of forming same

Ultrathin leadframe BGA circuit package

Ball grid array interposer, packages and methods

Methods for forming a slot with a laterally recessed area at an end...

Quad flat no-lead (QFN) grid array package, method of making and me...

Methods for assembling multiple semiconductor devices

Packaged microelectronic component assemblies

Quad flat no-lead (QFN) grid array package, method of making and me...

Semiconductor device assemblies and packages including multiple sem...

Ultrathin leadframe BGA circuit package

Methods for forming a slot with a laterally recessed area at an end...

Quad flat no lead (QFN) grid array package, method of making and me...

Enhanced BGA grounded heatsink

PACKAGED MICROELECTRONIC DEVICES AND METHODS OF FORMING SAME

Interposer, packages including the interposer, and methods

Enhanced BGA grounded heatsink

Ball grid array interposer, packages and methods

Heat spreader hole pin 1 identifier