Number | Name | Date | Kind |
---|---|---|---|
3611061 | Segerson | Oct 1971 | |
3802069 | Thompson | Apr 1974 | |
3821847 | Melse | Jul 1974 | |
4209355 | Burns | Jun 1980 | |
4234666 | Gursky | Nov 1980 | |
4385202 | Spinelli et al. | May 1983 | |
4394530 | Kaufman | Jul 1983 | |
4410927 | Butt | Oct 1983 | |
4449165 | Kaufman | May 1984 | |
4472876 | Nelson | Sep 1984 | |
4474292 | Tehrani | Oct 1984 | |
4510017 | Barber | Apr 1985 | |
4514750 | Adams | Apr 1985 | |
4524238 | Butt | Jun 1985 | |
4607276 | Butt | Aug 1986 | |
4656499 | Butt | Apr 1987 | |
4684975 | Takiar et al. | Aug 1987 | |
4701363 | Barber | Oct 1987 | |
4704187 | Fujita | Nov 1987 | |
4721993 | Walter | Jan 1988 | |
4735678 | Mandigo et al. | Apr 1988 | |
4736236 | Butt | Apr 1988 | |
4736882 | Winter et al. | Apr 1988 | |
4742024 | Sugimoto et al. | May 1988 |
Entry |
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"TAB Technology Tackles High Density Interconnections" by Tom Dixon, Electronic Packaging & Production, Dec. 1984, pp. 34-39. |
"Future Packages' Heat Transfer Will Affect PCB Designs" by Ernel R. Winkler, Electronic Packaging & Production, Apr. 1985, pp. 104-109. |
"Advanced Packaging for VLSI" by Charles J. Bartlett, Solid State Technology, Jun. 1986, pp. 119-123. |
"Microelectronic Packaging" by Albert J. Blodgett, Jr., Scientific America, Jul. 1983, pp. 86-96. |