Shenghua Huang

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with unbalanced die stackup
- Patent number 12,027,497
- Issue date Jul 2, 2024
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bump with multi-PI opening
- Patent number 11,978,713
- Issue date May 7, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Bump With Multi-PI Opening
- Publication number 20230378112
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device With Unbalanced Die Stackup
- Publication number 20230246000
- Publication date Aug 3, 2023
- Western Digital Technologies, Inc.
- Haiyue Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...
- Publication number 20230170312
- Publication date Jun 1, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER
- Publication number 20200006212
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Rui Guo
- H01 - BASIC ELECTRIC ELEMENTS

Shenghua Huang

Person

Patents Grantslast 30 patents

Semiconductor device including a suspended reinforcing layer and me...

Semiconductor device with unbalanced die stackup

Flip chip bump with multi-PI opening

Semiconductor device package having multi-layer molding compound an...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

Flip Chip Bump With Multi-PI Opening

Semiconductor Device With Unbalanced Die Stackup

SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...

Semiconductor Device Package Having Multi-Layer Molding Compound an...

SEMICONDUCTOR PRODUCT SUBSTRATE INCLUDING STRESS RELIEF LAYER