Seung Hyun Sohn

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for controlling adaptive reclosing based on tr...
- Patent number 9,673,610
- Issue date Jun 6, 2017
- Research & Business Foundation Sungkyunkwan University
- Chul Hwan Kim
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Piezoelectric device with piezoelectric polymer material
- Patent number 9,105,844
- Issue date Aug 11, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thin film capacitor-embedded printed circuit board and method of ma...
- Patent number 7,886,436
- Issue date Feb 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with film capacitor embedded therein and meth...
- Patent number 7,737,529
- Issue date Jun 15, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film-capacitor-embedded printed circuit board and method of ma...
- Patent number 7,675,756
- Issue date Mar 9, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board having embedded multi-l...
- Patent number 7,293,356
- Issue date Nov 13, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING ADAPTIVE RECLOSING BASED ON TR...
- Publication number 20150263506
- Publication date Sep 17, 2015
- Research & Business Foundation SUNGKYUNKWAN UNIVERISTY
- Chul Hwan KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PIEZOELECTRIC DEVICE OF POLYMER
- Publication number 20130127299
- Publication date May 23, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun KIM
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONDUCTIVE SUBTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130098668
- Publication date Apr 25, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Woon Chun Kim
- B82 - NANO-TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING ME...
- Publication number 20120291274
- Publication date Nov 22, 2012
- Jin-Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing PCB having electronic components embedded t...
- Publication number 20120017435
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING MET...
- Publication number 20110216515
- Publication date Sep 8, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jin-Won LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METH...
- Publication number 20110214913
- Publication date Sep 8, 2011
- Samsung Electro-Machanics Co., Ltd.
- Jin-Won Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20110141711
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics CO., LTD.
- Seung-Hyun SOHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING ME...
- Publication number 20110116246
- Publication date May 19, 2011
- Samsung Electro-Mechanics CO., LTD.
- Jin-Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITA...
- Publication number 20110034606
- Publication date Feb 10, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Eun Tae PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...
- Publication number 20090314419
- Publication date Dec 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun SOHN
- B32 - LAYERED PRODUCTS
Information Patent Application
PCB having electronic components embedded therein and method of man...
- Publication number 20090277673
- Publication date Nov 12, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MA...
- Publication number 20090152121
- Publication date Jun 18, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seok MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor memory package
- Publication number 20090057860
- Publication date Mar 5, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Seok Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor and multi-layer board embedding the capacitor
- Publication number 20080158777
- Publication date Jul 3, 2008
- Samsung Electro-Mechanics CO., LTD.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitor embedded printed circuit board and manufacturing method t...
- Publication number 20080100986
- Publication date May 1, 2008
- Samsung Electro-Mechanics CO., LTD.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...
- Publication number 20070148421
- Publication date Jun 28, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun SOHN
- B32 - LAYERED PRODUCTS
Information Patent Application
Thin film capacitor-embedded printed circuit board and method of ma...
- Publication number 20070102741
- Publication date May 10, 2007
- Samsung Electro-Mechanics CO., LTD.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing a printed circuit board with a film capaci...
- Publication number 20070094871
- Publication date May 3, 2007
- Samsung Electro-Mechanics CO., LTD.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with film capacitor embedded therein and meth...
- Publication number 20070085166
- Publication date Apr 19, 2007
- Samsung Electro-Mechanics CO., LTD.
- Jin Seok Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite dielectric composition having small variation of capacita...
- Publication number 20070087929
- Publication date Apr 19, 2007
- Samsung Electro-Mechanics CO., LTD.
- Eun Tae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board having embedded multi-l...
- Publication number 20060203456
- Publication date Sep 14, 2006
- Samsung Electro-mechanics Co., Ltd.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition for embedded capacitors having excellent adhesive...
- Publication number 20060183872
- Publication date Aug 17, 2006
- Samsung Electro-Mechanics CO., LTD.
- Seung Eun Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Printed circuit board material for embedded passive devices
- Publication number 20060062976
- Publication date Mar 23, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- B32 - LAYERED PRODUCTS

Seung Hyun Sohn

Person

Patents Grantslast 30 patents

Apparatus and method for controlling adaptive reclosing based on tr...

Piezoelectric device with piezoelectric polymer material

Thin film capacitor-embedded printed circuit board and method of ma...

Printed circuit board with film capacitor embedded therein and meth...

Thin film-capacitor-embedded printed circuit board and method of ma...

Method of fabricating printed circuit board having embedded multi-l...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR CONTROLLING ADAPTIVE RECLOSING BASED ON TR...

PIEZOELECTRIC DEVICE OF POLYMER

CONDUCTIVE SUBTRATE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING ME...

Method of manufacturing PCB having electronic components embedded t...

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING MET...

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METH...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING ME...

COMPOSITE DIELECTRIC COMPOSITION HAVING SMALL VARIATION OF CAPACITA...

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...

PCB having electronic components embedded therein and method of man...

THIN FILM CAPACITOR-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MA...

Semiconductor memory package

Capacitor and multi-layer board embedding the capacitor

Capacitor embedded printed circuit board and manufacturing method t...

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PRE...

Thin film capacitor-embedded printed circuit board and method of ma...

Method for manufacturing a printed circuit board with a film capaci...

Printed circuit board with film capacitor embedded therein and meth...

Composite dielectric composition having small variation of capacita...

Method of fabricating printed circuit board having embedded multi-l...

Resin composition for embedded capacitors having excellent adhesive...

Printed circuit board material for embedded passive devices