Shankar Devasenathipathy

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,057,369
- Issue date Aug 6, 2024
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 11,854,935
- Issue date Dec 26, 2023
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
STIM/liquid metal filled laser drill trench to improve cooling of s...
- Patent number 11,854,931
- Issue date Dec 26, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal thermal interface material application
- Patent number 11,679,407
- Issue date Jun 20, 2023
- Intel Corporation
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Socket loading mechanism for passive or active socket and package c...
- Patent number 11,646,244
- Issue date May 9, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package socket housing to enhance package cooling
- Patent number 11,581,671
- Issue date Feb 14, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual strip backside metallization for improved alt-FLI plating, KOZ...
- Patent number 11,502,008
- Issue date Nov 15, 2022
- Intel Corporation
- Nicholas S. Haehn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal assemblies for multi-chip packages
- Patent number 11,456,232
- Issue date Sep 27, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with multiple channels for multichip packages
- Patent number 11,444,003
- Issue date Sep 13, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die back side structures for warpage control
- Patent number 11,322,456
- Issue date May 3, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for inspection of a package assembly with a thermal solution
- Patent number 10,600,699
- Issue date Mar 24, 2020
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING
Information Patent Grant
Torque controlled driver apparatus and method
- Patent number 10,576,590
- Issue date Mar 3, 2020
- Intel Corporation
- Batsegaw K. Gebrehiwot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,434,029
- Issue date Sep 6, 2016
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20240282667
- Publication date Aug 22, 2024
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
- Publication number 20230290706
- Publication date Sep 14, 2023
- Intel Corporation
- Gaurav Patankar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20230128903
- Publication date Apr 27, 2023
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20210375719
- Publication date Dec 2, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS
- Publication number 20210257277
- Publication date Aug 19, 2021
- Intel Corporation
- Weston BERTRAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME
- Publication number 20210242105
- Publication date Aug 5, 2021
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIM/LIQUID METAL FILLED LASER DRILL TRENCH TO IMPROVE COOLING OF S...
- Publication number 20210193548
- Publication date Jun 24, 2021
- Intel Corporation
- Zhimin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED LIQUID METAL THERMAL INTERFACE MATERIALS
- Publication number 20210125896
- Publication date Apr 29, 2021
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION
- Publication number 20210101175
- Publication date Apr 8, 2021
- Kyle Jordan Arrington
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...
- Publication number 20200411410
- Publication date Dec 31, 2020
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING MICROCHANNELS WITH POROUS S...
- Publication number 20200409398
- Publication date Dec 31, 2020
- Intel Corporation
- Betsegaw Gebrehiwot
- G05 - CONTROLLING REGULATING
Information Patent Application
THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...
- Publication number 20200312741
- Publication date Oct 1, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING
- Publication number 20200303852
- Publication date Sep 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...
- Publication number 20200243418
- Publication date Jul 30, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL STRIP BACKSIDE METALLIZATION FOR IMPROVED ALT-FLI PLATING, KOZ...
- Publication number 20200203240
- Publication date Jun 25, 2020
- Intel Corporation
- Nicholas S. HAEHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...
- Publication number 20200176352
- Publication date Jun 4, 2020
- Intel Corporation
- Je-Young CHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
- Publication number 20200111720
- Publication date Apr 9, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES
- Publication number 20200105643
- Publication date Apr 2, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES
- Publication number 20200098666
- Publication date Mar 26, 2020
- Intel Corporation
- ZHIMIN WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL
- Publication number 20200066655
- Publication date Feb 27, 2020
- Intel Corporation
- Feras EID
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES
- Publication number 20200051894
- Publication date Feb 13, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT
- Publication number 20190214328
- Publication date Jul 11, 2019
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION
- Publication number 20190067135
- Publication date Feb 28, 2019
- Intel Corporation
- Aastha Uppal
- G01 - MEASURING TESTING
Information Patent Application
TORQUE CONTROLLED DRIVER APPARATUS AND METHOD
- Publication number 20180141173
- Publication date May 24, 2018
- Intel Corporation
- Betsegaw K. Gebrehiwot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20160211238
- Publication date Jul 21, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Shankar Devasenathipathy

Person

Patents Grantslast 30 patents

Enhanced base die heat path using through-silicon vias

Printed heat spreader structures and methods of providing same

Cooling solution including microchannel arrays and methods of formi...

Enhanced base die heat path using through-silicon vias

STIM/liquid metal filled laser drill trench to improve cooling of s...

Liquid metal thermal interface material application

Socket loading mechanism for passive or active socket and package c...

Integrated circuit package socket housing to enhance package cooling

Dual strip backside metallization for improved alt-FLI plating, KOZ...

Thermal assemblies for multi-chip packages

Integrated heat spreader with multiple channels for multichip packages

Sloped metal features for cooling hotspots in stacked-die packages

Die back side structures for warpage control

Apparatus for inspection of a package assembly with a thermal solution

Torque controlled driver apparatus and method

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

High performance transient uniform cooling solution for thermal com...

Thermal compression bonding process cooling manifold

Patents Applicationslast 30 patents

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

ENHANCED BASE DIE HEAT PATH USING THROUGH-SILICON VIAS

PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME

STIM/LIQUID METAL FILLED LASER DRILL TRENCH TO IMPROVE COOLING OF S...

FILLED LIQUID METAL THERMAL INTERFACE MATERIALS

LIQUID METAL THERMAL INTERFACE MATERIAL APPLICATION

SOCKET LOADING MECHANISM FOR PASSIVE OR ACTIVE SOCKET AND PACKAGE C...

DEVICE, SYSTEM AND METHOD FOR PROVIDING MICROCHANNELS WITH POROUS S...

THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORM...

INTEGRATED CIRCUIT PACKAGE SOCKET HOUSING TO ENHANCE PACKAGE COOLING

COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...

DUAL STRIP BACKSIDE METALLIZATION FOR IMPROVED ALT-FLI PLATING, KOZ...

DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...

DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION

INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES

SLOPED METAL FEATURES FOR COOLING HOTSPOTS IN STACKED-DIE PACKAGES

DIE BACK SIDE STRUCTURES FOR WARPAGE CONTROL

THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES

STACKED DIE ARCHITECTURES WITH IMPROVED THERMAL MANAGEMENT

APPARATUS FOR INSPECTION OF A PACKAGE ASSEMBLY WITH A THERMAL SOLUTION

TORQUE CONTROLLED DRIVER APPARATUS AND METHOD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...