Seungbae Park

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer scale thin film package
- Patent number 7,348,261
- Issue date Mar 25, 2008
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale thin film package
- Patent number 6,627,998
- Issue date Sep 30, 2003
- International Business Machines Corporation
- David Vincent Caletka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect techniques
- Patent number 6,347,901
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal deformation management for chip carriers
- Patent number 6,291,776
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage compensating heat spreader
- Patent number 6,288,900
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Eric A. Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER SCALE THIN FILM PACKAGE
- Publication number 20080119029
- Publication date May 22, 2008
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder Interconnect Joints For A Semiconductor Package
- Publication number 20080029888
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Seungbae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer scale thin film package
- Publication number 20030199121
- Publication date Oct 23, 2003
- David Vincent Caletka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...