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5426072 | Finnila | Jun 1995 | A |
5447264 | Koopman et al. | Sep 1995 | A |
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5821624 | Pasch | Oct 1998 | A |
5866949 | Schueller | Feb 1999 | A |
5915169 | Heo | Jun 1999 | A |
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6242815 | Hsu et al. | Jun 2001 | B1 |
Number | Date | Country |
---|---|---|
918354 | May 1999 | EP |
10065300 | Mar 1998 | JP |
Entry |
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IBM Technical Disclosure Bulletin, R.L. Imken, et al., entitled “Interposer for Direct Chip Attach or Surface Mount Array Devices” vol. 36, No. 7, Jul. 1993, pp. 137-138. |
Research Disclosure, Nov. 1998/1491, entitled “Die Attach Method for Semiconductor Chip Package”. |
TechSearch International, Inc., 50 Electronic Packaging & Production, entitled “BGAs will be Used Increasingly by Those Looking for Smaller Packages”. |