Shi-baek Nam

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Incheon-city, KR

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Patents Grantslast 30 patents

Information Patent Grant
Molded leadless package having a partially exposed lead frame pad
- Patent number 7,315,077
- Issue date Jan 1, 2008
- Fairchild Korea Semiconductor, Ltd.
- Yoon-hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package suitable for high voltage applications
- Patent number 7,199,461
- Issue date Apr 3, 2007
- Fairchild Korea Semiconductor, Ltd.
- Joon-seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device having multi-chip package structure
- Patent number 6,756,689
- Issue date Jun 29, 2004
- Fairchild Korea Semiconductor, Ltd.
- Shi-baek Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for die bonding
- Patent number 6,742,561
- Issue date Jun 1, 2004
- Samsung Electronics Co., Ltd.
- Shi Baek Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin, small-sized power semiconductor package
- Patent number 6,621,152
- Issue date Sep 16, 2003
- Fairchild Korea Semiconductor Ltd.
- Yoon-hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe using chip pad as heat conducting path and semiconductor...
- Patent number 6,329,706
- Issue date Dec 11, 2001
- Fairchild Korea Semiconductor, Ltd.
- Shi-back Nam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS
- Publication number 20070181984
- Publication date Aug 9, 2007
- Fairchild Korea Semiconductor, Ltd.
- Joon-seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded leadless package having improved reliability and high therma...
- Publication number 20050104168
- Publication date May 19, 2005
- Yoon-hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package suitable for high voltage applications
- Publication number 20040232541
- Publication date Nov 25, 2004
- Joon-seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power device having multi-chip package structure
- Publication number 20030102489
- Publication date Jun 5, 2003
- Shi-baek Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for die bonding
- Publication number 20020109217
- Publication date Aug 15, 2002
- Shi Baek Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin, small-sized power semiconductor package
- Publication number 20020074634
- Publication date Jun 20, 2002
- Yoon-Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20010045634
- Publication date Nov 29, 2001
- Shi-Baek Nam
- H01 - BASIC ELECTRIC ELEMENTS