Shane B. Leiphart

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Light sensor having undulating features for CMOS imager
- Patent number 7,456,452
- Issue date Nov 25, 2008
- Micron Technology, Inc.
- David Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced barrier liner formation for vias
- Patent number 7,163,893
- Issue date Jan 16, 2007
- Micron Technology, Inc.
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced barrier liner formation for via
- Patent number 6,833,623
- Issue date Dec 21, 2004
- Micron Technology, Inc.
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced barrier liner formation for vias
- Patent number 6,828,233
- Issue date Dec 7, 2004
- Micron Technology, Inc.
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resputtering to achieve better step coverage
- Patent number 6,800,180
- Issue date Oct 5, 2004
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures
- Patent number 6,690,094
- Issue date Feb 10, 2004
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a non-volatile resistance variable device and met...
- Patent number 6,660,136
- Issue date Dec 9, 2003
- Micron Technology, Inc.
- Jiutao Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures
- Patent number 6,495,921
- Issue date Dec 17, 2002
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of in-situ cleaning and deposition of device structures in a...
- Patent number 6,346,177
- Issue date Feb 12, 2002
- Micron Technology, Inc.
- Shane P. Leiphart
- B08 - CLEANING
Information Patent Grant
Resputtering to achieve better step coverage
- Patent number 6,323,124
- Issue date Nov 27, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a sputtering apparatus
- Patent number 6,267,852
- Issue date Jul 31, 2001
- Micron Technology, Inc.
- John H. Givens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing surface charge on semiconductor wafers to preve...
- Patent number 6,258,718
- Issue date Jul 10, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming an aluminum comprising line having a titanium nit...
- Patent number 6,224,942
- Issue date May 1, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of in-situ cleaning and deposition of device structures in a...
- Patent number 6,187,151
- Issue date Feb 13, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- B08 - CLEANING
Information Patent Grant
Resputtering to achieve better step coverage
- Patent number 6,171,459
- Issue date Jan 9, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High aspect ratio metallization structures and processes for fabric...
- Patent number 6,121,134
- Issue date Sep 19, 2000
- Micron Technology, Inc.
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for detecting reflected neutrals in a sputter...
- Patent number 6,090,246
- Issue date Jul 18, 2000
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing surface charge on semiconducter wafers to preve...
- Patent number 6,057,235
- Issue date May 2, 2000
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition chamber with a biased substrate configuration
- Patent number 6,051,121
- Issue date Apr 18, 2000
- Micron Technology Inc.
- John H. Givens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Insitu faceting during deposition
- Patent number 5,997,699
- Issue date Dec 7, 1999
- Micron Technology Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Kit for electrically isolating collimator of PVD chamber, chamber s...
- Patent number 5,985,102
- Issue date Nov 16, 1999
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of sputter depositing of metals onto substrates, and method...
- Patent number 5,928,480
- Issue date Jul 27, 1999
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resputtering to achieve better step coverage
- Patent number 5,882,488
- Issue date Mar 16, 1999
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In situ preclean in a PVD chamber with a biased substrate configura...
- Patent number 5,807,467
- Issue date Sep 15, 1998
- Micron Technology, Inc.
- John H. Givens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resputtering to achieve better step coverage of contact holes
- Patent number 5,783,282
- Issue date Jul 21, 1998
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrically isolated collimator and method
- Patent number 5,705,042
- Issue date Jan 6, 1998
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of sputter deposition
- Patent number 5,667,645
- Issue date Sep 16, 1997
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Light sensor having undulating features for CMOS imager
- Publication number 20070138590
- Publication date Jun 21, 2007
- Micron Technology, Inc.
- David Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced barrier liner formation for vias
- Publication number 20060205209
- Publication date Sep 14, 2006
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced barrier linear formation for vias
- Publication number 20050090083
- Publication date Apr 28, 2005
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A NON-VOLATILE RESISTANCE VARIABLE DEVICE AND MET...
- Publication number 20030183507
- Publication date Oct 2, 2003
- Micron Technology, Inc.
- Jiutao Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High aspect ratio metallization structures
- Publication number 20030075809
- Publication date Apr 24, 2003
- Randle D. Burton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED BARRIER LINER FORMATION FOR VIAS
- Publication number 20020109235
- Publication date Aug 15, 2002
- Micron Technology, Inc.
- Shane P. Leiphart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an aluminum comprising line having a titanium nit...
- Publication number 20020025372
- Publication date Feb 28, 2002
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED BARRIER LINER FORMATION FOR VIA
- Publication number 20020008322
- Publication date Jan 24, 2002
- SHANE P. LEIPHART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of in-situ cleaning and deposition of device structures in a...
- Publication number 20010001190
- Publication date May 17, 2001
- Micron Technology, Inc.
- Shane P. Leiphart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Shane B. Leiphart

Person

Patents Grantslast 30 patents

Light sensor having undulating features for CMOS imager

Advanced barrier liner formation for vias

Enhanced barrier liner formation for via

Enhanced barrier liner formation for vias

Resputtering to achieve better step coverage

High aspect ratio metallization structures

Method of forming a non-volatile resistance variable device and met...

High aspect ratio metallization structures

Method of in-situ cleaning and deposition of device structures in a...

Resputtering to achieve better step coverage

Method of forming a sputtering apparatus

Method for reducing surface charge on semiconductor wafers to preve...

Method of forming an aluminum comprising line having a titanium nit...

Method of in-situ cleaning and deposition of device structures in a...

Resputtering to achieve better step coverage

High aspect ratio metallization structures and processes for fabric...

Methods and apparatus for detecting reflected neutrals in a sputter...

Method for reducing surface charge on semiconducter wafers to preve...

Deposition chamber with a biased substrate configuration

Insitu faceting during deposition

Kit for electrically isolating collimator of PVD chamber, chamber s...

Methods of sputter depositing of metals onto substrates, and method...

Resputtering to achieve better step coverage

In situ preclean in a PVD chamber with a biased substrate configura...

Resputtering to achieve better step coverage of contact holes

Electrically isolated collimator and method

Method of sputter deposition

Patents Applicationslast 30 patents

Light sensor having undulating features for CMOS imager

Enhanced barrier liner formation for vias

Advanced barrier linear formation for vias

METHOD OF FORMING A NON-VOLATILE RESISTANCE VARIABLE DEVICE AND MET...

High aspect ratio metallization structures

ENHANCED BARRIER LINER FORMATION FOR VIAS

Method of forming an aluminum comprising line having a titanium nit...

ENHANCED BARRIER LINER FORMATION FOR VIA

Method of in-situ cleaning and deposition of device structures in a...