Seung Hyun Ra

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated electronic component and circuit board for mounting the same
- Patent number 10,714,265
- Issue date Jul 14, 2020
- Hyundai Motor Company
- Soo Hwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and circuit board having the same
- Patent number 9,997,294
- Issue date Jun 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hae Suk Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 9,887,040
- Issue date Feb 6, 2018
- SAMSUNG ELECTRO-MECHANICS, CO. LTD.
- Seung Hyun Ra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal electrode having transition metallic...
- Patent number 8,226,808
- Issue date Jul 24, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Hak-Kwan Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon-fiber web structure type field emitter electrode and fabrica...
- Patent number 8,058,787
- Issue date Nov 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Ra
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing printed circuit board using imprinting process
- Patent number 7,666,292
- Issue date Feb 23, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jae Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for imprinting stamper
- Patent number 7,644,496
- Issue date Jan 12, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Bok Kwak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board for fine circuit form...
- Patent number 7,562,447
- Issue date Jul 21, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Choon Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of carbon-fiber web structure type field emitter...
- Patent number 7,438,622
- Issue date Oct 21, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Ra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer ceramic capacitor
- Patent number 7,338,854
- Issue date Mar 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Ho Sung Choo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayered ceramic capacitor by spin coat...
- Patent number 7,203,055
- Issue date Apr 10, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Soon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Triplexer and multilayered structure thereof
- Patent number 6,876,840
- Issue date Apr 5, 2005
- Samsung Electro-Mechanics Co., Ltd.
- Yu Seon Shin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
- Publication number 20190172651
- Publication date Jun 6, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND CIRCUIT BOARD HAVING THE SAME
- Publication number 20170223832
- Publication date Aug 3, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Hae Suk CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20170162334
- Publication date Jun 8, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun RA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME
- Publication number 20170011854
- Publication date Jan 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140062908
- Publication date Mar 6, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140049484
- Publication date Feb 20, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130328575
- Publication date Dec 12, 2013
- Samsung Electro-Mechanics Co., Ltd.,
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130307565
- Publication date Nov 21, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130277100
- Publication date Oct 24, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING TOUCH PANEL
- Publication number 20130047420
- Publication date Feb 28, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING TOUCH PANEL
- Publication number 20130047428
- Publication date Feb 28, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Hyun Ra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LED PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120319562
- Publication date Dec 20, 2012
- Samsung Electro-Mechanics CO., LTD.
- Seung Hyun RA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PAPER DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120300285
- Publication date Nov 29, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun RA
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING METAL ELECTRODE HAVING TRANSITION METALLIC...
- Publication number 20120262844
- Publication date Oct 18, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hak-Kwan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Supercapacitor module
- Publication number 20120050946
- Publication date Mar 1, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Ra
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS FOR EQUALIZING VOLTAGE USING TIME SWITCH
- Publication number 20120043945
- Publication date Feb 23, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong Wook KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Chip-type electric double layer capacitor and package structure the...
- Publication number 20110058306
- Publication date Mar 10, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Sung Ho Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Chip-type electric double layer capacitor and method for manufactur...
- Publication number 20110058307
- Publication date Mar 10, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Sung Ho Lee
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CARBON-FIBER WEB STRUCTURE TYPE FIELD EMITTER ELECTRODE AND FABRICA...
- Publication number 20100277052
- Publication date Nov 4, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Ra
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
METHOD FOR MANUFACTURING METAL ELECTRODE HAVING TRANSITION METALLIC...
- Publication number 20100233496
- Publication date Sep 16, 2010
- Samsung Electro-Mechanics CO., LTD.
- Hak-Kwan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SUPERCAPACITOR ELECTRODE USING ION-EXCHANGER
- Publication number 20100220430
- Publication date Sep 2, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jun-Hee BAE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HYBRID SUPERCAPACITOR USING SURFACE-OXIDIZED TRANSITION METAL NITRI...
- Publication number 20100195269
- Publication date Aug 5, 2010
- Samsung Electro-Mechanics CO., LTD.
- Hak-Kwan KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flame retardant resin composition for printed circuit board and pri...
- Publication number 20080090084
- Publication date Apr 17, 2008
- Samsung Electro-Mechanics CO., LTD.
- Jae-Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for imprinting stamper
- Publication number 20080086877
- Publication date Apr 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Bok Kwak
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing a stamper
- Publication number 20080054518
- Publication date Mar 6, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun RA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing a broad stamper
- Publication number 20080057444
- Publication date Mar 6, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun Ra
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20080034581
- Publication date Feb 14, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Hyun Ra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board for fine circuit form...
- Publication number 20070264755
- Publication date Nov 15, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Choon Keun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board using imprinting process
- Publication number 20070020397
- Publication date Jan 25, 2007
- Samsung Electro-Mechanics CO., LTD.
- Jae Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board using imprinting process
- Publication number 20060240360
- Publication date Oct 26, 2006
- Samsung Electro-mechanics Co., Ltd.
- Jae Choon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Seung Hyun Ra

Person

Patents Grantslast 30 patents

Laminated electronic component and circuit board for mounting the same

Electronic component and circuit board having the same

Multilayer electronic component and board having the same

Method for manufacturing metal electrode having transition metallic...

Carbon-fiber web structure type field emitter electrode and fabrica...

Method of manufacturing printed circuit board using imprinting process

Manufacturing method for imprinting stamper

Method of manufacturing printed circuit board for fine circuit form...

Fabrication method of carbon-fiber web structure type field emitter...

Method for manufacturing multilayer ceramic capacitor

Method of manufacturing multilayered ceramic capacitor by spin coat...

Triplexer and multilayered structure thereof

Patents Applicationslast 30 patents

LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME

ELECTRONIC COMPONENT AND CIRCUIT BOARD HAVING THE SAME

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

LAMINATED ELECTRONIC COMPONENT AND CIRCUIT BOARD FOR MOUNTING THE SAME

TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME

TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME

TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME

TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME

TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING TOUCH PANEL

METHOD OF MANUFACTURING TOUCH PANEL

LED PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PAPER DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING METAL ELECTRODE HAVING TRANSITION METALLIC...

Supercapacitor module

APPARATUS FOR EQUALIZING VOLTAGE USING TIME SWITCH

Chip-type electric double layer capacitor and package structure the...

Chip-type electric double layer capacitor and method for manufactur...

CARBON-FIBER WEB STRUCTURE TYPE FIELD EMITTER ELECTRODE AND FABRICA...

METHOD FOR MANUFACTURING METAL ELECTRODE HAVING TRANSITION METALLIC...

SUPERCAPACITOR ELECTRODE USING ION-EXCHANGER

HYBRID SUPERCAPACITOR USING SURFACE-OXIDIZED TRANSITION METAL NITRI...

Flame retardant resin composition for printed circuit board and pri...

Manufacturing method for imprinting stamper

Method of manufacturing a stamper

Method of manufacturing a broad stamper

Method for manufacturing printed circuit board

Method of manufacturing printed circuit board for fine circuit form...

Method of fabricating printed circuit board using imprinting process

Method of manufacturing printed circuit board using imprinting process