Shang-Ting Tsai

Person

Sanchong City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vacuum wafer chuck for manufacturing semiconductor devices
- Patent number 12,191,185
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,993,510
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire-bond damper for shock absorption
- Patent number 11,987,494
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Board, circuit board, and fixture
- Patent number 11,956,887
- Issue date Apr 9, 2024
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 11,923,331
- Issue date Mar 5, 2024
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocouple device
- Patent number 11,765,975
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Tsai
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,713,242
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-bump connection to interconnect structure and manufacturing m...
- Patent number 11,705,420
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for downlink transmission in a cloud radio acc...
- Patent number 11,646,768
- Issue date May 9, 2023
- HON LIN TECHNOLOGY CO., LTD.
- Tzu-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MIMO signal symbol detection and search method, decoding circuit an...
- Patent number 11,569,873
- Issue date Jan 31, 2023
- Industrial Technology Research Institute
- Kai-Jiun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for downlink pre-coding in cloud radio access net...
- Patent number 11,533,090
- Issue date Dec 20, 2022
- HON LIN TECHNOLOGY CO., LTD.
- Yu-Heng You
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,530,130
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for processing uplink signal in cloud radio acces...
- Patent number 11,522,585
- Issue date Dec 6, 2022
- HON LIN TECHNOLOGY CO., LTD.
- Xiang-Quan Ser
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vacuum wafer chuck for manufacturing semiconductor devices
- Patent number 11,508,608
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,485,631
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite spring structure to reinforce mechanical robustness of a...
- Patent number 11,420,866
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for downlink transmission in a cloud radio acc...
- Patent number 11,329,700
- Issue date May 10, 2022
- HON LIN TECHNOLOGY CO., LTD.
- Tzu-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Beamforming transmission device and method
- Patent number 11,309,952
- Issue date Apr 19, 2022
- Industrial Technology Research Institute
- Shang-Ho Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method to produce chemical pattern in micro-fluidic structure
- Patent number 11,298,697
- Issue date Apr 12, 2022
- Illumina, Inc.
- Shang-Ying Tsai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermocouple device
- Patent number 11,251,354
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,196,015
- Issue date Dec 7, 2021
- Au Optronics Corporation
- Shang-Ta Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,174,158
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices with an element having varying widths
- Patent number 11,130,670
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Ying Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices including MEMS dies and connectors thereto
- Patent number 11,117,796
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of fabrication thereof
- Patent number 11,104,129
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Huei Peng
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid deposition apparatus and method
- Patent number 11,027,310
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Beamforming transmission device and method
- Patent number 10,879,982
- Issue date Dec 29, 2020
- Industrial Technology Research Institute
- Shang-Ho Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250112081
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid organic and non-organic interposer with embedded component a...
- Publication number 20240379516
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20240375939
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MANUFACTURING THE...
- Publication number 20240313085
- Publication date Sep 19, 2024
- Infinity Communication Tech. Inc.
- Shang-Hua TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-PRESSURE SOUNDBOX
- Publication number 20240314491
- Publication date Sep 19, 2024
- Compal Electronics, Inc.
- Chao-Kuei Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20240270565
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240162183
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS MODEM AND OPERATION METHOD THEREOF
- Publication number 20240064673
- Publication date Feb 22, 2024
- MEDIATEK INC.
- Nien-En WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021485
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20240021567
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...
- Publication number 20230402438
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS
- Publication number 20230395481
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BOND DAMPER FOR SHOCK ABSORPTION
- Publication number 20230382720
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOTOR
- Publication number 20230327517
- Publication date Oct 12, 2023
- Delta Electronics, Inc.
- Cheng-Hsun Tsai
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multi-Bump Connection to Interconnect Structure and Manufacturing M...
- Publication number 20230317661
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STOPPER BUMP STRUCTURES FOR MEMS DEVICE
- Publication number 20230257256
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230154892
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT I...
- Publication number 20230137691
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Ying LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20230068211
- Publication date Mar 2, 2023
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT A...
- Publication number 20230063304
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...
- Publication number 20220415813
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20220415699
- Publication date Dec 29, 2022
- TAIWAN SEMICONDUTOR MANUFACTURING CO., LTD.
- Chien-Fa LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER VIA INTERCONNECT SHAPES WITH IMPROVED PERFORMANCE CHARAC...
- Publication number 20220406723
- Publication date Dec 22, 2022
- Shang-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD, CIRCUIT BOARD, AND FIXTURE
- Publication number 20220377876
- Publication date Nov 24, 2022
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD AND CIRCUIT BOARD
- Publication number 20220322519
- Publication date Oct 6, 2022
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- F21 - LIGHTING
Information Patent Application
COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...
- Publication number 20220306454
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS
- Publication number 20220270999
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DOWNLINK TRANSMISSION IN A CLOUD RADIO ACC...
- Publication number 20220224378
- Publication date Jul 14, 2022
- HON LIN TECHNOLOGY CO., LTD.
- TZU-YU LIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NOVEL THERMOCOUPLE DEVICE
- Publication number 20220209093
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Hsien TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Shang-Ting Tsai

Person

Patents Grantslast 30 patents

Vacuum wafer chuck for manufacturing semiconductor devices

Composite spring structure to reinforce mechanical robustness of a...

Wire-bond damper for shock absorption

Board, circuit board, and fixture

Die attached leveling control by metal stopper bumps

Thermocouple device

MEMS device with dummy-area utilization for pressure enhancement

Multi-bump connection to interconnect structure and manufacturing m...

Semiconductor structure and manufacturing method thereof

Method and apparatus for downlink transmission in a cloud radio acc...

Semiconductive structure and manufacturing method thereof

MIMO signal symbol detection and search method, decoding circuit an...

MEMS apparatus with anti-stiction layer

Method and system for downlink pre-coding in cloud radio access net...

Method of making ohmic contact on low doped bulk silicon for optica...

Method and system for processing uplink signal in cloud radio acces...

Vacuum wafer chuck for manufacturing semiconductor devices

Method of making ohmic contact on low doped bulk silicon for optica...

Composite spring structure to reinforce mechanical robustness of a...

Method and apparatus for downlink transmission in a cloud radio acc...

Beamforming transmission device and method

Method to produce chemical pattern in micro-fluidic structure

Thermocouple device

Display apparatus and manufacturing method thereof

MEMS device with dummy-area utilization for pressure enhancement

MEMS devices with an element having varying widths

MEMS devices including MEMS dies and connectors thereto

MEMS devices and methods of fabrication thereof

Fluid deposition apparatus and method

Beamforming transmission device and method

Patents Applicationslast 30 patents

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

Hybrid organic and non-organic interposer with embedded component a...

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR MANUFACTURING THE...

AIR-PRESSURE SOUNDBOX

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

WIRELESS MODEM AND OPERATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...

REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS

WIRE-BOND DAMPER FOR SHOCK ABSORPTION

MOTOR

Multi-Bump Connection to Interconnect Structure and Manufacturing M...

STOPPER BUMP STRUCTURES FOR MEMS DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT I...

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT A...

INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...

VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

INTERPOSER VIA INTERCONNECT SHAPES WITH IMPROVED PERFORMANCE CHARAC...

BOARD, CIRCUIT BOARD, AND FIXTURE

BOARD AND CIRCUIT BOARD

COMPOSITE SPRING STRUCTURE TO REINFORCE MECHANICAL ROBUSTNESS OF A...

DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS

METHOD AND APPARATUS FOR DOWNLINK TRANSMISSION IN A CLOUD RADIO ACC...

NOVEL THERMOCOUPLE DEVICE