Sheldon H. Butt

Person

Godfrey, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic packaging of components incorporating a ceramic-glass-me...
- Patent number 5,024,883
- Issue date Jun 18, 1991
- Olin Corporation
- Narendra N. SinghDeo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor package
- Patent number 5,014,159
- Issue date May 7, 1991
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clad metal lead frame substrates
- Patent number 5,001,546
- Issue date Mar 19, 1991
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic microminiature packages
- Patent number 4,967,260
- Issue date Oct 30, 1990
- International Electronic Research Corp.
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal packages having improved thermal dissipation
- Patent number 4,961,106
- Issue date Oct 2, 1990
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal electronic package
- Patent number 4,897,508
- Issue date Jan 30, 1990
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor casing
- Patent number 4,889,960
- Issue date Dec 26, 1989
- Olin Corporation
- Sheldon H. Butt
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor package
- Patent number 4,888,449
- Issue date Dec 19, 1989
- Olin Corporation
- Jacob Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Products formed of a ceramic-glass-metal composite
- Patent number 4,883,778
- Issue date Nov 28, 1989
- Olin Corporation
- Narendra N. SinghDeo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic packaging of components incorporating a ceramic-glass-me...
- Patent number 4,882,212
- Issue date Nov 21, 1989
- Olin Corporation
- Narendra N. SinghDeo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Rigid magnetic recording disks and method of producing same
- Patent number 4,882,236
- Issue date Nov 21, 1989
- Olin Corporation
- Charles W. Smith
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 4,866,571
- Issue date Sep 12, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 4,862,323
- Issue date Aug 29, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier
- Patent number 4,853,491
- Issue date Aug 1, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 4,851,615
- Issue date Jul 25, 1989
- Olin Corporation
- Sheldon H. Butt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating interconnect tape for use in tape automated bonding
- Patent number 4,849,857
- Issue date Jul 18, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging
- Patent number 4,839,716
- Issue date Jun 13, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thermal expansivity and high thermal conductivity substrate
- Patent number RE32942
- Issue date Jun 6, 1989
- Olin Corporation
- Sheldon H. Butt
- 075 - Specialized metallurgical processes, compositions for use therein, cons...
Information Patent Grant
Multi-layer circuitry
- Patent number 4,827,377
- Issue date May 2, 1989
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed semiconductor package
- Patent number 4,805,009
- Issue date Feb 14, 1989
- Olin Corporation
- Michael J. Pryor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor casing
- Patent number 4,796,083
- Issue date Jan 3, 1989
- Olin Corporation
- Satyam C. Cherukuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a hermetically sealed semiconductor casing
- Patent number 4,784,974
- Issue date Nov 15, 1988
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a hermetically sealed package for an electric...
- Patent number 4,769,345
- Issue date Sep 6, 1988
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Special surfaces for wire bonding
- Patent number 4,767,049
- Issue date Aug 30, 1988
- Olin Corporation
- Sheldon H. Butt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-glass-metal packaging for electronic components incorporati...
- Patent number 4,761,518
- Issue date Aug 2, 1988
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape bonding material and structure for electronic circuit fabrication
- Patent number 4,736,236
- Issue date Apr 5, 1988
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuitry
- Patent number 4,682,414
- Issue date Jul 28, 1987
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making low thermal expansivity and high thermal conductiv...
- Patent number 4,659,404
- Issue date Apr 21, 1987
- Olin Corporation
- Sheldon H. Butt
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hermetically sealed semiconductor casing
- Patent number 4,656,499
- Issue date Apr 7, 1987
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma deposition applications for communication cables
- Patent number 4,652,323
- Issue date Mar 24, 1987
- Olin Corporation
- Sheldon H. Butt
- G02 - OPTICS

Sheldon H. Butt

Person

Patents Grantslast 30 patents

Electronic packaging of components incorporating a ceramic-glass-me...

Semiconductor package

Clad metal lead frame substrates

Hermetic microminiature packages

Metal packages having improved thermal dissipation

Metal electronic package

Sealed semiconductor casing

Semiconductor package

Products formed of a ceramic-glass-metal composite

Electronic packaging of components incorporating a ceramic-glass-me...

Rigid magnetic recording disks and method of producing same

Semiconductor package

Chip carrier

Chip carrier

Printed circuit board

Heat dissipating interconnect tape for use in tape automated bonding

Semiconductor packaging

Low thermal expansivity and high thermal conductivity substrate

Multi-layer circuitry

Hermetically sealed semiconductor package

Semiconductor casing

Method of making a hermetically sealed semiconductor casing

Process for producing a hermetically sealed package for an electric...

Special surfaces for wire bonding

Ceramic-glass-metal packaging for electronic components incorporati...

Tape bonding material and structure for electronic circuit fabrication

Multi-layer circuitry

Method of making low thermal expansivity and high thermal conductiv...

Hermetically sealed semiconductor casing

Plasma deposition applications for communication cables