Seung K. Mok

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 11,626,373
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking semiconductor chips in a semiconductor package
- Patent number 10,483,150
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 9,793,309
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Byoung-rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 9,190,401
- Issue date Nov 17, 2015
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,803,301
- Issue date Aug 12, 2014
- Samsung Electronics Co., Ltd.
- Kyong-soon Cho
- G02 - OPTICS
Information Patent Grant
Stacked semiconductor packages
- Patent number 8,759,959
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board including solder ball land having hole and semiconduc...
- Patent number 7,952,199
- Issue date May 31, 2011
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including solder ball land having hole and semiconduc...
- Patent number 7,667,325
- Issue date Feb 23, 2010
- Samsung Electronics Co., Ltd.
- Sang-Gui Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid-state imaging apparatus, wiring substrate and methods of manu...
- Patent number 7,579,583
- Issue date Aug 25, 2009
- Samsung Electronics Co., Ltd.
- Seung-Kon Mok
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ball grid array attaching means having improved reliability and met...
- Patent number 6,963,033
- Issue date Nov 8, 2005
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hollow solder structure having improved reliability and method of m...
- Patent number 6,638,638
- Issue date Oct 28, 2003
- Samsung Electronics Co., Ltd.
- Sang-Young Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of a semiconductor package including chips bonded to die...
- Patent number 5,965,947
- Issue date Oct 12, 1999
- Samsung Electronics Co., Ltd.
- Shi-baek Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multi-package stack
- Patent number 5,677,569
- Issue date Oct 14, 1997
- Samsung Electronics Co., Ltd.
- Ki Won Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having support film formed on inner leads
- Patent number 5,621,242
- Issue date Apr 15, 1997
- Samsung Electronics Co., Ltd.
- Seung-Kon Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module
- Patent number 5,504,373
- Issue date Apr 2, 1996
- Samsung Electronics Co., Ltd.
- Sang E. Oh
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN
- Publication number 20230215824
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Se Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN
- Publication number 20210398924
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Se Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE
- Publication number 20170236798
- Publication date Aug 17, 2017
- Samsung Electronics Co., Ltd.
- GUN-AH LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20150340397
- Publication date Nov 26, 2015
- FUREX CO., LTD.
- Byoung-rim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES
- Publication number 20140256089
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Choong-Bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND IMAGE SENSOR PACKAGE USING THE SAME
- Publication number 20130193545
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Young-Gyu Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20120274868
- Publication date Nov 1, 2012
- Kyong-soon Cho
- G02 - OPTICS
Information Patent Application
Stacked Semiconductor Packages
- Publication number 20110215451
- Publication date Sep 8, 2011
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD INCLUDING SOLDER ABLL LAND HAVING HOLE AND SEMICONDUC...
- Publication number 20100116539
- Publication date May 13, 2010
- Sang-Gui Jo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solid-state imaging apparatus and method for manufacturing the same
- Publication number 20090315130
- Publication date Dec 24, 2009
- Young-Hoon Ro
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD
- Publication number 20090108447
- Publication date Apr 30, 2009
- Samsung Electronics Co., Ltd.
- Sang-Gui JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE...
- Publication number 20090057845
- Publication date Mar 5, 2009
- Samsung Electronics Co., Ltd.
- Ji-Sun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING...
- Publication number 20080108169
- Publication date May 8, 2008
- Samsung Electronics Co., Ltd.
- Kwon-Young Roh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT BOARD INCLUDING SOLDER BALL LAND HAVING HOLE AND SEMICONDUC...
- Publication number 20080036085
- Publication date Feb 14, 2008
- Samsung Electronics Co., Ltd.
- Sang-Gui JO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER
- Publication number 20070190688
- Publication date Aug 16, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Han-Shin YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin module for semiconductor device and method of fabricating...
- Publication number 20060006511
- Publication date Jan 12, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Kwon-Young Roh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Solid-state imaging apparatus, wiring substrate and methods of manu...
- Publication number 20050116142
- Publication date Jun 2, 2005
- Seung-Kon Mok
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Solid-state imaging apparatus and method for making the same
- Publication number 20040263667
- Publication date Dec 30, 2004
- Kwan-Jai Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Ball grid array attaching means having improved reliability and met...
- Publication number 20030051909
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...
- Publication number 20030052156
- Publication date Mar 20, 2003
- Sang-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Seung K. Mok

Person

Patents Grantslast 30 patents

Semiconductor packages including antenna pattern

Semiconductor packages including antenna pattern

Apparatus for stacking semiconductor chips in a semiconductor package

Image sensor package

Stacked semiconductor packages

Semiconductor package

Stacked semiconductor packages

Circuit board including solder ball land having hole and semiconduc...

Circuit board including solder ball land having hole and semiconduc...

Solid-state imaging apparatus, wiring substrate and methods of manu...

Ball grid array attaching means having improved reliability and met...

Hollow solder structure having improved reliability and method of m...

Structure of a semiconductor package including chips bonded to die...

Semiconductor multi-package stack

Semiconductor package having support film formed on inner leads

Semiconductor memory module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN

SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE

STACKED SEMICONDUCTOR PACKAGES

SEMICONDUCTOR APPARATUS AND IMAGE SENSOR PACKAGE USING THE SAME

Semiconductor Package

Stacked Semiconductor Packages

CIRCUIT BOARD INCLUDING SOLDER ABLL LAND HAVING HOLE AND SEMICONDUC...

Solid-state imaging apparatus and method for manufacturing the same

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE...

ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING...

CIRCUIT BOARD INCLUDING SOLDER BALL LAND HAVING HOLE AND SEMICONDUC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Ultrathin module for semiconductor device and method of fabricating...

Solid-state imaging apparatus, wiring substrate and methods of manu...

Solid-state imaging apparatus and method for making the same

Ball grid array attaching means having improved reliability and met...

HOLLOW SOLDER STRUCTURE HAVING IMPROVED RELIABILITY AND METHOD OF M...